DE2861119D1 - Lead frame and package for establishing electrical connections to electronic components - Google Patents

Lead frame and package for establishing electrical connections to electronic components

Info

Publication number
DE2861119D1
DE2861119D1 DE7878300494T DE2861119T DE2861119D1 DE 2861119 D1 DE2861119 D1 DE 2861119D1 DE 7878300494 T DE7878300494 T DE 7878300494T DE 2861119 T DE2861119 T DE 2861119T DE 2861119 D1 DE2861119 D1 DE 2861119D1
Authority
DE
Germany
Prior art keywords
package
electronic components
lead frame
electrical connections
establishing electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE7878300494T
Other languages
English (en)
Inventor
Joseph Richard Keller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Application granted granted Critical
Publication of DE2861119D1 publication Critical patent/DE2861119D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE7878300494T 1977-10-27 1978-10-12 Lead frame and package for establishing electrical connections to electronic components Expired DE2861119D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/846,052 US4158745A (en) 1977-10-27 1977-10-27 Lead frame having integral terminal tabs

Publications (1)

Publication Number Publication Date
DE2861119D1 true DE2861119D1 (en) 1981-12-10

Family

ID=25296808

Family Applications (1)

Application Number Title Priority Date Filing Date
DE7878300494T Expired DE2861119D1 (en) 1977-10-27 1978-10-12 Lead frame and package for establishing electrical connections to electronic components

Country Status (7)

Country Link
US (1) US4158745A (de)
EP (1) EP0001892B1 (de)
JP (1) JPS5474372A (de)
CA (1) CA1106012A (de)
DE (1) DE2861119D1 (de)
ES (1) ES474519A1 (de)
IT (1) IT1100967B (de)

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US4266843A (en) * 1979-09-24 1981-05-12 The Bendix Corporation Insulation displacing electrical contact and method of making same
US4252864A (en) * 1979-11-05 1981-02-24 Amp Incorporated Lead frame having integral terminal tabs
US4339768A (en) * 1980-01-18 1982-07-13 Amp Incorporated Transistors and manufacture thereof
FR2495376A1 (fr) * 1980-12-02 1982-06-04 Thomson Csf Boitiers pour composants semiconducteurs de puissance a cosses de type faston
US4530003A (en) * 1981-02-02 1985-07-16 Motorola, Inc. Low-cost power device package with quick connect terminals and electrically isolated mounting means
FR2522203A1 (fr) * 1982-02-24 1983-08-26 Sintra Alcatel Sa Traversee electrique de boitier de circuit hybride et connecteurs complementaires
FR2527837A1 (fr) * 1982-05-25 1983-12-02 Thomson Csf Boitier d'encapsulation d'un dispositif semi-conducteur fonctionnant a tres haute tension, et son procede de fabrication
US4470648A (en) * 1982-12-27 1984-09-11 Ford Motor Company Interconnection construction to thick film substrate
US4630174A (en) * 1983-10-31 1986-12-16 Kaufman Lance R Circuit package with external circuit board and connection
US4611389A (en) * 1983-11-03 1986-09-16 Motorola, Inc. Low-cost power device package with quick-connect terminals and electrically isolated mounting means
FR2580137A1 (en) * 1985-04-05 1986-10-10 Omron Tateisi Electronics Co Assembly of electronic components
US4766520A (en) * 1986-12-05 1988-08-23 Capsonic Group, Inc. Injection molded circuit housing
US4897766A (en) * 1987-05-14 1990-01-30 Tdk Corporation Composite type circuit parts
JPS6435754U (de) * 1987-08-28 1989-03-03
US4846701A (en) * 1987-12-16 1989-07-11 Amp Incorporated Quick disconnect smart connector
US4879633A (en) * 1988-04-12 1989-11-07 Kaufman Lance R Direct bond circuit assembly with ground plane
US4868349A (en) * 1988-05-09 1989-09-19 National Semiconductor Corporation Plastic molded pin-grid-array power package
US4935803A (en) * 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
US5001545A (en) * 1988-09-09 1991-03-19 Motorola, Inc. Formed top contact for non-flat semiconductor devices
DE3839383A1 (de) * 1988-11-22 1990-05-23 Semikron Elektronik Gmbh Verfahren zum herstellen einer halbleiterbaueinheit und vorrichtung zur durchfuehrung des verfahrens
US5059746A (en) * 1989-05-01 1991-10-22 Amp Incorporated Housing assembly for electronic components
US5012391A (en) * 1989-08-17 1991-04-30 Amp Incorporated Molded electrical interconnection system
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
AU8519891A (en) * 1990-08-01 1992-03-02 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5804870A (en) * 1992-06-26 1998-09-08 Staktek Corporation Hermetically sealed integrated circuit lead-on package configuration
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
KR940016724A (ko) * 1992-12-03 1994-07-23 빈센트 비. 인그라시아 표면 실장형 집적 회로 파워 패키지용 리드 프레임 어셈블리
US6205654B1 (en) * 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5369056A (en) 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5410449A (en) * 1993-05-24 1995-04-25 Delco Electronics Corp. Heatsink conductor solder pad
US5686698A (en) * 1994-06-30 1997-11-11 Motorola, Inc. Package for electrical components having a molded structure with a port extending into the molded structure
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
FR2745954B1 (fr) * 1996-03-06 1999-10-22 Itt Composants Instr Bande metallique predecoupee pour la fabrication de composants electroniques, procede de fabrication de tels composants ainsi obtenus
US5945732A (en) 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US5867367A (en) * 1997-12-04 1999-02-02 Intel Corporation Quad flat pack integrated circuit package
US6091317A (en) * 1998-07-06 2000-07-18 Ford Motor Company Temperature sensor assembly
US6141219A (en) * 1998-12-23 2000-10-31 Sundstrand Corporation Modular power electronics die having integrated cooling apparatus
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US6462408B1 (en) * 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
DE112006004164B4 (de) * 2006-12-05 2017-04-06 Infineon Technologies Ag Integriertes Halbleiter-Outline-Gehäuse
DE102007051870A1 (de) * 2007-10-30 2009-05-07 Robert Bosch Gmbh Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses
JP4950862B2 (ja) * 2007-12-10 2012-06-13 矢崎総業株式会社 複合端子の製造方法
KR100983882B1 (ko) * 2008-07-07 2010-09-27 주식회사 뉴인텍 커패시터용 부스바 조립방법 및 그 제품
CN102196689A (zh) * 2010-03-19 2011-09-21 深圳富泰宏精密工业有限公司 便携式电子装置壳体
JP5734364B2 (ja) * 2012-11-22 2015-06-17 株式会社デンソー 電力変換装置
DE102015107657A1 (de) 2015-05-15 2016-12-01 Alanod Gmbh & Co. Kg Verfahren zur Herstellung eines Anschlussträgers, Anschlussträger sowie optoelektronisches Halbleiterbauteil mit einem Anschlussträger
TWI847482B (zh) 2017-06-13 2024-07-01 美商山姆科技公司 電纜線連接器
CN111095686B (zh) 2017-07-21 2023-02-03 申泰公司 具有闩锁的电连接器
USD964291S1 (en) 2017-07-21 2022-09-20 Samtec, Inc. Electrical connector
KR20200095470A (ko) * 2017-10-24 2020-08-10 샘텍, 인코포레이티드 직각 전기 커넥터 및 직각 커넥터용 전기 접점
USD896183S1 (en) 2018-01-08 2020-09-15 Samtec, Inc. Electrical cable connector
US10938136B2 (en) * 2018-05-29 2021-03-02 Avx Corporation Surface mounted card edge contact pair with pick-up carrier

