IT8906610A0 - Dispositivo a semiconduttore comprendente un circuito di comando e uno stadio di potenza a flusso di corrente verticale integrati in modo monolitico nella stessa piastrina e relativo processo di fabbricazione - Google Patents
Dispositivo a semiconduttore comprendente un circuito di comando e uno stadio di potenza a flusso di corrente verticale integrati in modo monolitico nella stessa piastrina e relativo processo di fabbricazioneInfo
- Publication number
- IT8906610A0 IT8906610A0 IT8906610A IT661089A IT8906610A0 IT 8906610 A0 IT8906610 A0 IT 8906610A0 IT 8906610 A IT8906610 A IT 8906610A IT 661089 A IT661089 A IT 661089A IT 8906610 A0 IT8906610 A0 IT 8906610A0
- Authority
- IT
- Italy
- Prior art keywords
- control circuit
- semiconductor device
- manufacturing process
- device including
- current flow
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0623—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8248—Combination of bipolar and field-effect technology
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Junction Field-Effect Transistors (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8906610A IT1234252B (it) | 1989-06-16 | 1989-06-16 | Dispositivo a semiconduttore comprendente un circuito di comando e uno stadio di potenza a flusso di corrente verticale integrati in modo monolitico nella stessa piastrina e relativo processo di fabbricazione |
EP90201505A EP0403016B1 (en) | 1989-06-16 | 1990-06-12 | Semiconductor device comprising a control circuit and a power stage with vertical current flow, integrated in monolithic form in the same chip, and related manufacturing process |
DE69031610T DE69031610T2 (de) | 1989-06-16 | 1990-06-12 | Monolitisch integrierte Halbleitervorrichtung, die eine Kontrollschaltung und einen Leistungsteil mit vertikalem Stromfluss umfasst, und Verfahren zu ihrer Herstellung |
JP02154121A JP3083831B2 (ja) | 1989-06-16 | 1990-06-14 | 半導体装置及びその製造方法 |
US07/537,940 US5119161A (en) | 1989-06-16 | 1990-06-14 | Semiconductor device comprising a control circuit and a power stage with a vertical current flow, integrated in monolithic form on a single chip |
US07/805,048 US5246871A (en) | 1989-06-16 | 1991-12-11 | Method of manufacturing a semiconductor device comprising a control circuit and a power stage with a vertical current flow, integrated in monolithic form on a single chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8906610A IT1234252B (it) | 1989-06-16 | 1989-06-16 | Dispositivo a semiconduttore comprendente un circuito di comando e uno stadio di potenza a flusso di corrente verticale integrati in modo monolitico nella stessa piastrina e relativo processo di fabbricazione |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8906610A0 true IT8906610A0 (it) | 1989-06-16 |
IT1234252B IT1234252B (it) | 1992-05-14 |
Family
ID=11121377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT8906610A IT1234252B (it) | 1989-06-16 | 1989-06-16 | Dispositivo a semiconduttore comprendente un circuito di comando e uno stadio di potenza a flusso di corrente verticale integrati in modo monolitico nella stessa piastrina e relativo processo di fabbricazione |
Country Status (5)
Country | Link |
---|---|
US (1) | US5119161A (it) |
EP (1) | EP0403016B1 (it) |
JP (1) | JP3083831B2 (it) |
DE (1) | DE69031610T2 (it) |
IT (1) | IT1234252B (it) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1217323B (it) * | 1987-12-22 | 1990-03-22 | Sgs Microelettronica Spa | Struttura integrata di transistor bipolare di potenza di alta tensione e di transistor mos di potenza di bassa tensione nella configurazione"emitter switching"e relativo processo di fabbricazione |
USRE35642E (en) * | 1987-12-22 | 1997-10-28 | Sgs-Thomson Microelectronics, S.R.L. | Integrated high-voltage bipolar power transistor and low voltage MOS power transistor structure in the emitter switching configuration and relative manufacturing process |
IT1246759B (it) * | 1990-12-31 | 1994-11-26 | Sgs Thomson Microelectronics | Struttura integrata di transistore bipolare di potenza e di transistore bipolare di bassa tensione nelle configurazioni ''emitter switching'' o ''semi-ponte'' e relativi processi di fabbricazione. |
EP0683521B1 (en) * | 1994-05-19 | 2002-08-14 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno | Power integrated circuit ("PIC") structure, and manufacturing process thereof |
EP0751573A1 (en) * | 1995-06-30 | 1997-01-02 | STMicroelectronics S.r.l. | Integrated power circuit and corresponding manufacturing process |
EP1043775B1 (en) | 1999-04-06 | 2006-06-14 | STMicroelectronics S.r.l. | Power integrated circuit with vertical current flow and related manufacturing process |
