IT201700017037A1 - Scheda di misura per applicazioni ad alta frequenza - Google Patents
Scheda di misura per applicazioni ad alta frequenzaInfo
- Publication number
- IT201700017037A1 IT201700017037A1 IT102017000017037A IT201700017037A IT201700017037A1 IT 201700017037 A1 IT201700017037 A1 IT 201700017037A1 IT 102017000017037 A IT102017000017037 A IT 102017000017037A IT 201700017037 A IT201700017037 A IT 201700017037A IT 201700017037 A1 IT201700017037 A1 IT 201700017037A1
- Authority
- IT
- Italy
- Prior art keywords
- contact
- flexible membrane
- measurement
- measurement board
- elements
- Prior art date
Links
- 238000005259 measurement Methods 0.000 title claims description 87
- 239000012528 membrane Substances 0.000 claims description 116
- 238000012360 testing method Methods 0.000 claims description 28
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 239000010948 rhodium Substances 0.000 claims description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 3
- 229910001260 Pt alloy Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 230000001419 dependent effect Effects 0.000 claims 1
- 239000000523 sample Substances 0.000 description 46
- 235000012431 wafers Nutrition 0.000 description 10
- 238000013016 damping Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- 101150101918 TSC22D3 gene Proteins 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Reinforced Plastic Materials (AREA)
- Medicinal Preparation (AREA)
Priority Applications (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT102017000017037A IT201700017037A1 (it) | 2017-02-15 | 2017-02-15 | Scheda di misura per applicazioni ad alta frequenza |
| PCT/EP2018/053615 WO2018149847A1 (en) | 2017-02-15 | 2018-02-14 | Probe card for high-frequency applications |
| KR1020197026853A KR102522524B1 (ko) | 2017-02-15 | 2018-02-14 | 고주파수 어플리케이션을 위한 프로브 카드 |
| SG11201907121WA SG11201907121WA (en) | 2017-02-15 | 2018-02-14 | Probe card for high-frequency applications |
| MYPI2019004499A MY195983A (en) | 2017-02-15 | 2018-02-14 | Probe Card For High-Frequency Applications |
| TW107105487A TWI703329B (zh) | 2017-02-15 | 2018-02-14 | 供高頻應用的探針卡 |
| JP2019543287A JP7306993B2 (ja) | 2017-02-15 | 2018-02-14 | 高周波用途用のプローブカード |
| EP18708599.8A EP3583431A1 (en) | 2017-02-15 | 2018-02-14 | Probe card for high-frequency applications |
| CN201880011726.1A CN110291407B (zh) | 2017-02-15 | 2018-02-14 | 一种用于高频应用的探针卡 |
| US16/537,727 US11112431B2 (en) | 2017-02-15 | 2019-08-12 | Probe card for high-frequency applications |
| PH12019501889A PH12019501889A1 (en) | 2017-02-15 | 2019-08-14 | Probe card for high-frequency applications |
| JP2023059695A JP2023085418A (ja) | 2017-02-15 | 2023-04-03 | 高周波用途用のプローブカード |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT102017000017037A IT201700017037A1 (it) | 2017-02-15 | 2017-02-15 | Scheda di misura per applicazioni ad alta frequenza |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT201700017037A1 true IT201700017037A1 (it) | 2018-08-15 |
Family
ID=59579801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT102017000017037A IT201700017037A1 (it) | 2017-02-15 | 2017-02-15 | Scheda di misura per applicazioni ad alta frequenza |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US11112431B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP3583431A1 (cg-RX-API-DMAC7.html) |
| JP (2) | JP7306993B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102522524B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN110291407B (cg-RX-API-DMAC7.html) |
| IT (1) | IT201700017037A1 (cg-RX-API-DMAC7.html) |
| MY (1) | MY195983A (cg-RX-API-DMAC7.html) |
| PH (1) | PH12019501889A1 (cg-RX-API-DMAC7.html) |
