JPS5527604A - Electronic circuit package - Google Patents
Electronic circuit packageInfo
- Publication number
- JPS5527604A JPS5527604A JP9995878A JP9995878A JPS5527604A JP S5527604 A JPS5527604 A JP S5527604A JP 9995878 A JP9995878 A JP 9995878A JP 9995878 A JP9995878 A JP 9995878A JP S5527604 A JPS5527604 A JP S5527604A
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- circuit package
- package
- electronic
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9995878A JPS5527604A (en) | 1978-08-18 | 1978-08-18 | Electronic circuit package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9995878A JPS5527604A (en) | 1978-08-18 | 1978-08-18 | Electronic circuit package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5527604A true JPS5527604A (en) | 1980-02-27 |
Family
ID=14261189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9995878A Pending JPS5527604A (en) | 1978-08-18 | 1978-08-18 | Electronic circuit package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5527604A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59189658A (en) * | 1983-04-13 | 1984-10-27 | Nec Corp | Ceramic package and manufacture thereof |
JPS60181072U (en) * | 1984-05-12 | 1985-12-02 | イビデン株式会社 | Printed wiring board for chip mounting |
-
1978
- 1978-08-18 JP JP9995878A patent/JPS5527604A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59189658A (en) * | 1983-04-13 | 1984-10-27 | Nec Corp | Ceramic package and manufacture thereof |
JPS60181072U (en) * | 1984-05-12 | 1985-12-02 | イビデン株式会社 | Printed wiring board for chip mounting |
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