IT1164597B - Dispositivo distributore di calore auto-posizionante in particolare per la produzione di dispositivi a semiconduttore incapsulati - Google Patents

Dispositivo distributore di calore auto-posizionante in particolare per la produzione di dispositivi a semiconduttore incapsulati

Info

Publication number
IT1164597B
IT1164597B IT48015/83A IT4801583A IT1164597B IT 1164597 B IT1164597 B IT 1164597B IT 48015/83 A IT48015/83 A IT 48015/83A IT 4801583 A IT4801583 A IT 4801583A IT 1164597 B IT1164597 B IT 1164597B
Authority
IT
Italy
Prior art keywords
self
production
semiconductor devices
dispenser device
encapsulated semiconductor
Prior art date
Application number
IT48015/83A
Other languages
English (en)
Other versions
IT8348015A0 (it
Inventor
William L Hunter
Paul R Theobald
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of IT8348015A0 publication Critical patent/IT8348015A0/it
Application granted granted Critical
Publication of IT1164597B publication Critical patent/IT1164597B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
IT48015/83A 1982-04-05 1983-03-29 Dispositivo distributore di calore auto-posizionante in particolare per la produzione di dispositivi a semiconduttore incapsulati IT1164597B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US36511482A 1982-04-05 1982-04-05

Publications (2)

Publication Number Publication Date
IT8348015A0 IT8348015A0 (it) 1983-03-29
IT1164597B true IT1164597B (it) 1987-04-15

Family

ID=23437521

Family Applications (1)

Application Number Title Priority Date Filing Date
IT48015/83A IT1164597B (it) 1982-04-05 1983-03-29 Dispositivo distributore di calore auto-posizionante in particolare per la produzione di dispositivi a semiconduttore incapsulati

Country Status (6)

Country Link
EP (1) EP0104231A4 (it)
JP (1) JPS59500541A (it)
KR (1) KR840004828A (it)
CA (1) CA1201817A (it)
IT (1) IT1164597B (it)
WO (1) WO1983003712A1 (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2597261B1 (fr) * 1986-04-11 1988-10-14 Aix Les Bains Composants Boitier d'encapsulation de circuits integres a dissipation thermique amelioree, et procede de fabrication
JP3322429B2 (ja) * 1992-06-04 2002-09-09 新光電気工業株式会社 半導体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6901240A (it) * 1968-01-26 1969-07-29
DE2004768C3 (de) * 1968-07-30 1979-09-06 N.V. Philips' Gloeilampenfabrieken, Eindhoven (Niederlande) Halbleiterbauelement
GB1239634A (it) * 1968-10-02 1971-07-21
US3585272A (en) * 1969-10-01 1971-06-15 Fairchild Camera Instr Co Semiconductor package of alumina and aluminum
US3868725A (en) * 1971-10-14 1975-02-25 Philips Corp Integrated circuit lead structure
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
JPS53126275A (en) * 1977-04-11 1978-11-04 Hitachi Ltd Semiconductor device
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
JPS55134951A (en) * 1979-04-10 1980-10-21 Toshiba Corp Semiconductor device
JPS6050346B2 (ja) * 1980-04-16 1985-11-08 日本電気株式会社 半導体装置の製造方法
FR2488445A1 (fr) * 1980-08-06 1982-02-12 Efcis Boitier plastique pour circuits integres

Also Published As

Publication number Publication date
IT8348015A0 (it) 1983-03-29
KR840004828A (ko) 1984-10-24
JPS59500541A (ja) 1984-03-29
CA1201817A (en) 1986-03-11
EP0104231A4 (en) 1985-10-30
WO1983003712A1 (en) 1983-10-27
EP0104231A1 (en) 1984-04-04

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