| SG (1) | SG11201907121WA (cg-RX-API-DMAC7.html) |
| TW (1) | TWI703329B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2018149847A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT201700017037A1 (it) * | 2017-02-15 | 2018-08-15 | Technoprobe Spa | Scheda di misura per applicazioni ad alta frequenza |
| CN108241078B (zh) * | 2017-05-18 | 2020-06-02 | 苏州韬盛电子科技有限公司 | 垂直探针卡 |
| KR102066678B1 (ko) * | 2019-10-30 | 2020-01-15 | 김재길 | 범프필름 타입 프로브카드 |
| IT201900024964A1 (it) * | 2019-12-20 | 2021-06-20 | Technoprobe Spa | Testa di misura per applicazioni a ridotto pitch |
| CN113433360B (zh) * | 2020-03-23 | 2023-12-01 | 奥特斯(中国)有限公司 | 测试适配器、测试设备和测试部件承载件的方法 |
| KR102307942B1 (ko) * | 2020-07-13 | 2021-10-01 | 양진석 | 반도체 소자 검사 장치 |
| CN112305395B (zh) * | 2020-11-06 | 2021-05-28 | 法特迪精密科技（苏州）有限公司 | 一种探针结构及其安装方法、闭路方法、抗干扰方法 |
| TWI784439B (zh) * | 2021-03-12 | 2022-11-21 | 冠銓科技實業股份有限公司 | 應用於高頻量測之測試針座構造 |
| JP7766290B2 (ja) * | 2021-03-26 | 2025-11-10 | 石福金属興業株式会社 | プローブピン用合金材料 |
| US11714105B2 (en) * | 2021-03-30 | 2023-08-01 | Enplas Corporation | Socket and inspection socket |
| KR102309675B1 (ko) * | 2021-07-30 | 2021-10-07 | 김재길 | 필름 형태의 프로브카드 |
| JP7795316B2 (ja) * | 2021-09-27 | 2026-01-07 | 株式会社ヨコオ | コンタクトユニット及び検査治具 |
| KR102450658B1 (ko) * | 2022-09-01 | 2022-10-06 | 윌테크놀러지(주) | 니들유닛의 팁 길이조절이 용이한 니들블럭 |
| KR102847367B1 (ko) * | 2022-10-20 | 2025-08-18 | 주식회사 에이엠에스티 | 프로브 카드 제작 방법 |
| IT202400003139A1 (it) * | 2024-02-14 | 2025-08-14 | Technoprobe Spa | Scheda di misura per applicazioni ad elevata frequenza |
| KR102913907B1 (ko) * | 2024-06-10 | 2026-01-19 | (주)위드멤스 | 피검사체의 전기적 특성을 프로빙하는 프로브 카드 어셈블리 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040036493A1 (en) * | 2002-05-08 | 2004-02-26 | Miller Charles A. | High performance probe system |
| US20040046579A1 (en) * | 2002-05-08 | 2004-03-11 | Formfactor, Inc. | High performance probe system |
| US20040070413A1 (en) * | 2002-10-02 | 2004-04-15 | Susumu Kasukabe | Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method |
| US20080061808A1 (en) * | 2006-09-12 | 2008-03-13 | Sammy Mok | Compliance partitioning in testing of integrated circuits |
| US20090042323A1 (en) * | 2007-08-07 | 2009-02-12 | Susumu Kasukabe | Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device |
| US20090212798A1 (en) * | 2008-02-27 | 2009-08-27 | Susumu Kasukabe | Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device |
| US20150192609A1 (en) * | 2014-01-09 | 2015-07-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Membrane Probe Card |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3046498B2 (ja) * | 1994-06-09 | 2000-05-29 | 日東電工株式会社 | プローブ |
| JPH0936188A (ja) * | 1995-07-14 | 1997-02-07 | Tokyo Electron Ltd | プローブ装置に用いられるプローブカードデバイス |
| TW369601B (en) * | 1997-06-17 | 1999-09-11 | Advantest Corp | Probe card |
| CN1276259C (zh) * | 1998-12-02 | 2006-09-20 | 佛姆法克特股份有限公司 | 光刻接触元件 |
| US6759861B2 (en) * | 2002-07-30 | 2004-07-06 | Intel Corporation | Thin film probe card contact drive system |
| JP2004144742A (ja) * | 2002-10-02 | 2004-05-20 | Renesas Technology Corp | プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法 |
| TWI255520B (en) * | 2003-05-01 | 2006-05-21 | Celerity Res Inc | Device probing using a matching device |
| US7368927B2 (en) * | 2004-07-07 | 2008-05-06 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
| US7129730B2 (en) * | 2004-12-15 | 2006-10-31 | Chipmos Technologies (Bermuda) Ltd. | Probe card assembly |
| JP2008311071A (ja) * | 2007-06-14 | 2008-12-25 | Alps Electric Co Ltd | 電子部品用ソケット |
| KR20090019384A (ko) * | 2007-08-21 | 2009-02-25 | 주식회사 세지 | 반도체 웨이퍼 검사용 프로브카드 |
| TWI431278B (zh) * | 2008-07-01 | 2014-03-21 | Taiwan Semiconductor Mfg | 半導體測試探針卡空間變換器的製造方法 |
