IT202200006356A1 - Sistema di test per il test ad alta tensione ed alta corrente su una pluralità di dispositivi a semiconduttore di potenza compresi in un wafer, e sistema di contattazione - Google Patents

Sistema di test per il test ad alta tensione ed alta corrente su una pluralità di dispositivi a semiconduttore di potenza compresi in un wafer, e sistema di contattazione Download PDF

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Publication number
IT202200006356A1
IT202200006356A1 IT102022000006356A IT202200006356A IT202200006356A1 IT 202200006356 A1 IT202200006356 A1 IT 202200006356A1 IT 102022000006356 A IT102022000006356 A IT 102022000006356A IT 202200006356 A IT202200006356 A IT 202200006356A IT 202200006356 A1 IT202200006356 A1 IT 202200006356A1
Authority
IT
Italy
Prior art keywords
wafer
semiconductor devices
power semiconductor
devices included
current testing
Prior art date
Application number
IT102022000006356A
Other languages
English (en)
Inventor
Marco Marcinnò
Carlo Cianferotti
Original Assignee
Crea Collaudi Elettr Automatizzati S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Crea Collaudi Elettr Automatizzati S R L filed Critical Crea Collaudi Elettr Automatizzati S R L
Priority to IT102022000006356A priority Critical patent/IT202200006356A1/it
Priority to PCT/IB2023/053180 priority patent/WO2023187701A1/en
Publication of IT202200006356A1 publication Critical patent/IT202200006356A1/it

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IT102022000006356A 2022-03-31 2022-03-31 Sistema di test per il test ad alta tensione ed alta corrente su una pluralità di dispositivi a semiconduttore di potenza compresi in un wafer, e sistema di contattazione IT202200006356A1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT102022000006356A IT202200006356A1 (it) 2022-03-31 2022-03-31 Sistema di test per il test ad alta tensione ed alta corrente su una pluralità di dispositivi a semiconduttore di potenza compresi in un wafer, e sistema di contattazione
PCT/IB2023/053180 WO2023187701A1 (en) 2022-03-31 2023-03-30 Test system for high-voltage and high-current testing on a plurality of power semiconductor devices comprised in a wafer, and contacting system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102022000006356A IT202200006356A1 (it) 2022-03-31 2022-03-31 Sistema di test per il test ad alta tensione ed alta corrente su una pluralità di dispositivi a semiconduttore di potenza compresi in un wafer, e sistema di contattazione

Publications (1)

Publication Number Publication Date
IT202200006356A1 true IT202200006356A1 (it) 2023-10-01

Family

ID=82385606

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102022000006356A IT202200006356A1 (it) 2022-03-31 2022-03-31 Sistema di test per il test ad alta tensione ed alta corrente su una pluralità di dispositivi a semiconduttore di potenza compresi in un wafer, e sistema di contattazione

Country Status (2)

Country Link
IT (1) IT202200006356A1 (it)
WO (1) WO2023187701A1 (it)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4482061B2 (ja) * 2008-08-19 2010-06-16 パナソニック株式会社 半導体素子の耐圧測定装置および耐圧測定方法
EP2546668A1 (en) * 2010-03-12 2013-01-16 Tokyo Electron Limited Probe apparatus
US20150241472A1 (en) * 2014-02-25 2015-08-27 Cascade Microtech, Inc. Systems and methods for on-wafer dynamic testing of electronic devices
WO2021240431A1 (en) 2020-05-27 2021-12-02 Crea Collaudi Elettronici Automatizzati S.R.L. Safety system for needle probe card for high-voltage and high-current test on power semiconductor devices, related test machine and corresponding testing method
US20220034956A1 (en) * 2020-08-03 2022-02-03 Chroma Ate Inc. Wafer inspection system and wafer inspection equipment thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4482061B2 (ja) * 2008-08-19 2010-06-16 パナソニック株式会社 半導体素子の耐圧測定装置および耐圧測定方法
EP2546668A1 (en) * 2010-03-12 2013-01-16 Tokyo Electron Limited Probe apparatus
US20150241472A1 (en) * 2014-02-25 2015-08-27 Cascade Microtech, Inc. Systems and methods for on-wafer dynamic testing of electronic devices
WO2021240431A1 (en) 2020-05-27 2021-12-02 Crea Collaudi Elettronici Automatizzati S.R.L. Safety system for needle probe card for high-voltage and high-current test on power semiconductor devices, related test machine and corresponding testing method
US20220034956A1 (en) * 2020-08-03 2022-02-03 Chroma Ate Inc. Wafer inspection system and wafer inspection equipment thereof

Also Published As

Publication number Publication date
WO2023187701A1 (en) 2023-10-05

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