JPS59189658A - Ceramic package and manufacture thereof - Google Patents

Abstract

PURPOSE:To obtain a package characterized by easy manufacture and excellent heat radiation, by bonding a wiring substrate and a chip carrier by a heat conducting bonding material and fixing them, and soldering the part between electrodes. CONSTITUTION:On a ceramic wiring substrate 1, an electrode 11, which corresponds to an electrode 21 for connecting ceramic chip carrier 2, is formed. A heat conducting bonding material 4, wherein a material having excellent heat conductivity is kneaded as a filler, is applied to a region 3 corresponding to the bottom surface of the central part of the ceramic chip carrier 2. In order to fix the ceramic chip carrier 2 to be mounted through the heat conducting bonding material 4, the bonding electrode 21 and the corresponding electrode 11 are aligned, bonded, and fixed. Then, soldering 25 is performed, and electric connection is accomplished.

Description

DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD The present invention relates to a structure of a ceramic package mounting a ceramic chip carrier and a method for manufacturing the same.

Prior Art Referring to FIG. 1, this type of conventional ceramic package has a semiconductor integrated circuit 22 built into the cavity of a ceramic carrier 2 which has connection electrodes 21 on the bottom surface of the outer periphery, and thin wires 23 and bonding electrodes 24. It is connected to the connection electrode 21 via 7. The mounting on the wiring board 1 is carried out by soldering or the like to the electrodes 11 of the wiring board 1 corresponding to the connection electrodes 21 formed on the bottom surface of the outer periphery of the ceramic chip carrier 2. Therefore, a gap 31 exists between the central bottom surface 3 of the ceramic chip carrier 2 and the wiring board 1, and during soldering, flux residue and solder grains enter, making it difficult to remove them. As a result, these residues may reduce reliability, and due to the gap 31 between the casing and the gap 31, conduction of heat generated in the semiconductor integrated circuit 22 is caused by the connection electrodes 21 soldered on the outer periphery of the chip carrier 2. The signal is only transmitted through the wiring board IYC. Therefore, semiconductor integrated circuits with high thermal resistance and high power consumption have drawbacks such as insufficient heat dissipation, making it impossible to mount them.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned drawbacks and provide a ceramic cupcake that is easy to manufacture and has good heat dissipation properties, and a method for manufacturing the same.

Structure of the Invention The package of the present invention has a semiconductor integrated circuit mounted thereon.
The central bottom surface of the ceramic chip carrier, which has connection electrodes on the side bottom surface of the outer periphery, is adhered to the wiring board on which the ceramic chip carrier is mounted using a thermally conductive adhesive, and the connection electrodes are electrically connected by soldering. It is characterized by what it did.

In the method for manufacturing a ceramic package of the present invention, a step of applying a thermally conductive adhesive to a portion of a wiring board on which the ceramic chip carrier is mounted corresponding to the bottom surface of the central portion of the ceramic chip carrier; A process of aligning and gluing and fixing the carrier at a position corresponding to the connection electrode;
The method is characterized in that it includes a step of soldering between the fixed ceramic chip carrier and the connecting electrodes of the wiring board.

Embodiments of the Invention Next, the great invention will be described in detail with reference to the drawings. Referring to FIG. 2, one embodiment of the present invention is a ceramic chip carrier 2 having connection electrodes 21 on the bottom surface of the outer periphery.
．． and '[4] at a position corresponding to the connection electrode 21.
(Constructed of a ceramic wiring board 1 having poles 11?, the central bottom area 3 of the ceramic chip carrier 2 and the board 1 are bonded and fixed by a thermally conductive adhesive 4,
Connection electrodes 21 of ceramic chip carrier 2 and electrodes 11 of ceramic wiring board 1 are soldered with solder 25.

Next, a method for manufacturing a ceramic package according to the present invention will be explained.

Referring to FIG. 2(b), the ceramic chip carrier 2 has contact electrodes 21 on the bottom surface of the outer periphery.
On the ceramic wiring board 1 on which the chip carrier 2 is mounted, a wire @11 corresponding to the connection g4: @21 of the ceramic chip carrier 2 is formed.・↑Response・Area 3
Thermal conductive adhesive 4 kneaded as a material with good thermal conductivity such as silver powder or alumina powder can be used for screen printing, stamping, and dispensing. By what method is it applied?

Referring to FIG. 2(C), the ceramic chip carrier 2 to be mounted is fixed via the thermally conductive adhesive 4 applied to the ceramic wiring board 1. The connection electrodes 21 of the ceramic chip carrier 2 and the corresponding electrodes 11 of the ceramic wiring board 1 are aligned, bonded, and fixed.

Next, referring to FIG. 2(d), the ceramic chip carrier 2 aligned and adhesively fixed to the ceramic wiring board 1 is connected to the connecting electrode 21 of the ceramic wiring board 2 through solder 25. 1 electrode 11
are soldered to establish an electrical connection.

