SG64417A1 - A frame for the fabrication of electronic components a fabrication method of such components and components obtained thereby - Google Patents
A frame for the fabrication of electronic components a fabrication method of such components and components obtained therebyInfo
- Publication number
- SG64417A1 SG64417A1 SG1997000634A SG1997000634A SG64417A1 SG 64417 A1 SG64417 A1 SG 64417A1 SG 1997000634 A SG1997000634 A SG 1997000634A SG 1997000634 A SG1997000634 A SG 1997000634A SG 64417 A1 SG64417 A1 SG 64417A1
- Authority
- SG
- Singapore
- Prior art keywords
- components
- fabrication
- tongues
- frame
- mounting
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 210000002105 tongue Anatomy 0.000 abstract 4
- 239000013078 crystal Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/3701—Shape
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- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/401—Disposition
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/85051—Forming additional members, e.g. for "wedge-on-ball", "ball-on-wedge", "ball-on-ball" connections
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L2924/1904—Component type
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Packaging Frangible Articles (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The frame (1) consists of two mounting strips (3,3') linked together at regular intervals with transverse segments (4) between which are provided co-planar tongues each formed as one piece with a lateral mounting strip. The tongues (5) and (5') of each pair face one another without touching, one having a free end section (6) forming a mounting for the semiconductor crystal (2'). The other tongue at the height of its free end (7) has a pre-punched metal strip connector (8) which can be bent over so that it is in contact with the semiconductor crystal. This strip is located in the volume defined by the planes which enclose the long edges of the tongues.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9602998A FR2745954B1 (en) | 1996-03-06 | 1996-03-06 | PRE-CUT METAL STRIP FOR THE MANUFACTURE OF ELECTRONIC COMPONENTS, METHOD FOR MANUFACTURING SUCH COMPONENTS THUS OBTAINED |
Publications (1)
Publication Number | Publication Date |
---|---|
SG64417A1 true SG64417A1 (en) | 1999-04-27 |
Family
ID=9490030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1997000634A SG64417A1 (en) | 1996-03-06 | 1997-03-03 | A frame for the fabrication of electronic components a fabrication method of such components and components obtained thereby |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0794571B9 (en) |
JP (1) | JP3949769B2 (en) |
KR (1) | KR100483500B1 (en) |
DE (1) | DE59704498D1 (en) |
FR (1) | FR2745954B1 (en) |
SG (1) | SG64417A1 (en) |
TW (1) | TW335542B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000042655A1 (en) * | 1999-01-11 | 2000-07-20 | Koninklijke Philips Electronics N.V. | Method of manufacturing a semiconductor device |
JP3602453B2 (en) | 2000-08-31 | 2004-12-15 | Necエレクトロニクス株式会社 | Semiconductor device |
GB0213094D0 (en) * | 2002-06-07 | 2002-07-17 | Power Innovations Ltd | Lead frame |
ATE498908T1 (en) * | 2003-06-18 | 2011-03-15 | Nxp Bv | METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE HAVING A CONDUCTOR FRAME AND DEVICE THEREFOR |
CN217280759U (en) * | 2022-04-08 | 2022-08-23 | 力特半导体(无锡)有限公司 | Small-shape TVS packaging structure |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4158745A (en) * | 1977-10-27 | 1979-06-19 | Amp Incorporated | Lead frame having integral terminal tabs |
US4616250A (en) * | 1984-07-03 | 1986-10-07 | Motorola, Inc. | Contact assembly for small semiconductor device |
JPS6235549A (en) * | 1985-08-08 | 1987-02-16 | Mitsubishi Electric Corp | Rectifier |
JPH06101493B2 (en) * | 1986-03-28 | 1994-12-12 | 松下電器産業株式会社 | Plastic chip carrier |
JPH0357251A (en) * | 1989-07-26 | 1991-03-12 | Hitachi Ltd | Semiconductor device |
US4994412A (en) * | 1990-02-09 | 1991-02-19 | Motorola Inc. | Self-centering electrode for power devices |
JPH05109978A (en) * | 1991-10-17 | 1993-04-30 | Fujitsu Ltd | Semiconductor device |
US5343072A (en) * | 1990-08-20 | 1994-08-30 | Rohm Co., Ltd. | Method and leadframe for making electronic components |
JPH0547835A (en) * | 1991-08-09 | 1993-02-26 | Seiko Epson Corp | Mounting structure of semiconductor device |
KR930009029A (en) * | 1991-10-17 | 1993-05-22 | 김광호 | Package with TAB |
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1996
- 1996-03-06 FR FR9602998A patent/FR2745954B1/en not_active Expired - Lifetime
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1997
- 1997-02-26 EP EP19970103078 patent/EP0794571B9/en not_active Expired - Lifetime
- 1997-02-26 DE DE59704498T patent/DE59704498D1/en not_active Expired - Lifetime
- 1997-02-27 KR KR1019970006144A patent/KR100483500B1/en not_active IP Right Cessation
- 1997-03-03 SG SG1997000634A patent/SG64417A1/en unknown
- 1997-03-04 TW TW086102569A patent/TW335542B/en not_active IP Right Cessation
- 1997-03-06 JP JP05216997A patent/JP3949769B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW335542B (en) | 1998-07-01 |
EP0794571B1 (en) | 2001-09-05 |
EP0794571A1 (en) | 1997-09-10 |
JPH104166A (en) | 1998-01-06 |
FR2745954B1 (en) | 1999-10-22 |
KR100483500B1 (en) | 2006-05-04 |
EP0794571B9 (en) | 2002-08-07 |
JP3949769B2 (en) | 2007-07-25 |
FR2745954A1 (en) | 1997-09-12 |
KR970068051A (en) | 1997-10-13 |
DE59704498D1 (en) | 2001-10-11 |
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