JPS6435754U - - Google Patents

Info

Publication number
JPS6435754U
JPS6435754U JP13119787U JP13119787U JPS6435754U JP S6435754 U JPS6435754 U JP S6435754U JP 13119787 U JP13119787 U JP 13119787U JP 13119787 U JP13119787 U JP 13119787U JP S6435754 U JPS6435754 U JP S6435754U
Authority
JP
Japan
Prior art keywords
conductor pattern
semiconductor chip
lead frame
fixed
out terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13119787U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13119787U priority Critical patent/JPS6435754U/ja
Publication of JPS6435754U publication Critical patent/JPS6435754U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、この考案の半導体装置を製作するた
めのリードフレームを示し、同図ａは、その平面
図、同図ｂは、上記リードフレームから切除した
状態の側面図、同図ｃは、上記のリードフレーム
を使用して製作された半導体装置の平面図、第２
図は、従来のこの種の半導体装置を示し、同図ａ
は、その平面図、同図ｂは、その横断面図である
。 １……半導体チツプ、２……基板、４……導体
パターン、１４ａ，１４ｂ……カソード端子中継
部、１５，１６……アノード端子、１７，１８…
…カソード端子、１９，２０……ゲート端子、２
１……リードフレーム、２２，２３……補助カソ
ード端子、２４……連結部、２５……絶縁ケース
。 FIG. 1 shows a lead frame for manufacturing a semiconductor device of this invention; FIG. 1A is a plan view thereof, FIG. A second plan view of a semiconductor device manufactured using the above lead frame.
The figure shows a conventional semiconductor device of this type.
is a plan view thereof, and Figure b is a cross-sectional view thereof. DESCRIPTION OF SYMBOLS 1... Semiconductor chip, 2... Substrate, 4... Conductor pattern, 14a, 14b... Cathode terminal relay part, 15, 16... Anode terminal, 17, 18...
...Cathode terminal, 19,20...Gate terminal, 2
DESCRIPTION OF SYMBOLS 1... Lead frame, 22, 23... Auxiliary cathode terminal, 24... Connecting part, 25... Insulating case.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 所定の導体パターンが形成され、半導体チツプ
が搭載・固定される基板と、この半導体チツプの
電極金属層および上記基板に形成された導体パタ
ーンと接続され、外部へ導出される複数の外部導
出端子のすべてが連結部を介して一体的に形成さ
れたリードフレームとを有し、前記基板に搭載・
固定した半導体チツプの電極金属層および導体パ
ターンと前記各外部導出端子とを互いにリードフ
レームのまま位置を合わせて固着され、前記リー
ドフレームの不要部分が切除されるとともに、前
記外部導出端子を立ち上げて成る半導体装置。 A substrate on which a predetermined conductor pattern is formed and a semiconductor chip is mounted and fixed thereon, and a plurality of external lead-out terminals connected to the electrode metal layer of this semiconductor chip and the conductor pattern formed on the substrate and led out to the outside. All have a lead frame integrally formed via a connecting part, and are mounted on the board.
The electrode metal layer and conductor pattern of the fixed semiconductor chip and each of the external lead-out terminals are aligned and fixed to each other with the lead frame intact, unnecessary portions of the lead frame are removed, and the external lead-out terminals are set up. A semiconductor device consisting of
JP13119787U 1987-08-28 1987-08-28 Pending JPS6435754U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13119787U JPS6435754U (en) 1987-08-28 1987-08-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13119787U JPS6435754U (en) 1987-08-28 1987-08-28

Publications (1)

Publication Number Publication Date
JPS6435754U true JPS6435754U (en) 1989-03-03

Family

ID=31387038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13119787U Pending JPS6435754U (en) 1987-08-28 1987-08-28

Country Status (1)

Country Link
JP (1) JPS6435754U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5474372A (en) * 1977-10-27 1979-06-14 Amp Inc Lead frame and package for electrically connecting electronic parts

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5474372A (en) * 1977-10-27 1979-06-14 Amp Inc Lead frame and package for electrically connecting electronic parts

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