IT1244184B - Struttura di alloggiamento per dispositivi a semiconduttore - Google Patents
Struttura di alloggiamento per dispositivi a semiconduttoreInfo
- Publication number
- IT1244184B IT1244184B IT02240190A IT2240190A IT1244184B IT 1244184 B IT1244184 B IT 1244184B IT 02240190 A IT02240190 A IT 02240190A IT 2240190 A IT2240190 A IT 2240190A IT 1244184 B IT1244184 B IT 1244184B
- Authority
- IT
- Italy
- Prior art keywords
- semiconductor devices
- housing structure
- housing
- semiconductor
- devices
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Casings For Electric Apparatus (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB898928492A GB8928492D0 (en) | 1989-12-18 | 1989-12-18 | Housings for semiconductor devices |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| IT9022401A0 IT9022401A0 (it) | 1990-12-17 |
| IT9022401A1 IT9022401A1 (it) | 1991-06-19 |
| IT1244184B true IT1244184B (it) | 1994-07-08 |
Family
ID=10668090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT02240190A IT1244184B (it) | 1989-12-18 | 1990-12-17 | Struttura di alloggiamento per dispositivi a semiconduttore |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH0744050U (it) |
| DE (1) | DE9016960U1 (it) |
| GB (2) | GB8928492D0 (it) |
| IT (1) | IT1244184B (it) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3469304B2 (ja) * | 1994-04-12 | 2003-11-25 | 三菱電機株式会社 | 半導体装置 |
| JP5709491B2 (ja) * | 2010-11-30 | 2015-04-30 | 京セラクリスタルデバイス株式会社 | 電子デバイスの製造方法 |
| US11380557B2 (en) * | 2017-06-05 | 2022-07-05 | Applied Materials, Inc. | Apparatus and method for gas delivery in semiconductor process chambers |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2941688A (en) * | 1957-12-31 | 1960-06-21 | Tung Sol Electric Inc | Encapsulation of electronic component and method of making the same |
| GB1038686A (en) * | 1964-06-04 | 1966-08-10 | Westinghouse Brake & Signal | Improvements relating to the encapsulation of semi-conductor devices |
| GB1176519A (en) * | 1967-11-28 | 1970-01-07 | Westinghouse Brake & Signal | Semiconductor Devices and the Manufacture Thereof |
| US3753054A (en) * | 1970-01-02 | 1973-08-14 | Texas Instruments Inc | Hermetically sealed electronic package |
| US3688163A (en) * | 1970-08-04 | 1972-08-29 | Gen Motors Corp | Cold welded semiconductor package having integral cold welding oil |
| US3751800A (en) * | 1970-08-04 | 1973-08-14 | Gen Motors Corp | Method of fabricating a semiconductor enclosure |
| FR2182791B1 (it) * | 1972-05-03 | 1977-12-30 | Siemens Ag | |
| JPH065686B2 (ja) * | 1985-09-04 | 1994-01-19 | 株式会社日立製作所 | 圧接型半導体装置 |
-
1989
- 1989-12-18 GB GB898928492A patent/GB8928492D0/en active Pending
-
1990
- 1990-12-14 GB GB9027122A patent/GB2239127B/en not_active Expired - Fee Related
- 1990-12-15 DE DE9016960U patent/DE9016960U1/de not_active Expired - Lifetime
- 1990-12-17 IT IT02240190A patent/IT1244184B/it active IP Right Grant
- 1990-12-17 JP JP400785U patent/JPH0744050U/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB2239127B (en) | 1993-07-07 |
| IT9022401A1 (it) | 1991-06-19 |
| IT9022401A0 (it) | 1990-12-17 |
| GB2239127A (en) | 1991-06-19 |
| GB9027122D0 (en) | 1991-02-06 |
| DE9016960U1 (de) | 1991-04-04 |
| GB8928492D0 (en) | 1990-02-21 |
| JPH0744050U (ja) | 1995-10-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 0001 | Granted | ||
| TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19961223 |