JPS6435754U - - Google Patents
Info
- Publication number
- JPS6435754U JPS6435754U JP13119787U JP13119787U JPS6435754U JP S6435754 U JPS6435754 U JP S6435754U JP 13119787 U JP13119787 U JP 13119787U JP 13119787 U JP13119787 U JP 13119787U JP S6435754 U JPS6435754 U JP S6435754U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- semiconductor chip
- lead frame
- fixed
- out terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13119787U JPS6435754U (it) | 1987-08-28 | 1987-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13119787U JPS6435754U (it) | 1987-08-28 | 1987-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6435754U true JPS6435754U (it) | 1989-03-03 |
Family
ID=31387038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13119787U Pending JPS6435754U (it) | 1987-08-28 | 1987-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6435754U (it) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5474372A (en) * | 1977-10-27 | 1979-06-14 | Amp Inc | Lead frame and package for electrically connecting electronic parts |
-
1987
- 1987-08-28 JP JP13119787U patent/JPS6435754U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5474372A (en) * | 1977-10-27 | 1979-06-14 | Amp Inc | Lead frame and package for electrically connecting electronic parts |