SG11201907121WA - Probe card for high-frequency applications - Google Patents
Probe card for high-frequency applicationsInfo
- Publication number
- SG11201907121WA SG11201907121WA SG11201907121WA SG11201907121WA SG11201907121WA SG 11201907121W A SG11201907121W A SG 11201907121WA SG 11201907121W A SG11201907121W A SG 11201907121WA SG 11201907121W A SG11201907121W A SG 11201907121WA SG 11201907121W A SG11201907121W A SG 11201907121WA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- probe card
- flexible membrane
- end portion
- support plate
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Geometry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Reinforced Plastic Materials (AREA)
- Medicinal Preparation (AREA)
Abstract
H26 21' 24A 20 26 5B 25B 25 28 25A FIG. 2A 21 29 1-1 N cc 00 O O (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 23 August 2018 (23.08.2018) WIPO I PCT onion °nolo olomin mo Holum° oimIE (10) International Publication Number WO 2018/149847 Al (51) International Patent Classification: G01R 1/073 (2006.01) G01R 1/067 (2006.01) GO1R 31/28 (2006.01) (21) International Application Number: PCT/EP2018/053615 (22) International Filing Date: 14 February 2018 (14.02.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 102017000017037 15 February 2017 (15.02.2017) IT (71) Applicant: TECHNOPROBE S.P.A. [IT/IT]; Via Cava- lieri di Vittorio Veneto, 2, 23870 Cernusco Lombardone (Lecco) (IT). (72) Inventor: FELICI, Stefano; c/o TECHNOPROBE S.p.A., Via Cavalieri di Vittorio Veneto, 2, 23870 Cernusco Lom- bardone (Lecco) (IT). (74) Agent: FERRARI, Barbara; BOTTI & FERRARI S.r.1., Via Cappellini, 11, 20124 Milano (IT). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (54) Title: PROBE CARD FOR HIGH-FREQUENCY APPLICATIONS (57) : A probe card (20) of a testing apparatus of electronic devices comprises a testing head (21), which houses a plurality of contact elements (22) extending along a longitudinal axis (H-H) between a first end portion (24A) and a second end portion (24B), a support plate (23), onto which said first end portion (24A) is adapted to abut, and a flexible membrane (25). Suitably, the testing head (21) is arranged between the support plate (23) and a first portion (25A) of the flexible membrane (25), which is connected to the support plate (23) through a second portion (25B) thereof, the probe card (20) further comprising a plurality of contact tips (27) arranged on a first face (F1) of the flexible membrane (25) at the first portion (25A) thereof, the second end portion (24B) of each contact element (22) being apt to abut onto a second face (F2) of the flexible membrane (25), opposite to the first face (F1), the number and distribution of the contact elements (22) being different to the number and distribution of the contact tips (27). [Continued on next page] WO 2018/149847 Al MIDEDIMOMMIDIREEMOMMEHHEMOHMEHOIS (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: — of inventorship (Rule 4.17(iv)) Published: — with international search report (Art. 21(3))
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000017037A IT201700017037A1 (en) | 2017-02-15 | 2017-02-15 | Measurement board for high frequency applications |
PCT/EP2018/053615 WO2018149847A1 (en) | 2017-02-15 | 2018-02-14 | Probe card for high-frequency applications |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201907121WA true SG11201907121WA (en) | 2019-09-27 |
Family
