FR2185915B1 - - Google Patents

Info

Publication number
FR2185915B1
FR2185915B1 FR7218676A FR7218676A FR2185915B1 FR 2185915 B1 FR2185915 B1 FR 2185915B1 FR 7218676 A FR7218676 A FR 7218676A FR 7218676 A FR7218676 A FR 7218676A FR 2185915 B1 FR2185915 B1 FR 2185915B1
Authority
FR
France
Prior art keywords
studs
substrate
wire
component
thermo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7218676A
Other languages
English (en)
French (fr)
Other versions
FR2185915A1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR7218676A priority Critical patent/FR2185915B1/fr
Priority to GB2289373A priority patent/GB1427588A/en
Priority to IT68521/73A priority patent/IT986355B/it
Priority to DE2326861A priority patent/DE2326861A1/de
Publication of FR2185915A1 publication Critical patent/FR2185915A1/fr
Priority to BE150705A priority patent/BE822420A/xx
Application granted granted Critical
Publication of FR2185915B1 publication Critical patent/FR2185915B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10P72/0444—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H10W72/07141—
    • H10W72/07502—
    • H10W72/07533—
    • H10W72/522—
    • H10W72/5366—
    • H10W72/5445—
    • H10W72/581—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
FR7218676A 1972-05-25 1972-05-25 Expired FR2185915B1 (enExample)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR7218676A FR2185915B1 (enExample) 1972-05-25 1972-05-25
GB2289373A GB1427588A (en) 1972-05-25 1973-05-14 Method of connecting electronic micro-components
IT68521/73A IT986355B (it) 1972-05-25 1973-05-24 Procedimento per l interconnessio ne di microcomponenti elettronici
DE2326861A DE2326861A1 (de) 1972-05-25 1973-05-25 Verfahren zum gegenseitigen verbinden von elektronischen mikrobausteinen und nach einem solchen verfahren hergestellte verbindungssubstrate und hybridschaltungen
BE150705A BE822420A (fr) 1972-05-25 1974-11-20 Procede d'interconnexion de microcomposants electroniques et circuits de mise en oeuvre du dit procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7218676A FR2185915B1 (enExample) 1972-05-25 1972-05-25

Publications (2)

Publication Number Publication Date
FR2185915A1 FR2185915A1 (enExample) 1974-01-04
FR2185915B1 true FR2185915B1 (enExample) 1975-08-29

Family

ID=9099096

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7218676A Expired FR2185915B1 (enExample) 1972-05-25 1972-05-25

Country Status (5)

Country Link
BE (1) BE822420A (enExample)
DE (1) DE2326861A1 (enExample)
FR (1) FR2185915B1 (enExample)
GB (1) GB1427588A (enExample)
IT (1) IT986355B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3981076A (en) * 1974-11-27 1976-09-21 Commissariat A L'energie Atomique Method of connecting electronic microcomponents
DE3501710A1 (de) * 1985-01-19 1986-07-24 Allied Corp., Morristown, N.J. Leiterplatte mit integralen positioniermitteln
DE19618917C1 (de) * 1996-05-12 1997-10-02 Markus Woelfel Verfahren und Vorrichtung zur Herstellung von drahtgeschriebenen Leiterplatten
DE19705934C2 (de) * 1997-02-15 2001-05-17 Cubit Electronics Gmbh Verfahren und Vorrichtung zum Einbringen von drahtförmigen Leiterdrähten in ein Substrat
DE102006037093B3 (de) * 2006-08-07 2008-03-13 Reinhard Ulrich Fügeverfahren und Vorrichtung zum Verlegen von dünnem Draht
DE102007037165A1 (de) 2007-08-07 2009-02-12 Mühlbauer Ag Verfahren und Vorrichtung zum Verlegen von dünnem Draht

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1070248A (en) * 1966-01-31 1967-06-01 Standard Telephones Cables Ltd Electrical wiring assembly
JPS5550399B1 (enExample) * 1970-03-05 1980-12-17
US3710441A (en) * 1970-05-15 1973-01-16 Bunker Ramo Numerically controlled automatic wiring system
US3703033A (en) * 1970-06-22 1972-11-21 Bunker Ramo Combined component and interconnection module and method of making

Also Published As

Publication number Publication date
IT986355B (it) 1975-01-30
FR2185915A1 (enExample) 1974-01-04
GB1427588A (en) 1976-03-10
BE822420A (fr) 1975-03-14
DE2326861A1 (de) 1973-12-06
DE2326861C2 (enExample) 1987-08-27

Similar Documents

Publication Publication Date Title
US3981076A (en) Method of connecting electronic microcomponents
US3353263A (en) Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
US3613230A (en) Method of fabricating coaxial circuitry
DE3879021D1 (de) Elektrische sicherung und verfahren zu ihrer herstellung.
US5942046A (en) Solar module and process for manufacturing same
JPS5816552A (ja) 半導体素子用パッケ−ジ
CA1167976A (en) Circuit board having encapsulatd wiring on component side
GB1004459A (en) Electronic circuits
US3703603A (en) Rub-on sub-element for electronic circuit board
US4188714A (en) Rigid termination for flexible printed circuits
FR2185915B1 (enExample)
US4512854A (en) Method of electroplating printed circuits
GB1152809A (en) Electric Circuit Assembly
EP0015053A1 (en) A method of manufacturing a semi-conductor power device assembly and an assembly thereby produced
GB1445591A (en) Mounting integrated circuit elements
JPS6386322A (ja) 導電異方性接着剤シ−ト
GB1217148A (en) Improvements in or relating to substrates for microelectronic components
JPS575356A (en) Hybrid integrated circuit device
JPS61118977A (ja) 多電極コネクタ−構造
SU1133701A1 (ru) Монтажна плата
ES380076A1 (es) Metodo para unir una pluralidad de pilas de trabajo en zo- nas separadas sobre una o mas segundas piezas de trabajo.
JPH01194209A (ja) 熱接着性可撓性配線部材
JPH02222598A (ja) 半導体装置モジュール
JPS5552231A (en) Semiconductor attaching device
JPS5418672A (en) Bonding method for beam lead

Legal Events

Date Code Title Description
ST Notification of lapse