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB785452A (en) * 1954-07-20 1957-10-30 Westinghouse Brake & Signal Improvements relating to sealed metal rectifier assemblies and methods of sealing such assemblies
US3258661A (en) * 1962-12-17 1966-06-28 Sealed semiconductor device
US3426252A (en) * 1966-05-03 1969-02-04 Bell Telephone Labor Inc Semiconductive device including beam leads
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting
US3597666A (en) * 1969-11-26 1971-08-03 Fairchild Camera Instr Co Lead frame design
US3650232A (en) * 1970-09-08 1972-03-21 Amp Inc Method and apparatus for manufacturing lead frames
US3778887A (en) * 1970-12-23 1973-12-18 Hitachi Ltd Electronic devices and method for manufacturing the same
US3736367A (en) * 1971-04-09 1973-05-29 Amp Inc Lead frames and method of making same
US3735017A (en) * 1971-04-12 1973-05-22 Amp Inc Lead frames and method of making same
US3821615A (en) * 1973-05-16 1974-06-28 Solitron Devices Long life lead frame means for semiconductor devices
JPS5245261A (en) * 1975-10-08 1977-04-09 Hitachi Ltd Electronic parts

Also Published As

Publication number Publication date
EP0001892A1 (de) 1979-05-16
CA1106012A (en) 1981-07-28
EP0001892B1 (de) 1981-09-23
IT7828700A0 (it) 1978-10-12
ES474519A1 (es) 1979-11-01
US4158745A (en) 1979-06-19
IT1100967B (it) 1985-09-28
JPS5474372A (en) 1979-06-14

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Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Free format text: SCHMITT-NILSON, G., DIPL.-ING. DR.-ING. HIRSCH, P., DIPL.-ING., PAT.-ANW., 8000 MUENCHEN

8328 Change in the person/name/address of the agent

Free format text: KLUNKER, H., DIPL.-ING. DR.RER.NAT. SCHMITT-NILSON, G., DIPL.-ING. DR.-ING. HIRSCH, P., DIPL.-ING., PAT.-ANW., 8000 MUENCHEN

8339 Ceased/non-payment of the annual fee