IT1194477B - Dispositivo laser a semiconduttori - Google Patents

Dispositivo laser a semiconduttori

Info

Publication number
IT1194477B
IT1194477B IT23850/83A IT2385083A IT1194477B IT 1194477 B IT1194477 B IT 1194477B IT 23850/83 A IT23850/83 A IT 23850/83A IT 2385083 A IT2385083 A IT 2385083A IT 1194477 B IT1194477 B IT 1194477B
Authority
IT
Italy
Prior art keywords
semiconductor laser
laser device
semiconductor
laser
Prior art date
Application number
IT23850/83A
Other languages
English (en)
Other versions
IT8323850A0 (it
Inventor
Masaaki Sawai
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8323850A0 publication Critical patent/IT8323850A0/it
Application granted granted Critical
Publication of IT1194477B publication Critical patent/IT1194477B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2301/00—Functional characteristics
    • H01S2301/14—Semiconductor lasers with special structural design for lasing in a specific polarisation mode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2301/00—Functional characteristics
    • H01S2301/18—Semiconductor lasers with special structural design for influencing the near- or far-field
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
    • H01S5/0264—Photo-diodes, e.g. transceiver devices, bidirectional devices for monitoring the laser-output
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
IT23850/83A 1982-11-24 1983-11-23 Dispositivo laser a semiconduttori IT1194477B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57204645A JPS5994891A (ja) 1982-11-24 1982-11-24 半導体レ−ザ装置

Publications (2)

Publication Number Publication Date
IT8323850A0 IT8323850A0 (it) 1983-11-23
IT1194477B true IT1194477B (it) 1988-09-22

Family

ID=16493906

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23850/83A IT1194477B (it) 1982-11-24 1983-11-23 Dispositivo laser a semiconduttori

Country Status (7)

Country Link
US (1) US4604753A (it)
JP (1) JPS5994891A (it)
KR (1) KR840006578A (it)
DE (1) DE3342111A1 (it)
FR (1) FR2536596A1 (it)
GB (1) GB2131607B (it)
IT (1) IT1194477B (it)

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JPH04105572U (ja) * 1991-02-26 1992-09-10 ソニー株式会社 レーザ装置
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US5313333A (en) * 1992-12-23 1994-05-17 Estman Kodak Company Method and apparatus for combined active and passive athermalization of an optical assembly
US5270869A (en) * 1992-12-23 1993-12-14 Eastman Kodak Company Passively athermalized optical assembly incorporating laminate fiber compensation ring
US5317875A (en) * 1992-12-23 1994-06-07 Eastman Kodak Company Thermally-controlled rotary displacement actuator operable for precise displacement of an optical or mechanical element
US5270870A (en) * 1992-12-23 1993-12-14 Eastman Kodak Company Athermalized beam source and collimator lens assembly
US6043872A (en) * 1994-06-22 2000-03-28 Nec Corporation Method and apparatus for determining defectiveness/non-defectiveness of a semiconductor laser by examining an optical output from the semiconductor laser
JP3432620B2 (ja) * 1994-12-20 2003-08-04 富士通株式会社 光送信機及びレーザダイオードモジュール
JPH08264898A (ja) * 1995-03-23 1996-10-11 Mitsubishi Electric Corp 半導体レーザ装置
DE19617552A1 (de) * 1996-05-02 1997-11-06 Heidelberger Druckmasch Ag Verfahren und Vorrichtung zur Regelung der Temperatur in einer mit Laserlicht arbeitenden Druckplatten-Beschriftungseinheit, insbesondere einer Offset-Druckmaschine
JP3339369B2 (ja) * 1997-05-30 2002-10-28 株式会社デンソー レーザダイオード
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DE19912463A1 (de) * 1999-03-19 2000-09-28 Sensor Line Ges Fuer Optoelekt Verfahren zur Stabilisierung der optischen Ausgangsleistung von Leuchtdioden und Laserdioden
US6868104B2 (en) 2001-09-06 2005-03-15 Finisar Corporation Compact laser package with integrated temperature control
US20050105571A1 (en) * 2002-02-25 2005-05-19 Van Der Kall Herman P. Controlling the temperature of a laser diode in a disc drive
JP4687460B2 (ja) * 2003-07-28 2011-05-25 日亜化学工業株式会社 発光装置、ｌｅｄ照明、ｌｅｄ発光装置及び発光装置の制御方法
US7701988B2 (en) * 2005-04-20 2010-04-20 Finisar Corporation Optical transmit assembly including thermally isolated laser, temperature sensor, and temperature driver
US7706421B2 (en) 2005-04-20 2010-04-27 Finisar Corporation Temperature sensing device patterned on an electro-optic transducer die
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JP2006324524A (ja) * 2005-05-19 2006-11-30 Sumitomo Electric Ind Ltd 発光モジュール
US20070120138A1 (en) * 2005-11-28 2007-05-31 Visteon Global Technologies, Inc. Multi-layer light emitting device with integrated thermoelectric chip
US7832944B2 (en) 2007-11-08 2010-11-16 Finisar Corporation Optoelectronic subassembly with integral thermoelectric cooler driver
TWI447892B (zh) * 2009-04-20 2014-08-01 財團法人工業技術研究院 發光裝置與其製造方法
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US8605763B2 (en) * 2010-03-31 2013-12-10 Microsoft Corporation Temperature measurement and control for laser and light-emitting diodes
JP2013110138A (ja) * 2011-11-17 2013-06-06 Sumitomo Electric Ind Ltd 発光モジュール
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JP6356526B2 (ja) * 2014-08-01 2018-07-11 株式会社日立エルジーデータストレージ 光モジュールとその製造方法
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Also Published As

Publication number Publication date
GB2131607B (en) 1987-01-14
JPS5994891A (ja) 1984-05-31
KR840006578A (ko) 1984-11-30
FR2536596A1 (fr) 1984-05-25
US4604753A (en) 1986-08-05
GB2131607A (en) 1984-06-20
DE3342111A1 (de) 1984-05-24
GB8330997D0 (en) 1983-12-29
IT8323850A0 (it) 1983-11-23

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Legal Events

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19931118