JP2008311071A - Socket for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact socket for electronic components capable of retaining electronic components of different sizes, without damaging them. <P>SOLUTION: When an electronic component 1 is retained, a movable lever 13 moves horizontally from a second position (ii) in a retreated state to a first position (i) in a retention state, and thereafter it moves in a vertically downward direction and takes on a reverse route in releasing the retention of the electronic component. The movable lever 13 presses as well as releases it in moving in a vertical direction toward a top face of the electronic component 1, so that the occurrence of contact traces due to sliding on a top face of the electronic component 1 can be prevented. Moreover, since nearly a center part of the electronic component 1 can be retained, even an electronic component 1 with a different size can be retained. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a socket for an electronic component mounted on a burn-in board, and particularly an electronic component socket that prevents a scratch such as a contact mark from being formed on the upper surface of the electronic component when holding the electronic component. About.

  2. Description of the Related Art Conventionally, in a burn-in apparatus that performs a semiconductor thermal cycle test, a plurality of sockets that hold a semiconductor to be tested are mounted on the burn-in board. A pair of rotation latch levers are provided on the left and right sides of the socket. When the IC is mounted in the central opening of the frame frame, the pair of rotation latch levers rotate according to the elasticity of the spring means and the IC Press the top surface of. At this time, the IC terminal provided on the lower surface of the IC and the contact disposed opposite to each other in the central opening of the frame frame can be individually contacted.

In such a socket for electronic components, a pair of rotating latch levers are connected between a holding area where the IC can be held in conjunction with a lifting operation of the frame frame and a retreat area where the IC can be inserted and removed. What is moving in is disclosed.
Japanese Patent No. 3103760 JP 2006-127937 A

  However, in the sockets disclosed in Patent Documents 1 and 2, since the pair of rotation latch levers are configured to rotate on the spot, the distance between the tip portions that directly press the IC is always constant. For this reason, ICs having different sizes cannot be held, and in order to cope with ICs having different sizes, a socket having a size corresponding to the IC must be prepared separately.

  In this regard, in the inventions described in Patent Documents 1 and 2, it is also considered that it is possible to hold ICs of different sizes by adopting a rotation latch lever having a long arm length.

  However, when the arm length of the rotation latch lever is extended, the distance from the rotation center to the tip end portion is extended, and the tip portion is more likely to be shaken accordingly. For this reason, there is a problem that when the front end of the rotating latch lever presses the surface of the IC, the front end is rubbed and the surface of the IC is attached with contact marks.

  In particular, it is very important to prevent the surface of the IC from being damaged, because the appearance inspection of the IC is strict and even a slight contact mark on the surface is treated as a defective product.

  The present invention is for solving the above-described conventional problems, and it is possible to securely hold and hold electronic components of different sizes, and the upper surface of the electronic component is damaged when the electronic component is held. An object of the present invention is to provide a socket for an electronic component that can prevent sticking.

The electronic component socket according to the present invention is provided so as to be movable between a first position for holding the electronic component and a second position for allowing the electronic component to be taken in and out, and when the electronic component socket reaches the first position. A movable lever that presses and holds the electronic component, and a biasing member that applies a biasing force to rotate the movable lever from the second position toward the first position,
When holding the electronic component, after the movable lever reaches the first position, the movable lever moves downward along a direction perpendicular to the upper surface of the electronic component to attach the upper surface of the electronic component to the attachment. Hold down with power,
When releasing the electronic component from the holding state, the movable lever moves upward along the vertical direction to release the urging force, and then retracted to the second position. It is.

  In the present invention, since the movable lever that holds the electronic component is movable back and forth between the first position and the second position, by moving to the first position where the electronic component can be held, It becomes possible to hold | maintain the center part of an electronic component. Therefore, the socket of the present invention can hold even when electronic components having different sizes are mounted.

  Moreover, the movable lever descends vertically after moving to the first position and presses the upper surface of the electronic component. For this reason, the pressing portion of the movable lever does not slide on the upper surface of the electronic component, and the upper surface of the electronic component can be prevented from being damaged by a sliding mark or the like.

  In the above, it is preferable that the pair of rotating levers are provided at positions symmetrical to each other.

  In the above means, since the electronic component can be held from both sides by the pair of rotating levers, it is possible to prevent the pressing force acting on the electronic component from becoming unbalanced. Therefore, connection between individual terminals between the electronic component and the contact substrate can be reliably performed.

  For example, a link member that rotatably supports the movable lever along a first locus, a link member that rotatably supports the link member, and a posture of the rotation lever that is controlled along the second locus. It is preferable that a cam wall having an inclined surface is provided.