JP5048242B2 (ja) * | 2005-11-30 | 2012-10-17 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及びその製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1592856A (en) * | 1976-11-27 | 1981-07-08 | Ferranti Ltd | Semiconductor devices |
US4641172A (en) * | 1982-08-26 | 1987-02-03 | Mitsubishi Denki Kabushiki Kaisha | Buried PN junction isolation regions for high power semiconductor devices |
JPS60117765A (ja) * | 1983-11-30 | 1985-06-25 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS63204640A (ja) * | 1987-02-20 | 1988-08-24 | Hitachi Ltd | 半導体装置とその製造方法 |
US4734382A (en) * | 1987-02-20 | 1988-03-29 | Fairchild Semiconductor Corporation | BiCMOS process having narrow bipolar emitter and implanted aluminum isolation |
IT1221587B (it) * | 1987-09-07 | 1990-07-12 | S G S Microelettronics Spa | Procedimento di fabbricazione di un dispositivo integrato monolitico a semiconduttore avente strati epitas siali a bassa concentrazione di impurita' |
IT1217322B (it) * | 1987-12-22 | 1990-03-22 | Sgs Microelettronica Spa | Procedimento di fabbricazione di un dispositivo nonolitico a semiconduttope comprendente almeno un transistor di un circuito integrato di comando e un transistor di rotenza in tegrato nella stessa piastrina |
-
1989
- 1989-06-16 IT IT8906610A patent/IT1234252B/it active
-
1990
- 1990-06-12 EP EP90201505A patent/EP0403016B1/en not_active Expired - Lifetime
- 1990-06-12 DE DE69031610T patent/DE69031610T2/de not_active Expired - Fee Related
- 1990-06-14 US US07/537,940 patent/US5119161A/en not_active Expired - Lifetime
- 1990-06-14 JP JP02154121A patent/JP3083831B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0403016A3 (en) | 1991-12-04 |
EP0403016A2 (en) | 1990-12-19 |
DE69031610T2 (de) | 1998-03-12 |
US5119161A (en) | 1992-06-02 |
JP3083831B2 (ja) | 2000-09-04 |
IT1234252B (it) | 1992-05-14 |
DE69031610D1 (de) | 1997-11-27 |
JPH0342866A (ja) | 1991-02-25 |
EP0403016B1 (en) | 1997-10-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0606093A3 (en) | Integrated semiconductor optical device and manufacturing method. | |
EP0422511A3 (en) | Photovoltaic device and process for manufacturing the same | |
EP0417787A3 (en) | Multimold semiconductor device and the manufacturing method therefor | |
KR960008517B1 (en) | Semiconductor device and the manufacturing method | |
KR910008793A (ko) | 반도체장치 및 그 제조방법 | |
DE69526811D1 (de) | Integrierte Halbleiterschaltung mit zwei Versorgungsspannungen | |
KR910007146A (ko) | T형의 반도체 돌출부를 가지는 mosfet와 그 제조방법 | |
IT8706630A0 (it) | Procedimento di fabbricazione di un dispositivo monolitico a semiconduttore comprendente almeno un transistor di un circuito integrato di comando e un transistor di potenza integrato nella stessa piastrina | |
KR960000962B1 (en) | Semiconductor device and the manufacturing method thereof | |
AU2077592A (en) | Semiconductor chip module and method for manufacturing the same | |
KR890013782A (ko) | 광전자집적회로 및 그 제조방법 | |
DE69031291D1 (de) | Testmethode, Testschaltung und integrierter Halbleiterschaltkreis mit Testschaltung | |
ITMI913265A0 (it) | Dispositivo a semiconduttore comprendente almeno un transistor di potenza e almeno un circuito di comando con circuito di isolamento dinamico integrati in maniera manolitica nella stessa piastrina | |
EP0616370A3 (en) | Bipolar semiconductor device containing SiGe and method for its manufacture. | |
IT8906610A0 (it) | Dispositivo a semiconduttore comprendente un circuito di comando e uno stadio di potenza a flusso di corrente verticale integrati in modo monolitico nella stessa piastrina e relativo processo di fabbricazione | |
EP0408868A3 (en) | High voltage semiconductor device and fabrication process | |
DE69427617D1 (de) | Im Nanometerbereich hergestellte Halbleiteranordnung | |
DE68926387D1 (de) | Wärmebeständige Kunststoffpaste sowie damit hergestellte integrierte Schaltungsanordnung | |
DE68915885D1 (de) | Verbindungsvorrichtung zwischen einer integrierten Schaltung und einer elektrischen Schaltung und Herstellungsverfahren derselben. | |
EP0646952A3 (en) | Bipolar semiconductor device and its manufacturing method. | |
EP0361283A3 (en) | Resin-sealed type semiconductor device and method for manufacturing the same | |
DE69232258D1 (de) | Elektrische verbindungsvorrichtung mit modulauswurfsmittel | |
EP0417646A3 (en) | Mos type semiconductor device with a multilayer gate electrode and method for manufacturing the same | |
BR9007676A (pt) | Dispositivo para conexao eletrica e bloco de terminais para telecomunicacoes e processo de fabricacao do dispositivo e do bloco | |
DE69023469D1 (de) | Integrierte Schaltung und Herstellungsverfahren dafür. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970628 |