IT7828700A0 - Telaietto ed imballaggio per stabilire connessioni elettriche a componenti elettronici. - Google Patents

Telaietto ed imballaggio per stabilire connessioni elettriche a componenti elettronici.

Info

Publication number
IT7828700A0
IT7828700A0 IT7828700A IT2870078A IT7828700A0 IT 7828700 A0 IT7828700 A0 IT 7828700A0 IT 7828700 A IT7828700 A IT 7828700A IT 2870078 A IT2870078 A IT 2870078A IT 7828700 A0 IT7828700 A0 IT 7828700A0
Authority
IT
Italy
Prior art keywords
packaging
frame
electronic components
electrical connections
establish electrical
Prior art date
Application number
IT7828700A
Other languages
English (en)
Other versions
IT1100967B (it
Original Assignee
Amp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amp Inc filed Critical Amp Inc
Publication of IT7828700A0 publication Critical patent/IT7828700A0/it
Application granted granted Critical
Publication of IT1100967B publication Critical patent/IT1100967B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
IT28700/78A 1977-10-27 1978-10-12 Tealietto ed imballaggio per stabilire connessioni elettriche a componenti elettronici IT1100967B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/846,052 US4158745A (en) 1977-10-27 1977-10-27 Lead frame having integral terminal tabs

Publications (2)

Publication Number Publication Date
IT7828700A0 true IT7828700A0 (it) 1978-10-12
IT1100967B IT1100967B (it) 1985-09-28

Family

ID=25296808

Family Applications (1)

Application Number Title Priority Date Filing Date
IT28700/78A IT1100967B (it) 1977-10-27 1978-10-12 Tealietto ed imballaggio per stabilire connessioni elettriche a componenti elettronici

Country Status (7)

Country Link
US (1) US4158745A (it)
EP (1) EP0001892B1 (it)
JP (1) JPS5474372A (it)
CA (1) CA1106012A (it)
DE (1) DE2861119D1 (it)
ES (1) ES474519A1 (it)
IT (1) IT1100967B (it)