In this way, the thermally conductive adhesive 4 is inserted between the bottom surface of the central portion of the ceramic chip carrier 2 and the corresponding ceramic wiring board 1, and the ceramic chip carrier 2 is bonded and fixed.

As a result, during soldering, flux residue and solder particles do not enter, making cleaning easy and providing a strong connection against external stress. Furthermore, since the thermally conductive adhesive 4 is interposed between the ceramic chip carrier 2 and the ceramic wiring board 1, the thermal resistance from the semiconductor integrated circuit 22 to the ceramic wiring board 1 is reduced, and the semiconductor integrated circuit 22 is The generated heat is easily conducted to the ceramic wiring board IVc, allowing for good heat dissipation and the mounting of semiconductor integrated circuits with high power consumption.

Next, referring to FIG. 3, in a second embodiment of the present invention, ceramic chip carriers 2 and 2' are mounted on both sides of a ceramic wiring board 1 to achieve high density.

Both surfaces 10 and 1 of the ceramic wiring board 1 in this embodiment
Electrodes 11 and 11' corresponding to the ceramic chip carriers 2 and 2' having connection electrodes on the bottom surface of the outer periphery are formed at 0'.

First, referring to FIG. 3(a), a filler such as silver powder or alumina powder is applied to an area of one surface 10 of the ceramic wiring board 1 corresponding to the bottom surface of the central part of the ceramic chip carrier 2 to be mounted. The thermally conductive adhesive 4 is applied by a method such as screen printing or dispensing.

Referring to FIG. 3(b), on the other side 10' of the ceramic wiring board 1, a thermally conductive adhesive 4' is similarly applied to the area corresponding to the bottom surface of the central part of the ceramic chip carrier 2'. be done.

Next, referring to FIGS. 3(C) and 3(d), a ceramic chip carrier to be mounted is attached via thermally conductive adhesives 4 and 4' applied to both surfaces 10 and 10' of the ceramic wiring board 1. 2 and 2' are aligned between corresponding electrodes, and bonded and fixed. Note that here, the thermally conductive adhesives 4 and 4 are sequentially applied to one side 10.
and the other surface 10', and then the ceramic chip carriers 2 and 2' are bonded and fixed. A thermally conductive adhesive 4 is applied to one side 10, a ceramic chip carrier 2 is glued and fixed thereto, and then
A thermally conductive adhesive 4' may be applied to the other surface 10', and a ceramic chip carrier ada may be bonded and fixed thereto. Third
Referring to FIG. and electrical connections are made. In this way, since soldering is performed after adhering and fixing in advance, there is an advantage that solder reflow can be performed all at once. Although only the mounting of a ceramic chip carrier has been described here, chip capacitors, resistors, etc. mounted in general hybrid ICs can also be mounted in the same manner. Further, similar applications can be made to ceramic packages with different structures, and the present invention can also be implemented not only to ceramic chip carriers and ceramic wiring boards, but also to resin carriers, porcelain wiring boards, etc. be.

In the present invention, by bonding and fixing the wiring board and the chip carrier with a thermally conductive adhesive and soldering between the electrodes,
This has the advantage of being easy to manufacture and providing a package with good combustion dissipation.

[Brief explanation of the drawing]

FIG. 1 is a diagram partially showing a conventional example, FIG. 2 is a diagram showing a first embodiment of the present invention, and FIG. 3 is a diagram showing a second embodiment of the present invention. be. 1 to 3, 1...ceramic wiring board, 2, 2' ceramic chip carrier, 3...
...Central bottom view, 4, 4'...Thermal conductive adhesive, 10, 10'...Surface, 11, 11'
...Wiring, 21... Connection electrode, 22
... Semiconductor integrated circuit, 23 ... Thin wire,
24...Bonding electrode, 25.25'...
...Solder, 31...Gap.

Claims (1)

[Claims] 1. In a ceramic package equipped with a semiconductor integrated circuit mounted on a ceramic chip carrier having connection electrodes on the side bottom surface of the outer periphery, the central bottom surface of the ceramic chip carrier and the ceramic dip carrier 1. A ceramic package characterized in that the wiring board to be mounted is bonded to the wiring board using a thermally conductive adhesive, and the connection electrodes are electrically connected to each other by soldering. 2. In the method for manufacturing a ceramic package, the step of applying a thermally conductive adhesive to a portion of the wiring board on which the ceramic chip carrier is mounted, corresponding to the bottom surface of the central portion of the ceramic chip carrier; and for connecting the ceramic chip carrier. A method for manufacturing a ceramic package, comprising: aligning and adhesively fixing the ceramic chip carrier at a position corresponding to the electrode; and soldering between the aligned ceramic chip carrier and the connecting electrode of the wiring board.