  In the above means, when the electronic component is held, the movable lever is first moved in the substantially horizontal direction between the first position and the second position, and then lowered along the vertical direction. Can do. Also, when releasing the holding of the electronic component, the movable lever can first be raised along the vertical direction and then retracted from the second position to the first position.

  Therefore, at least when holding and releasing the electronic component, the movable lever can be moved in a direction perpendicular to the upper surface of the electronic component, and the movable lever slides between the upper surface of the electronic component. Therefore, it is possible to prevent the occurrence of contact marks.

  In the socket according to the present invention, it is possible to hold not the edge portion of the electronic component but the central portion, so that it is possible to hold electronic components of different sizes with one socket.

  Further, since the movable lever can be moved in the vertical direction to press or release the upper surface of the electronic component, it is possible to prevent the upper surface of the electronic component from being damaged during the attaching / detaching operation with the socket.

  1 is an exploded perspective view showing an electronic component socket according to the present invention, FIG. 2 is a perspective view showing a stage constituting the socket, and FIG. 3 is a cross-sectional view of the electronic component socket showing a retracted state in which the electronic component can be taken in and out. FIG. 4 is a sectional perspective view of an electronic component socket showing a state where the electronic component is held, FIG. 5 is a partial sectional view showing a movable lever from the side, FIG. 6 is a plan view showing a contact substrate, and FIG. Is an enlarged sectional view showing a spiral contact as an elastic contact, and FIG. 8 is an enlarged perspective view showing a guide piece. 3 to 5, the contact substrate is omitted. In FIG. 5, only one of the pair of movable levers is shown and the other movable lever is omitted, but the other movable lever has the same configuration.

  The socket for electronic parts (hereinafter simply referred to as “socket”) of the present invention is suitable in that it can hardly cause poor contact between electrodes even when used in a high temperature environment such as a burn-in test.

  As shown in FIG. 1, the socket includes a stage 10 and a substantially rectangular frame type frame 20. Each member constituting the socket is made of a material that does not easily deform even in a high temperature environment, such as a metal material or ceramic.

  As shown in FIG. 2, the stage 10 is formed in a substantially square shape, and has a square opening 11a at the center thereof. At the four corners of the opening 11a, positioning corners 11b are formed that protrude inward from the sides of the opening 11a. The electronic component 1 is loaded into the opening 11a, and coarse positioning in the horizontal direction is performed by the four positioning corners 11b (see FIG. 3).

  A pair of wall portions 12, 12 are provided in parallel to each other at both edges in the X direction of the opening 11a and at positions facing each other across the opening 11a. A support wall portion 12A is provided at the center of the wall portion 12, and guide wall portions 12B and 12B are continuously formed at both ends thereof. Further, cam wall portions 12C and 12C are formed outside the guide wall portions 12B and 12B. The support wall portion 12A, the guide wall portions 12B and 12B, and the cam wall portions 12C and 12C are integrally formed.

  A flat surface 12a is formed on the upper surface of the support wall portion 12A, and slopes 12c and 12c are formed on the upper edge portions of the cam wall portions 12C and 12C. Each is formed. The inner surfaces of the guide wall portions 12B facing each other are each formed as a smooth surface, and the upper end is formed by a guide slope 12B1 that spreads outward compared to the lower end. The lower ends of the individual guide slopes 12B1 are respectively continuous with the positioning corners 11b provided at the four corners of the opening 11a.

  As shown in FIGS. 1, 3, and 4, a pair of movable levers (holding members) 13 and 13 facing each other in the Y direction are provided between the wall portion 12 and the wall portion 12. The movable lever 13 has a lever body 13A extending in the vertical direction (Z direction). A through hole 13a is provided at the upper end of the lever main body 13A, and the lower end side serves as a pressing portion 13b. The end surface of the pressing portion 13b (the end surface at the tip of the movable lever 13) is a flat surface. As will be described later, a rotation shaft (second shaft) 14 is inserted through the through hole 13a.

  Further, the movable lever 13 is integrally formed with a support piece 13B extending perpendicularly to the lever main body 13A, and protrudes in both directions (X1 and X2 directions) from the tip of the support piece 13B in the Y direction. Stoppers 13c and 13c are integrally formed. The rotating shaft 14 and the stopper 13c are in a parallel relationship with each other.

  In addition, link members 15 and 15 are provided between the cam wall portion 12C and the cam wall portion 12C that are arranged to face each other. The link member 15 has a pair of side plates 15A, 15A having substantially the same L shape when viewed from the side. One side plate 15A and the other side plate 15A are connected by a connecting plate 15B. Through holes 15a and 15a are formed at the upper end in the height direction of the pair of side plates 15A and 15A, and holes 15b and 15b are formed at the lower end in the height (Z) direction, respectively. In addition, elongated holes 15c and 15c are formed at the ends of the pair of side plates 15A and 15A in the Y direction, respectively. Such a link member 15 is formed by punching and pressing a single metal plate.

