JPS5555554A - Semiconductor element - Google Patents

Semiconductor element

Info

Publication number
JPS5555554A
JPS5555554A JP11888179A JP11888179A JPS5555554A JP S5555554 A JPS5555554 A JP S5555554A JP 11888179 A JP11888179 A JP 11888179A JP 11888179 A JP11888179 A JP 11888179A JP S5555554 A JPS5555554 A JP S5555554A
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11888179A
Other languages
Japanese (ja)
Other versions
JPS6046542B2 (en
Inventor
Jiyon Ieeman Arekisandaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPS5555554A publication Critical patent/JPS5555554A/en
Publication of JPS6046542B2 publication Critical patent/JPS6046542B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP54118881A 1978-09-18 1979-09-18 semiconductor element Expired JPS6046542B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94332578A 1978-09-18 1978-09-18
US943325 1978-09-18

Publications (2)

Publication Number Publication Date
JPS5555554A true JPS5555554A (en) 1980-04-23
JPS6046542B2 JPS6046542B2 (en) 1985-10-16

Family

ID=25479456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54118881A Expired JPS6046542B2 (en) 1978-09-18 1979-09-18 semiconductor element

Country Status (4)

Country Link
JP (1) JPS6046542B2 (en)
CH (1) CH661932A5 (en)
DE (1) DE2937547A1 (en)
NL (1) NL7906941A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0243221A (en) * 1988-06-10 1990-02-13 Occidental Chem Corp New soluble polyimide siloxane and its manufacture and use
JPH02277416A (en) * 1989-04-19 1990-11-14 Fujii Kinzoku Kako Kk Flying pan capable of self-controlling in temperature
JPH03195730A (en) * 1989-12-25 1991-08-27 Hitachi Chem Co Ltd Siloxane modified polyimide and precursor thereof
JPH05331283A (en) * 1992-06-04 1993-12-14 Sumitomo Bakelite Co Ltd Polyimide resin
JPH05331446A (en) * 1992-06-04 1993-12-14 Sumitomo Bakelite Co Ltd High-molecular weight polyimide resin film adhesive
JP2009249872A (en) * 2008-04-03 2009-10-29 Japan Delivery System Corp Electric lock

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3247938A1 (en) * 1982-12-24 1984-07-05 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor device having high reverse-voltage handling capacity
JPS62201734U (en) * 1986-06-13 1987-12-23
JPS63194335U (en) * 1987-06-01 1988-12-14

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1246886B (en) * 1960-07-30 1967-08-10 Elektronik M B H Process for stabilizing and improving the blocking properties of semiconductor components
US3740305A (en) * 1971-10-01 1973-06-19 Gen Electric Composite materials bonded with siloxane containing polyimides
SE418432B (en) * 1975-12-11 1981-05-25 Gen Electric SET FOR TREATMENT OF A SELECTED AREA WITH A SEMICONDUCTOR
DE2632647A1 (en) * 1976-07-20 1978-01-26 Siemens Ag SEMICONDUCTOR COMPONENT WITH PASSIVATING PROTECTIVE LAYER

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0243221A (en) * 1988-06-10 1990-02-13 Occidental Chem Corp New soluble polyimide siloxane and its manufacture and use
JPH02277416A (en) * 1989-04-19 1990-11-14 Fujii Kinzoku Kako Kk Flying pan capable of self-controlling in temperature
JPH03195730A (en) * 1989-12-25 1991-08-27 Hitachi Chem Co Ltd Siloxane modified polyimide and precursor thereof
JPH05331283A (en) * 1992-06-04 1993-12-14 Sumitomo Bakelite Co Ltd Polyimide resin
JPH05331446A (en) * 1992-06-04 1993-12-14 Sumitomo Bakelite Co Ltd High-molecular weight polyimide resin film adhesive
JP2009249872A (en) * 2008-04-03 2009-10-29 Japan Delivery System Corp Electric lock

Also Published As

Publication number Publication date
NL7906941A (en) 1980-03-20
JPS6046542B2 (en) 1985-10-16
CH661932A5 (en) 1987-08-31
DE2937547A1 (en) 1980-03-27

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