IT8348015A0 - Dispositivo distributore di calore auto-posizionante in particolareper la produzione di dispositivi a semiconduttore incapsulati - Google Patents
Dispositivo distributore di calore auto-posizionante in particolareper la produzione di dispositivi a semiconduttore incapsulatiInfo
- Publication number
- IT8348015A0 IT8348015A0 IT8348015A IT4801583A IT8348015A0 IT 8348015 A0 IT8348015 A0 IT 8348015A0 IT 8348015 A IT8348015 A IT 8348015A IT 4801583 A IT4801583 A IT 4801583A IT 8348015 A0 IT8348015 A0 IT 8348015A0
- Authority
- IT
- Italy
- Prior art keywords
- self
- production
- semiconductor devices
- encapsulated semiconductor
- distributor device
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36511482A | 1982-04-05 | 1982-04-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8348015A0 true IT8348015A0 (it) | 1983-03-29 |
IT1164597B IT1164597B (it) | 1987-04-15 |
Family
ID=23437521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT48015/83A IT1164597B (it) | 1982-04-05 | 1983-03-29 | Dispositivo distributore di calore auto-posizionante in particolare per la produzione di dispositivi a semiconduttore incapsulati |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0104231A4 (it) |
JP (1) | JPS59500541A (it) |
KR (1) | KR840004828A (it) |
CA (1) | CA1201817A (it) |
IT (1) | IT1164597B (it) |
WO (1) | WO1983003712A1 (it) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2597261B1 (fr) * | 1986-04-11 | 1988-10-14 | Aix Les Bains Composants | Boitier d'encapsulation de circuits integres a dissipation thermique amelioree, et procede de fabrication |
JP3322429B2 (ja) * | 1992-06-04 | 2002-09-09 | 新光電気工業株式会社 | 半導体装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6901240A (it) * | 1968-01-26 | 1969-07-29 | ||
DE2004768C3 (de) * | 1968-07-30 | 1979-09-06 | N.V. Philips' Gloeilampenfabrieken, Eindhoven (Niederlande) | Halbleiterbauelement |
GB1239634A (it) * | 1968-10-02 | 1971-07-21 | ||
US3585272A (en) * | 1969-10-01 | 1971-06-15 | Fairchild Camera Instr Co | Semiconductor package of alumina and aluminum |
US3868725A (en) * | 1971-10-14 | 1975-02-25 | Philips Corp | Integrated circuit lead structure |
US3930114A (en) * | 1975-03-17 | 1975-12-30 | Nat Semiconductor Corp | Integrated circuit package utilizing novel heat sink structure |
US4054901A (en) * | 1975-10-14 | 1977-10-18 | Thermalloy, Inc. | Index mounting unitary heat sink apparatus with apertured base |
JPS53126275A (en) * | 1977-04-11 | 1978-11-04 | Hitachi Ltd | Semiconductor device |
JPS53132975A (en) * | 1977-04-26 | 1978-11-20 | Toshiba Corp | Semiconductor device |
US4132856A (en) * | 1977-11-28 | 1979-01-02 | Burroughs Corporation | Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby |
JPS55134951A (en) * | 1979-04-10 | 1980-10-21 | Toshiba Corp | Semiconductor device |
JPS6050346B2 (ja) * | 1980-04-16 | 1985-11-08 | 日本電気株式会社 | 半導体装置の製造方法 |
FR2488445A1 (fr) * | 1980-08-06 | 1982-02-12 | Efcis | Boitier plastique pour circuits integres |
-
1983
- 1983-03-11 EP EP19830901297 patent/EP0104231A4/en not_active Withdrawn
- 1983-03-11 WO PCT/US1983/000351 patent/WO1983003712A1/en not_active Application Discontinuation
- 1983-03-11 JP JP58501368A patent/JPS59500541A/ja active Pending
- 1983-03-18 CA CA000423966A patent/CA1201817A/en not_active Expired
- 1983-03-29 IT IT48015/83A patent/IT1164597B/it active
- 1983-04-04 KR KR1019830001389A patent/KR840004828A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP0104231A1 (en) | 1984-04-04 |
EP0104231A4 (en) | 1985-10-30 |
WO1983003712A1 (en) | 1983-10-27 |
CA1201817A (en) | 1986-03-11 |
JPS59500541A (ja) | 1984-03-29 |
IT1164597B (it) | 1987-04-15 |
KR840004828A (ko) | 1984-10-24 |
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