IT8883674A0 - Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet - Google Patents

Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet

Info

Publication number
IT8883674A0
IT8883674A0 IT8883674A IT8367488A IT8883674A0 IT 8883674 A0 IT8883674 A0 IT 8883674A0 IT 8883674 A IT8883674 A IT 8883674A IT 8367488 A IT8367488 A IT 8367488A IT 8883674 A0 IT8883674 A0 IT 8883674A0
Authority
IT
Italy
Prior art keywords
procedure
devices containing
integrated devices
forming self
aligned metal
Prior art date
Application number
IT8883674A
Other languages
English (en)
Other versions
IT1225624B (it
Inventor
Pier Luigi Crotti
Nadia Iazzi
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT8883674A priority Critical patent/IT1225624B/it
Publication of IT8883674A0 publication Critical patent/IT8883674A0/it
Priority to EP89830445A priority patent/EP0365492B1/en
Priority to DE68916165T priority patent/DE68916165T2/de
Priority to JP1274760A priority patent/JPH02164027A/ja
Priority to US07/424,446 priority patent/US4966867A/en
Application granted granted Critical
Publication of IT1225624B publication Critical patent/IT1225624B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
    • H01L21/28525—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System the conductive layers comprising semiconducting material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76819—Smoothing of the dielectric
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/911—Differential oxidation and etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/978—Semiconductor device manufacturing: process forming tapered edges on substrate or adjacent layers
IT8883674A 1988-10-20 1988-10-20 Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet IT1225624B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT8883674A IT1225624B (it) 1988-10-20 1988-10-20 Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet
EP89830445A EP0365492B1 (en) 1988-10-20 1989-10-16 Process for forming self-aligned, metal-semiconductor contacts in integrated misfet structures
DE68916165T DE68916165T2 (de) 1988-10-20 1989-10-16 Verfahren zum Herstellen von selbstjustierenden Metallhalbleiterkontakten in integrierten MISFET-Strukturen.
JP1274760A JPH02164027A (ja) 1988-10-20 1989-10-20 集積ｍｉｓｆｅｔ構造中の自己整列金属―半導体コンタクトの形成方法
US07/424,446 US4966867A (en) 1988-10-20 1989-10-20 Process for forming self-aligned, metal-semiconductor contacts in integrated MISFET structures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8883674A IT1225624B (it) 1988-10-20 1988-10-20 Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet

Publications (2)

Publication Number Publication Date
IT8883674A0 true IT8883674A0 (it) 1988-10-20
IT1225624B IT1225624B (it) 1990-11-22

Family

ID=11323765

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8883674A IT1225624B (it) 1988-10-20 1988-10-20 Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet

Country Status (5)

Country Link
US (1) US4966867A (it)
EP (1) EP0365492B1 (it)
JP (1) JPH02164027A (it)
DE (1) DE68916165T2 (it)
IT (1) IT1225624B (it)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920010129B1 (ko) * 1989-11-30 1992-11-16 현대전자산업 주식회사 콘택홀의 패턴형성방법
US5240872A (en) * 1990-05-02 1993-08-31 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing semiconductor device having interconnection layer contacting source/drain regions
JP2934325B2 (ja) * 1990-05-02 1999-08-16 三菱電機株式会社 半導体装置およびその製造方法
US5229325A (en) * 1991-01-31 1993-07-20 Samsung Electronics Co., Ltd. Method for forming metal wirings of semiconductor device
KR930006128B1 (ko) * 1991-01-31 1993-07-07 삼성전자 주식회사 반도체장치의 금속 배선 형성방법
WO1992016966A1 (en) * 1991-03-18 1992-10-01 Boston University A method for the preparation and doping of highly insulating monocrystalline gallium nitride thin films
US5633192A (en) * 1991-03-18 1997-05-27 Boston University Method for epitaxially growing gallium nitride layers
US6953703B2 (en) * 1991-03-18 2005-10-11 The Trustees Of Boston University Method of making a semiconductor device with exposure of sapphire substrate to activated nitrogen
US5231043A (en) * 1991-08-21 1993-07-27 Sgs-Thomson Microelectronics, Inc. Contact alignment for integrated circuits
US5200358A (en) * 1991-11-15 1993-04-06 At&T Bell Laboratories Integrated circuit with planar dielectric layer
US5250464A (en) * 1992-03-11 1993-10-05 Texas Instruments Incorporated Method of making a low capacitance, low resistance sidewall antifuse structure
US5302551A (en) * 1992-05-11 1994-04-12 National Semiconductor Corporation Method for planarizing the surface of an integrated circuit over a metal interconnect layer
KR950011986B1 (ko) * 1992-12-16 1995-10-13 현대전자산업주식회사 고집적 반도체 접속장치 제조방법
US5399533A (en) * 1993-12-01 1995-03-21 Vlsi Technology, Inc. Method improving integrated circuit planarization during etchback
US5597764A (en) * 1996-07-15 1997-01-28 Vanguard International Semiconductor Corporation Method of contact formation and planarization for semiconductor processes
US5994228A (en) * 1997-04-11 1999-11-30 Vanguard International Semiconductor Corporation Method of fabricating contact holes in high density integrated circuits using taper contact and self-aligned etching processes
KR100451500B1 (ko) * 1998-12-28 2004-12-08 주식회사 하이닉스반도체 반도체소자의제조방법
US7777321B2 (en) * 2002-04-22 2010-08-17 Gann Keith D Stacked microelectronic layer and module with three-axis channel T-connects
US6806559B2 (en) * 2002-04-22 2004-10-19 Irvine Sensors Corporation Method and apparatus for connecting vertically stacked integrated circuit chips
US8686002B2 (en) 2005-08-21 2014-04-01 AbbVie Deutschland GmbH & Co. KG Heterocyclic compounds and their use as binding partners for 5-HT5 receptors
DE102007052167B4 (de) * 2007-10-31 2010-04-08 Advanced Micro Devices, Inc., Sunnyvale Halbleiterbauelement und Verfahren zum Einstellen der Höhe einer Gateelektrode in dem Halbleiterbauelement
WO2013032906A1 (en) * 2011-08-29 2013-03-07 Efficient Power Conversion Corporation Parallel connection methods for high performance transistors
US8921136B2 (en) * 2013-01-17 2014-12-30 Taiwan Semiconductor Manufacturing Co., Ltd. Self aligned contact formation

