FR2745954B1 - Bande metallique predecoupee pour la fabrication de composants electroniques, procede de fabrication de tels composants ainsi obtenus - Google Patents

Bande metallique predecoupee pour la fabrication de composants electroniques, procede de fabrication de tels composants ainsi obtenus

Info

Publication number
FR2745954B1
FR2745954B1 FR9602998A FR9602998A FR2745954B1 FR 2745954 B1 FR2745954 B1 FR 2745954B1 FR 9602998 A FR9602998 A FR 9602998A FR 9602998 A FR9602998 A FR 9602998A FR 2745954 B1 FR2745954 B1 FR 2745954B1
Authority
FR
France
Prior art keywords
components
metal strip
tongues
manufacture
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9602998A
Other languages
English (en)
Other versions
FR2745954A1 (fr
Inventor
Umberto Pascuttini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ITT Composants et Instruments SA
Original Assignee
ITT Composants et Instruments SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ITT Composants et Instruments SA filed Critical ITT Composants et Instruments SA
Priority to FR9602998A priority Critical patent/FR2745954B1/fr
Priority to EP19970103078 priority patent/EP0794571B9/fr
Priority to DE59704498T priority patent/DE59704498D1/de
Priority to KR1019970006144A priority patent/KR100483500B1/ko
Priority to SG1997000634A priority patent/SG64417A1/en
Priority to TW086102569A priority patent/TW335542B/zh
Priority to JP05216997A priority patent/JP3949769B2/ja
Publication of FR2745954A1 publication Critical patent/FR2745954A1/fr
Application granted granted Critical
Publication of FR2745954B1 publication Critical patent/FR2745954B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Packaging Frangible Articles (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR9602998A 1996-03-06 1996-03-06 Bande metallique predecoupee pour la fabrication de composants electroniques, procede de fabrication de tels composants ainsi obtenus Expired - Lifetime FR2745954B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR9602998A FR2745954B1 (fr) 1996-03-06 1996-03-06 Bande metallique predecoupee pour la fabrication de composants electroniques, procede de fabrication de tels composants ainsi obtenus
EP19970103078 EP0794571B9 (fr) 1996-03-06 1997-02-26 Bande métallique prédécoupée pour la fabrication de composants électroniques
DE59704498T DE59704498D1 (de) 1996-03-06 1997-02-26 Vorgestanztes Metallrahmenband zur Herstellung von elektronischen Bauelementen
KR1019970006144A KR100483500B1 (ko) 1996-03-06 1997-02-27 전자소자제조용프레임과,전자소자의제조방법및그전자소자
SG1997000634A SG64417A1 (en) 1996-03-06 1997-03-03 A frame for the fabrication of electronic components a fabrication method of such components and components obtained thereby
TW086102569A TW335542B (en) 1996-03-06 1997-03-04 A frame for fabrication of electronic components, a fabrication method of such components and components obtained thereby
JP05216997A JP3949769B2 (ja) 1996-03-06 1997-03-06 電子部品の組立のためのフレームと得られた部品と部品を組立てをするための過程

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9602998A FR2745954B1 (fr) 1996-03-06 1996-03-06 Bande metallique predecoupee pour la fabrication de composants electroniques, procede de fabrication de tels composants ainsi obtenus

Publications (2)

Publication Number Publication Date
FR2745954A1 FR2745954A1 (fr) 1997-09-12
FR2745954B1 true FR2745954B1 (fr) 1999-10-22

Family

ID=9490030

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9602998A Expired - Lifetime FR2745954B1 (fr) 1996-03-06 1996-03-06 Bande metallique predecoupee pour la fabrication de composants electroniques, procede de fabrication de tels composants ainsi obtenus

Country Status (7)

Country Link
EP (1) EP0794571B9 (fr)
JP (1) JP3949769B2 (fr)
KR (1) KR100483500B1 (fr)
DE (1) DE59704498D1 (fr)
FR (1) FR2745954B1 (fr)
SG (1) SG64417A1 (fr)
TW (1) TW335542B (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6358774B1 (en) * 1999-01-11 2002-03-19 U.S. Philips Corporation Method of manufacturing a semiconductor device
JP3602453B2 (ja) 2000-08-31 2004-12-15 Ｎｅｃエレクトロニクス株式会社 半導体装置
GB0213094D0 (en) * 2002-06-07 2002-07-17 Power Innovations Ltd Lead frame
CN1806328B (zh) * 2003-06-18 2010-07-28 Nxp股份有限公司 引线框架、包括引线框架的半导体器件的制造方法和设备
CN217280759U (zh) * 2022-04-08 2022-08-23 力特半导体（无锡）有限公司 小外形tvs封装结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4158745A (en) * 1977-10-27 1979-06-19 Amp Incorporated Lead frame having integral terminal tabs
US4616250A (en) * 1984-07-03 1986-10-07 Motorola, Inc. Contact assembly for small semiconductor device
JPS6235549A (ja) * 1985-08-08 1987-02-16 Mitsubishi Electric Corp 整流装置
JPH06101493B2 (ja) * 1986-03-28 1994-12-12 松下電器産業株式会社 プラスチツクチツプキヤリア
JPH0357251A (ja) * 1989-07-26 1991-03-12 Hitachi Ltd 半導体装置
US4994412A (en) * 1990-02-09 1991-02-19 Motorola Inc. Self-centering electrode for power devices
JPH05109978A (ja) * 1991-10-17 1993-04-30 Fujitsu Ltd 半導体装置
US5343072A (en) * 1990-08-20 1994-08-30 Rohm Co., Ltd. Method and leadframe for making electronic components
JPH0547835A (ja) * 1991-08-09 1993-02-26 Seiko Epson Corp 半導体装置の実装構造
KR930009029A (ko) * 1991-10-17 1993-05-22 김광호 Tab을 이용한 패키지

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SG64417A1 (en) 1999-04-27
JP3949769B2 (ja) 2007-07-25
EP0794571A1 (fr) 1997-09-10
EP0794571B9 (fr) 2002-08-07
KR970068051A (ko) 1997-10-13
KR100483500B1 (ko) 2006-05-04
DE59704498D1 (de) 2001-10-11
JPH104166A (ja) 1998-01-06
EP0794571B1 (fr) 2001-09-05
FR2745954A1 (fr) 1997-09-12
TW335542B (en) 1998-07-01

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