IT9022401A0 - Struttura di alloggiamento per dispositivi a semiconduttore - Google Patents

Struttura di alloggiamento per dispositivi a semiconduttore

Info

Publication number
IT9022401A0
IT9022401A0 IT22401A IT2240190A IT9022401A0 IT 9022401 A0 IT9022401 A0 IT 9022401A0 IT 22401 A IT22401 A IT 22401A IT 2240190 A IT2240190 A IT 2240190A IT 9022401 A0 IT9022401 A0 IT 9022401A0
Authority
IT
Italy
Prior art keywords
semiconductor devices
housing structure
housing
semiconductor
devices
Prior art date
Application number
IT22401A
Other languages
English (en)
Other versions
IT1244184B (it
IT9022401A1 (it
Inventor
Roger Filmore Bennett
David Charles Ham
Original Assignee
Westinghouse Brake & Signal
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake & Signal filed Critical Westinghouse Brake & Signal
Publication of IT9022401A0 publication Critical patent/IT9022401A0/it
Publication of IT9022401A1 publication Critical patent/IT9022401A1/it
Application granted granted Critical
Publication of IT1244184B publication Critical patent/IT1244184B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Bipolar Transistors (AREA)
IT02240190A 1989-12-18 1990-12-17 Struttura di alloggiamento per dispositivi a semiconduttore IT1244184B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898928492A GB8928492D0 (en) 1989-12-18 1989-12-18 Housings for semiconductor devices

Publications (3)

Publication Number Publication Date
IT9022401A0 true IT9022401A0 (it) 1990-12-17
IT9022401A1 IT9022401A1 (it) 1991-06-19
IT1244184B IT1244184B (it) 1994-07-08

Family

ID=10668090

Family Applications (1)

Application Number Title Priority Date Filing Date
IT02240190A IT1244184B (it) 1989-12-18 1990-12-17 Struttura di alloggiamento per dispositivi a semiconduttore

Country Status (4)

Country Link
JP (1) JPH0744050U (it)
DE (1) DE9016960U1 (it)
GB (2) GB8928492D0 (it)
IT (1) IT1244184B (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3469304B2 (ja) * 1994-04-12 2003-11-25 三菱電機株式会社 半導体装置
JP5709491B2 (ja) * 2010-11-30 2015-04-30 京セラクリスタルデバイス株式会社 電子デバイスの製造方法
US11380557B2 (en) * 2017-06-05 2022-07-05 Applied Materials, Inc. Apparatus and method for gas delivery in semiconductor process chambers

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2941688A (en) * 1957-12-31 1960-06-21 Tung Sol Electric Inc Encapsulation of electronic component and method of making the same
GB1038686A (en) * 1964-06-04 1966-08-10 Westinghouse Brake & Signal Improvements relating to the encapsulation of semi-conductor devices
GB1176519A (en) * 1967-11-28 1970-01-07 Westinghouse Brake & Signal Semiconductor Devices and the Manufacture Thereof
US3753054A (en) * 1970-01-02 1973-08-14 Texas Instruments Inc Hermetically sealed electronic package
US3751800A (en) * 1970-08-04 1973-08-14 Gen Motors Corp Method of fabricating a semiconductor enclosure
US3688163A (en) * 1970-08-04 1972-08-29 Gen Motors Corp Cold welded semiconductor package having integral cold welding oil
FR2182791B1 (it) * 1972-05-03 1977-12-30 Siemens Ag
JPH065686B2 (ja) * 1985-09-04 1994-01-19 株式会社日立製作所 圧接型半導体装置

Also Published As

Publication number Publication date
GB8928492D0 (en) 1990-02-21
DE9016960U1 (de) 1991-04-04
GB2239127B (en) 1993-07-07
GB9027122D0 (en) 1991-02-06
JPH0744050U (ja) 1995-10-24
IT1244184B (it) 1994-07-08
GB2239127A (en) 1991-06-19
IT9022401A1 (it) 1991-06-19

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19961223