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4057895A (en) * 1976-09-20 1977-11-15 General Electric Company Method of forming sloped members of N-type polycrystalline silicon
US4319954A (en) * 1981-02-27 1982-03-16 Rca Corporation Method of forming polycrystalline silicon lines and vias on a silicon substrate
US4464824A (en) * 1982-08-18 1984-08-14 Ncr Corporation Epitaxial contact fabrication process
FR2537779B1 (fr) * 1982-12-10 1986-03-14 Commissariat Energie Atomique Procede de positionnement d'un trou de contact electrique entre deux lignes d'interconnexion d'un circuit integre
JPS59214239A (ja) * 1983-05-16 1984-12-04 Fujitsu Ltd 半導体装置の製造方法
US4508815A (en) * 1983-11-03 1985-04-02 Mostek Corporation Recessed metallization
US4523372A (en) * 1984-05-07 1985-06-18 Motorola, Inc. Process for fabricating semiconductor device
US4545852A (en) * 1984-06-20 1985-10-08 Hewlett-Packard Company Planarization of dielectric films on integrated circuits
JPS61260639A (ja) * 1985-05-14 1986-11-18 Sony Corp 半導体装置の製造方法
JPS63248145A (ja) * 1987-04-03 1988-10-14 Seiko Instr & Electronics Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
DE68916165D1 (de) 1994-07-21
IT1225624B (it) 1990-11-22
US4966867A (en) 1990-10-30
JPH02164027A (ja) 1990-06-25
EP0365492B1 (en) 1994-06-15
DE68916165T2 (de) 1994-09-22
EP0365492A3 (en) 1992-07-08
EP0365492A2 (en) 1990-04-25

Similar Documents

Publication Publication Date Title
IT8883674A0 (it) Procedimento per formare contatti metallo-semiconduttore autoallineatiin dispositivi integrati contenenti strutture misfet
EP0283278A3 (en) Compound semiconductor device having nonalloyed ohmic contacts
EP0428247A3 (en) Semiconductor memory device with improved contact layout
EP0341000A3 (en) Gated turn-off semiconductor device
EP0235785A3 (en) Semiconductor device
KR920003677B1 (en) Metal-semiconductor mesfet device
DE69009626D1 (de) Masterslice-Halbleitervorrichtung.
EP0236687A3 (en) Self-aligned p contact diffusion
IT9048059A0 (it) Dispositivo di contatto elettrico.
GB2227882B (en) Cellular power semiconductor device
GB8803803D0 (en) Semiconductor device
SG67297A1 (en) Semiconductor device
GB2228826B (en) Semiconductor device
GB8901342D0 (en) Semiconductor device
EP0334759A3 (en) Semiconductor device
EP0240567A4 (en) SEMICONDUCTOR ARRANGEMENT.
EP0346120A3 (en) Semiconductor device
EP0296248A4 (en) SEMICONDUCTOR THERAPEUTIC DEVICE.
EP0432796A3 (en) Semiconductor device and electrode block therefor
EP0415318A3 (en) Semiconductor device
EP0238671A4 (en) SEMICONDUCTOR DEVICE.
KR930001219B1 (en) Semiconductor device
GB8812340D0 (en) High mobility semiconductor device
GB2162366B (en) Semiconductor device contact arrangements
DE3683731D1 (de) Kontaktdurchgaenge in halbleiteranordnungen.

Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19971030