IT8023728A0 - Resistivita'.metodo di fabbricazione di unapellicola di silicio policristallino di bassa - Google Patents

Resistivita'.metodo di fabbricazione di unapellicola di silicio policristallino di bassa

Info

Publication number
IT8023728A0
IT8023728A0 IT8023728A IT2372880A IT8023728A0 IT 8023728 A0 IT8023728 A0 IT 8023728A0 IT 8023728 A IT8023728 A IT 8023728A IT 2372880 A IT2372880 A IT 2372880A IT 8023728 A0 IT8023728 A0 IT 8023728A0
Authority
IT
Italy
Prior art keywords
resistivity
manufacturing
polycrystalline silicon
silicon film
low polycrystalline
Prior art date
Application number
IT8023728A
Other languages
English (en)
Other versions
IT1131995B (it
Inventor
Chung Pao Wu
Ronald Keith Smeltzer
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of IT8023728A0 publication Critical patent/IT8023728A0/it
Application granted granted Critical
Publication of IT1131995B publication Critical patent/IT1131995B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/32055—Deposition of semiconductive layers, e.g. poly - or amorphous silicon layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/934—Sheet resistance, i.e. dopant parameters

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Electrodes Of Semiconductors (AREA)
IT23728/80A 1979-08-10 1980-07-25 Metodo di fabbricazione di una pellicola di silicio policristallino di bassa resistivita' IT1131995B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/065,437 US4229502A (en) 1979-08-10 1979-08-10 Low-resistivity polycrystalline silicon film

Publications (2)

Publication Number Publication Date
IT8023728A0 true IT8023728A0 (it) 1980-07-25
IT1131995B IT1131995B (it) 1986-06-25

Family

ID=22062724

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23728/80A IT1131995B (it) 1979-08-10 1980-07-25 Metodo di fabbricazione di una pellicola di silicio policristallino di bassa resistivita'

Country Status (6)