| JP2010175371A (ja) * | 2009-01-29 | 2010-08-12 | Yokowo Co Ltd | 検査ソケット |
| JP2011038930A (ja) * | 2009-08-12 | 2011-02-24 | Renesas Electronics Corp | プローブカード及び被検査装置のテスト方法 |
| JP2011163807A (ja) * | 2010-02-05 | 2011-08-25 | Advantest Corp | 電子部品試験装置 |
| JP2011242377A (ja) * | 2010-05-19 | 2011-12-01 | Kimoto Gunsei | プローブ |
| TW201316014A (zh) * | 2011-10-12 | 2013-04-16 | Advantest Corp | 測試裝置、測試方法以及裝置介面 |
| US10359447B2 (en) * | 2012-10-31 | 2019-07-23 | Formfactor, Inc. | Probes with spring mechanisms for impeding unwanted movement in guide holes |
| CN105531593B (zh) * | 2013-05-06 | 2019-05-03 | 佛姆法克特股份有限公司 | 用于测试电子器件的探针卡组件 |
| EP3019879A4 (en) * | 2013-07-11 | 2017-08-16 | JohnsTech International Corporation | Testing apparatus and method for microcircuit and wafer level ic testing |
| JP2018503805A (ja) * | 2014-12-04 | 2018-02-08 | テクノプローベ エス．ピー．エー． | 垂直プローブを含むテストヘッド |
| JP6721302B2 (ja) * | 2015-08-10 | 2020-07-15 | 東京特殊電線株式会社 | 両面回路基板の検査装置 |
| IT201700017037A1 (it) * | 2017-02-15 | 2018-08-15 | Technoprobe Spa | Scheda di misura per applicazioni ad alta frequenza |
| IT201700017061A1 (it) * | 2017-02-15 | 2018-08-15 | Technoprobe Spa | Scheda di misura perfezionata per applicazioni ad alta frequenza |
-
2017
- 2017-02-15 IT IT102017000017037A patent/IT201700017037A1/it unknown
-
2018
- 2018-02-14 KR KR1020197026853A patent/KR102522524B1/ko active Active
- 2018-02-14 JP JP2019543287A patent/JP7306993B2/ja active Active
- 2018-02-14 CN CN201880011726.1A patent/CN110291407B/zh active Active
- 2018-02-14 TW TW107105487A patent/TWI703329B/zh active
- 2018-02-14 MY MYPI2019004499A patent/MY195983A/en unknown
- 2018-02-14 EP EP18708599.8A patent/EP3583431A1/en not_active Withdrawn
- 2018-02-14 WO PCT/EP2018/053615 patent/WO2018149847A1/en not_active Ceased
- 2018-02-14 SG SG11201907121WA patent/SG11201907121WA/en unknown
-
2019
- 2019-08-12 US US16/537,727 patent/US11112431B2/en not_active Expired - Fee Related
- 2019-08-14 PH PH12019501889A patent/PH12019501889A1/en unknown
-
2023
- 2023-04-03 JP JP2023059695A patent/JP2023085418A/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040036493A1 (en) * | 2002-05-08 | 2004-02-26 | Miller Charles A. | High performance probe system |
| US20040046579A1 (en) * | 2002-05-08 | 2004-03-11 | Formfactor, Inc. | High performance probe system |
| US20040070413A1 (en) * | 2002-10-02 | 2004-04-15 | Susumu Kasukabe | Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method |
| US20080061808A1 (en) * | 2006-09-12 | 2008-03-13 | Sammy Mok | Compliance partitioning in testing of integrated circuits |
| US20090042323A1 (en) * | 2007-08-07 | 2009-02-12 | Susumu Kasukabe | Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device |
| US20090212798A1 (en) * | 2008-02-27 | 2009-08-27 | Susumu Kasukabe | Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device |
| US20150192609A1 (en) * | 2014-01-09 | 2015-07-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Membrane Probe Card |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3583431A1 (en) | 2019-12-25 |
| US11112431B2 (en) | 2021-09-07 |
| SG11201907121WA (en) | 2019-09-27 |
| JP2023085418A (ja) | 2023-06-20 |
| KR20190112155A (ko) | 2019-10-02 |
| US20190361050A1 (en) | 2019-11-28 |
| CN110291407B (zh) | 2022-06-07 |
| MY195983A (en) | 2023-02-27 |
| TWI703329B (zh) | 2020-09-01 |
| CN110291407A (zh) | 2019-09-27 |
| WO2018149847A1 (en) | 2018-08-23 |
| KR102522524B1 (ko) | 2023-04-14 |
| JP2020507771A (ja) | 2020-03-12 |
| JP7306993B2 (ja) | 2023-07-11 |
| PH12019501889A1 (en) | 2020-07-06 |
| TW201831909A (zh) | 2018-09-01 |
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