ID=59579801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201907121WA SG11201907121WA (en) | 2017-02-15 | 2018-02-14 | Probe card for high-frequency applications |
Country Status (11)
Country | Link |
---|---|
US (1) | US11112431B2 (en) |
EP (1) | EP3583431A1 (en) |
JP (2) | JP7306993B2 (en) |
KR (1) | KR102522524B1 (en) |
CN (1) | CN110291407B (en) |
IT (1) | IT201700017037A1 (en) |
MY (1) | MY195983A (en) |
PH (1) | PH12019501889A1 (en) |
SG (1) | SG11201907121WA (en) |
TW (1) | TWI703329B (en) |
WO (1) | WO2018149847A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108241078B (en) * | 2017-05-18 | 2020-06-02 | 苏州韬盛电子科技有限公司 | Vertical probe card |
KR102066678B1 (en) * | 2019-10-30 | 2020-01-15 | 김재길 | Bump film type probe card |
IT201900024964A1 (en) * | 2019-12-20 | 2021-06-20 | Technoprobe Spa | Measuring head for low pitch applications |
CN113433360B (en) * | 2020-03-23 | 2023-12-01 | 奥特斯(中国)有限公司 | Test adapter, test apparatus and method of testing a component carrier |
KR102307942B1 (en) * | 2020-07-13 | 2021-10-01 | 양진석 | Apparatus for testing a semiconductor device |
CN112305395B (en) * | 2020-11-06 | 2021-05-28 | 法特迪精密科技(苏州)有限公司 | Probe structure and installation method, closed circuit method and anti-interference method thereof |
TWI784439B (en) * | 2021-03-12 | 2022-11-21 | 冠銓科技實業股份有限公司 | Test needle seat structure for high frequency measurement |
US11714105B2 (en) * | 2021-03-30 | 2023-08-01 | Enplas Corporation | Socket and inspection socket |
KR102309675B1 (en) * | 2021-07-30 | 2021-10-07 | 김재길 | Probe card in film type |
JP2023047464A (en) * | 2021-09-27 | 2023-04-06 | 株式会社ヨコオ | Contact unit and inspection jig |
KR102450658B1 (en) * | 2022-09-01 | 2022-10-06 | 윌테크놀러지(주) | Needle block for easy adjustment of length of needle unit tip |
KR20240055555A (en) * | 2022-10-20 | 2024-04-29 | 주식회사 에이엠에스티 | Manufacturing method for probe card |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3046498B2 (en) * | 1994-06-09 | 2000-05-29 | 日東電工株式会社 | probe |
JPH0936188A (en) * | 1995-07-14 | 1997-02-07 | Tokyo Electron Ltd | Probe card device for probe device |
TW369601B (en) * | 1997-06-17 | 1999-09-11 | Advantest Corp | Probe card |
DE69908638T2 (en) * | 1998-12-02 | 2004-04-29 | Formfactor, Inc., Livermore | Lithographic Contact Structures |
US6965244B2 (en) * | 2002-05-08 | 2005-11-15 | Formfactor, Inc. | High performance probe system |
US6911835B2 (en) * | 2002-05-08 | 2005-06-28 | Formfactor, Inc. | High performance probe system |
US6759861B2 (en) * | 2002-07-30 | 2004-07-06 | Intel Corporation | Thin film probe card contact drive system |
JP2004144742A (en) * | 2002-10-02 | 2004-05-20 | Renesas Technology Corp | Probe sheet, probe card, semiconductor inspection apparatus, and method for manufacturing semiconductor device |
TWI236723B (en) * | 2002-10-02 | 2005-07-21 | Renesas Tech Corp | Probe sheet, probe card, semiconductor inspection device, and manufacturing method for semiconductor device |
TWI255520B (en) * | 2003-05-01 | 2006-05-21 | Celerity Res Inc | Device probing using a matching device |
DE202005021386U1 (en) * | 2004-07-07 | 2007-11-29 | Cascade Microtech, Inc., Beaverton | Probe with a sensor with membrane suspension |
US7129730B2 (en) * | 2004-12-15 | 2006-10-31 | Chipmos Technologies (Bermuda) Ltd. | Probe card assembly |
WO2008033428A2 (en) * | 2006-09-12 | 2008-03-20 | Innoconnex, Inc. | Compliance partitioning in testing of integrated circuits |
JP2008311071A (en) * | 2007-06-14 | 2008-12-25 | Alps Electric Co Ltd | Socket for electronic component |