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US4252864A (en) * 1979-11-05 1981-02-24 Amp Incorporated Lead frame having integral terminal tabs
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FR2522203A1 (fr) * 1982-02-24 1983-08-26 Sintra Alcatel Sa Traversee electrique de boitier de circuit hybride et connecteurs complementaires
US4436358A (en) 1982-03-31 1984-03-13 Amp Incorporated Terminal tab intended for mounting on a circuit board
FR2527837A1 (fr) * 1982-05-25 1983-12-02 Thomson Csf Boitier d'encapsulation d'un dispositif semi-conducteur fonctionnant a tres haute tension, et son procede de fabrication
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US4611389A (en) * 1983-11-03 1986-09-16 Motorola, Inc. Low-cost power device package with quick-connect terminals and electrically isolated mounting means
USD289036S (en) 1984-02-21 1987-03-31 Pace Incorporated Ornamental design for a frame of edge connectors utilized to replace damaged connectors on printed circuit boards
USD288436S (en) 1984-02-21 1987-02-24 Pace, Incorporated Frame of dual in line package pads utilized to replace damaged pads on printed circuit boards
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US4846701A (en) * 1987-12-16 1989-07-11 Amp Incorporated Quick disconnect smart connector
US4879633A (en) * 1988-04-12 1989-11-07 Kaufman Lance R Direct bond circuit assembly with ground plane
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US4935803A (en) * 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
US5001545A (en) * 1988-09-09 1991-03-19 Motorola, Inc. Formed top contact for non-flat semiconductor devices
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US5059746A (en) * 1989-05-01 1991-10-22 Amp Incorporated Housing assembly for electronic components
US5012391A (en) * 1989-08-17 1991-04-30 Amp Incorporated Molded electrical interconnection system
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
AU8519891A (en) * 1990-08-01 1992-03-02 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
US5804870A (en) * 1992-06-26 1998-09-08 Staktek Corporation Hermetically sealed integrated circuit lead-on package configuration
KR940016724A (ko) * 1992-12-03 1994-07-23 빈센트 비. 인그라시아 표면 실장형 집적 회로 파워 패키지용 리드 프레임 어셈블리
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US6205654B1 (en) * 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5410449A (en) * 1993-05-24 1995-04-25 Delco Electronics Corp. Heatsink conductor solder pad
US5686698A (en) * 1994-06-30 1997-11-11 Motorola, Inc. Package for electrical components having a molded structure with a port extending into the molded structure
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
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US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US5867367A (en) * 1997-12-04 1999-02-02 Intel Corporation Quad flat pack integrated circuit package
US6091317A (en) * 1998-07-06 2000-07-18 Ford Motor Company Temperature sensor assembly
US6141219A (en) * 1998-12-23 2000-10-31 Sundstrand Corporation Modular power electronics die having integrated cooling apparatus
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US6462408B1 (en) * 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
USD552559S1 (en) * 2005-08-31 2007-10-09 Osram Sylvania Inc. Electrical connector
USD555598S1 (en) * 2005-08-31 2007-11-20 Osram Sylvania Inc. Electrical connector
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DE102007051870A1 (de) * 2007-10-30 2009-05-07 Robert Bosch Gmbh Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses
JP4950862B2 (ja) * 2007-12-10 2012-06-13 矢崎総業株式会社 複合端子の製造方法
KR100983882B1 (ko) * 2008-07-07 2010-09-27 주식회사 뉴인텍 커패시터용 부스바 조립방법 및 그 제품
CN102196689A (zh) * 2010-03-19 2011-09-21 深圳富泰宏精密工业有限公司 便携式电子装置壳体
JP5734364B2 (ja) * 2012-11-22 2015-06-17 株式会社デンソー 電力変換装置
DE102015107657A1 (de) 2015-05-15 2016-12-01 Alanod Gmbh & Co. Kg Verfahren zur Herstellung eines Anschlussträgers, Anschlussträger sowie optoelektronisches Halbleiterbauteil mit einem Anschlussträger
TWI828624B (zh) 2017-06-13 2024-01-11 美商山姆科技公司 電連接器系統及其使用方法
USD964291S1 (en) 2017-07-21 2022-09-20 Samtec, Inc. Electrical connector
CN111095686B (zh) 2017-07-21 2023-02-03 申泰公司 具有闩锁的电连接器
EP3701594A4 (en) * 2017-10-24 2021-07-21 Samtec Inc. RIGHT ANGLED ELECTRICAL CONNECTOR AND ELECTRICAL CONTACTS FOR A RIGHT ANGLED CONNECTOR
USD896183S1 (en) 2018-01-08 2020-09-15 Samtec, Inc. Electrical cable connector
US10938136B2 (en) * 2018-05-29 2021-03-02 Avx Corporation Surface mounted card edge contact pair with pick-up carrier
JP2024544309A (ja) * 2021-12-17 2024-11-28 ヴィシャイ シリコニックス，エルエルシー 半導体デバイス、および半導体デバイス用部品の形成方法

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US3258661A (en) * 1962-12-17 1966-06-28 Sealed semiconductor device
US3426252A (en) * 1966-05-03 1969-02-04 Bell Telephone Labor Inc Semiconductive device including beam leads
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting
US3597666A (en) * 1969-11-26 1971-08-03 Fairchild Camera Instr Co Lead frame design
US3650232A (en) * 1970-09-08 1972-03-21 Amp Inc Method and apparatus for manufacturing lead frames
US3778887A (en) * 1970-12-23 1973-12-18 Hitachi Ltd Electronic devices and method for manufacturing the same
US3736367A (en) * 1971-04-09 1973-05-29 Amp Inc Lead frames and method of making same
US3735017A (en) * 1971-04-12 1973-05-22 Amp Inc Lead frames and method of making same
US3821615A (en) * 1973-05-16 1974-06-28 Solitron Devices Long life lead frame means for semiconductor devices
JPS5245261A (en) * 1975-10-08 1977-04-09 Hitachi Ltd Electronic parts

Also Published As

Publication number Publication date
JPS5474372A (en) 1979-06-14
ES474519A1 (es) 1979-11-01
IT1100967B (it) 1985-09-28
DE2861119D1 (en) 1981-12-10
CA1106012A (en) 1981-07-28
EP0001892B1 (en) 1981-09-23
US4158745A (en) 1979-06-19
EP0001892A1 (en) 1979-05-16

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