Country Link
US (1) US4229502A (it)
JP (1) JPS5629321A (it)
DE (1) DE3029055A1 (it)
FR (1) FR2463507A1 (it)
GB (1) GB2056173B (it)
IT (1) IT1131995B (it)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5633822A (en) * 1979-08-29 1981-04-04 Hitachi Ltd Preparation of semiconductor device
JPS5688818A (en) * 1979-12-17 1981-07-18 Hitachi Ltd Polycrystalline silicon membrane and its production
US4803528A (en) * 1980-07-28 1989-02-07 General Electric Company Insulating film having electrically conducting portions
US4339285A (en) * 1980-07-28 1982-07-13 Rca Corporation Method for fabricating adjacent conducting and insulating regions in a film by laser irradiation
US4395467A (en) * 1981-12-30 1983-07-26 Rca Corporation Transparent conductive film having areas of high and low resistivity
US4467519A (en) * 1982-04-01 1984-08-28 International Business Machines Corporation Process for fabricating polycrystalline silicon film resistors
US4475955A (en) * 1982-12-06 1984-10-09 Harris Corporation Method for forming integrated circuits bearing polysilicon of reduced resistance
US4472210A (en) * 1983-01-07 1984-09-18 Rca Corporation Method of making a semiconductor device to improve conductivity of amorphous silicon films
US4559102A (en) * 1983-05-09 1985-12-17 Sony Corporation Method for recrystallizing a polycrystalline, amorphous or small grain material
JPH0638496B2 (ja) * 1983-06-27 1994-05-18 日本電気株式会社 半導体装置
JPS6165441A (ja) * 1984-09-07 1986-04-04 Mitsubishi Electric Corp プラズマ窒化シリコン絶縁膜の処理方法
US4551352A (en) * 1985-01-17 1985-11-05 Rca Corporation Method of making P-type hydrogenated amorphous silicon
GB8504725D0 (en) * 1985-02-23 1985-03-27 Standard Telephones Cables Ltd Integrated circuits
GB2191510A (en) * 1986-04-16 1987-12-16 Gen Electric Plc Depositing doped polysilicon films
JP2821117B2 (ja) * 1986-11-29 1998-11-05 日本電気株式会社 半導体装置の製造方法
US5096856A (en) * 1988-03-01 1992-03-17 Texas Instruments Incorporated In-situ doped silicon using tertiary butyl phosphine
US5244822A (en) * 1988-05-16 1993-09-14 Kabushiki Kaisha Toshiba Method of fabricating bipolar transistor using self-aligned polysilicon technology
US5096842A (en) * 1988-05-16 1992-03-17 Kabushiki Kaisha Toshiba Method of fabricating bipolar transistor using self-aligned polysilicon technology
US5250388A (en) * 1988-05-31 1993-10-05 Westinghouse Electric Corp. Production of highly conductive polymers for electronic circuits
US5198387A (en) * 1989-12-01 1993-03-30 Texas Instruments Incorporated Method and apparatus for in-situ doping of deposited silicon
DE69125886T2 (de) * 1990-05-29 1997-11-20 Semiconductor Energy Lab Dünnfilmtransistoren
TW237562B (it) * 1990-11-09 1995-01-01 Semiconductor Energy Res Co Ltd
US5334880A (en) * 1991-04-30 1994-08-02 International Business Machines Corporation Low voltage programmable storage element
JP3315730B2 (ja) * 1991-08-26 2002-08-19 マイクロリス、コーパレイシャン ピエゾ抵抗半導体センサ・ゲージ及びこれを作る方法
US5766344A (en) * 1991-09-21 1998-06-16 Semiconductor Energy Laboratory Co., Ltd. Method for forming a semiconductor
JP2830718B2 (ja) * 1993-09-30 1998-12-02 日本電気株式会社 薄膜トランジスタの製造方法
US6040019A (en) * 1997-02-14 2000-03-21 Advanced Micro Devices, Inc. Method of selectively annealing damaged doped regions
US6319743B1 (en) 1999-04-14 2001-11-20 Mykrolis Corporation Method of making thin film piezoresistive sensor
US6255185B1 (en) 1999-05-19 2001-07-03 International Business Machines Corporation Two step anneal for controlling resistor tolerance
DE10053957C2 (de) * 2000-10-31 2002-10-31 Infineon Technologies Ag Temperaturkompensierter Halbleiterwiderstand und dessen Verwendung
US6621404B1 (en) * 2001-10-23 2003-09-16 Lsi Logic Corporation Low temperature coefficient resistor
EP1618609A4 (en) * 2003-04-11 2009-10-28 Ibm PROGRAMMABLE SEMICONDUCTOR ELEMENT
KR20100040455A (ko) * 2008-10-10 2010-04-20 주식회사 동부하이텍 반도체 소자의 제조 방법
CN110359032A (zh) * 2019-07-18 2019-10-22 北京北方华创微电子装备有限公司 温度补偿方法及恒温区温度校准方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4059461A (en) * 1975-12-10 1977-11-22 Massachusetts Institute Of Technology Method for improving the crystallinity of semiconductor films by laser beam scanning and the products thereof
JPS53132275A (en) * 1977-04-25 1978-11-17 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device and its production
FR2394173A1 (fr) * 1977-06-06 1979-01-05 Thomson Csf Procede de fabrication de dispositifs electroniques qui comportent une couche mince de silicium amorphe et dispositif electronique obtenu par un tel procede
JPS5423386A (en) * 1977-07-22 1979-02-21 Hitachi Ltd Manufacture of semiconductor device
US4198246A (en) * 1978-11-27 1980-04-15 Rca Corporation Pulsed laser irradiation for reducing resistivity of a doped polycrystalline silicon film

Also Published As

Publication number Publication date
GB2056173B (en) 1983-09-14
GB2056173A (en) 1981-03-11
JPS5629321A (en) 1981-03-24
US4229502A (en) 1980-10-21
FR2463507B1 (it) 1984-10-19
IT1131995B (it) 1986-06-25
DE3029055A1 (de) 1981-02-26
FR2463507A1 (fr) 1981-02-20

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