JP5049694B2 (en) * | 2007-08-07 | 2012-10-17 | ルネサスエレクトロニクス株式会社 | Probe card, semiconductor inspection apparatus, and semiconductor device manufacturing method |
KR20090019384A (en) * | 2007-08-21 | 2009-02-25 | 주식회사 세지 | Probe card of semiconductor wafer inspector |
JP2009204393A (en) * | 2008-02-27 | 2009-09-10 | Renesas Technology Corp | Probe card, method for manufacturing probe card, semiconductor inspection apparatus and method for manufacturing semiconductor device |
TWI431278B (en) * | 2008-07-01 | 2014-03-21 | Taiwan Semiconductor Mfg | Semiconductor test probe card space transformer |
JP2010175371A (en) * | 2009-01-29 | 2010-08-12 | Yokowo Co Ltd | Inspection socket |
JP2011038930A (en) * | 2009-08-12 | 2011-02-24 | Renesas Electronics Corp | Probe card and test method of device to be inspected |
JP2011163807A (en) * | 2010-02-05 | 2011-08-25 | Advantest Corp | Electronic component testing device |
JP2011242377A (en) * | 2010-05-19 | 2011-12-01 | Kimoto Gunsei | Probe |
TW201316014A (en) * | 2011-10-12 | 2013-04-16 | Advantest Corp | Testing apparatus, testing method and apparatus interface thereof |
US10359447B2 (en) * | 2012-10-31 | 2019-07-23 | Formfactor, Inc. | Probes with spring mechanisms for impeding unwanted movement in guide holes |
US9588139B2 (en) * | 2013-05-06 | 2017-03-07 | Formfactor, Inc. | Probe card assembly for testing electronic devices |
MY174175A (en) * | 2013-07-11 | 2020-03-12 | Johnstech Int Corporation | Testing apparatus and method for microcircuit and wafer level ic testing |
US9709599B2 (en) * | 2014-01-09 | 2017-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Membrane probe card |
TW201625962A (en) * | 2014-12-04 | 2016-07-16 | 技術探測股份有限公司 | Testing head comprising vertical probes |
JP6721302B2 (en) * | 2015-08-10 | 2020-07-15 | 東京特殊電線株式会社 | Double-sided circuit board inspection device |
IT201700017061A1 (en) * | 2017-02-15 | 2018-08-15 | Technoprobe Spa | Improved measurement card for high frequency applications |
-
2017
- 2017-02-15 IT IT102017000017037A patent/IT201700017037A1/en unknown
-
2018
- 2018-02-14 EP EP18708599.8A patent/EP3583431A1/en active Pending
- 2018-02-14 TW TW107105487A patent/TWI703329B/en active
- 2018-02-14 CN CN201880011726.1A patent/CN110291407B/en active Active
- 2018-02-14 WO PCT/EP2018/053615 patent/WO2018149847A1/en active Search and Examination
- 2018-02-14 KR KR1020197026853A patent/KR102522524B1/en active IP Right Grant
- 2018-02-14 JP JP2019543287A patent/JP7306993B2/en active Active
- 2018-02-14 SG SG11201907121WA patent/SG11201907121WA/en unknown
- 2018-02-14 MY MYPI2019004499A patent/MY195983A/en unknown
-
2019
- 2019-08-12 US US16/537,727 patent/US11112431B2/en active Active
- 2019-08-14 PH PH12019501889A patent/PH12019501889A1/en unknown
-
2023
- 2023-04-03 JP JP2023059695A patent/JP2023085418A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
IT201700017037A1 (en) | 2018-08-15 |
US11112431B2 (en) | 2021-09-07 |
PH12019501889A1 (en) | 2020-07-06 |
WO2018149847A1 (en) | 2018-08-23 |
TWI703329B (en) | 2020-09-01 |
JP2023085418A (en) | 2023-06-20 |
MY195983A (en) | 2023-02-27 |
EP3583431A1 (en) | 2019-12-25 |
TW201831909A (en) | 2018-09-01 |
CN110291407B (en) | 2022-06-07 |
JP7306993B2 (en) | 2023-07-11 |
CN110291407A (en) | 2019-09-27 |
KR20190112155A (en) | 2019-10-02 |
KR102522524B1 (en) | 2023-04-14 |
JP2020507771A (en) | 2020-03-12 |
US20190361050A1 (en) | 2019-11-28 |
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