  In the movable lever 13, the one side plate 15A is disposed to face one side (X1 side) of the lever body 13A in the X direction, and the other side plate 15A is placed to face the other side (X2 side). That is, the lever main body 13A is provided between the parallel side plate 15A and the side plate 15A.

  Through holes 15a and 15a formed in the link member 15 are overlapped with both ends of the through hole 13a provided in the movable lever 13, respectively, and the rotation shaft 14 has one through hole 15a, the through hole 13a, and the other through. It is inserted through the hole 15a. That is, the movable lever 13 is rotatably supported on the upper end side of the link member 15 via the rotation shaft 14.

  As shown in FIG. 2 and the like, convex portions (first shafts) 12d and 12d projecting inward are formed at the lower portions of the cam wall portions 12C and 12C. The convex portions 12 d and 12 d are fitted in the holes 15 b and 15 b formed in the link member 15. For this reason, the link member 15 is rotatably supported by the cam wall portions 12C and 12C through the holes 15b and 15b and the convex portions 12d and 12d. That is, the link member 15 is in a state of being rotatable in the β1 and β2 directions with the convex portions 12d and 12d as the first axis (see FIG. 5). In this state, the stoppers 13c and 13c face the upper edge portions of the cam wall portions 12C and 12C.

  As shown in FIG. 5, shaft-like connecting shafts 17 are inserted through the long holes 15 c and 15 c provided in the side plates 15 A and 15 A, respectively. An urging member is provided in the socket, and the urging member always urges upward in the figure (Z1 direction) for lifting the connecting shaft 17. For this reason, a force that always rotates the link member 15 in the β1 direction about the convex portions 12d and 12d acts as an axis. The connecting shaft 17 can move through the long holes 15c and 15c. The state in which the connecting shaft 17 is moved upward and the link member 15 is rotated to β1 is the initial state (see FIG. 9) or the holding state (see FIG. 11), and the connecting shaft 17 is moved downward. The state in which the link member 15 is rotated to β2 is the retracted state (see FIG. 10).

  The urging member that urges the connecting shaft 17 upward in the drawing is provided with a coil spring between, for example, a plurality of support protrusions 10A provided on the stage 10 and the lower surface of the frame 20 facing them. Can be configured.

  Alternatively, the side plates 15A and 15A can be constituted by wire springs (torsion coil springs) that urge the side plates 15A in the β1 direction. In this case, the connecting shaft 17 that receives the urging force of the coil spring or the wire spring is rotated in the β1 direction in FIG. 5, and as a result, the elongated holes 15c and 15c lift the connecting shafts 17 and 17 in the Z1 direction. .

  Further, as shown in FIG. 5, a biasing member 18 is provided on the inner surface of at least one of the cam wall portions 12 </ b> C of the pair of cam wall portions 12 </ b> C and 12 </ b> C and around the rotation shaft (second shaft) 14. Is provided. The urging member 18 is constituted by a torsion coil spring, and one leg portion 18 a is hooked to a connecting plate 15 B formed on the link member 15. Further, the tip end of the other leg portion 18 b of the urging member 18 is bent at a substantially right angle in a direction penetrating the paper surface, and is inserted into a retaining hole 13 d formed on the side surface of the movable lever 13. The biasing member 18 is provided between the connecting plate 15B and the retaining hole 13d in a state where the opening angle between the leg portion 18a and the leg portion 18b is narrowed. Therefore, an urging force is applied to the leg portion 18a and the leg portion 18b in a direction in which the opening angle of both the leg portions is always widened around the rotation shaft 14. That is, when the connecting plate 15B on the link member 15 side is used as a reference, the movable lever 13 is always urged by the second urging member 18 in the α1 direction in which the lower end side of the lever main body 13A is separated from the link member 15. . For this reason, the controlled pieces 13c and 13c provided integrally with the lever main body 13A can abut on the upper edge portions of the cam wall portions 12C and 12C.

  As shown in FIG. 1, a loading port 21 through which the electronic component 1 can be mounted and taken out is provided at the center of the frame 20. Inside the loading port 21, the pair of wall portions 12, 12, the movable levers 13, 13 and the link members 15, 15 described above are provided. The frame 20 is provided on the stage 10 so as to be movable up and down along the vertical direction (Z1-Z2 direction) in the figure.

  More specifically, as shown in FIGS. 3 and 4, recesses 22 and 22 are provided at the lower ends of the frame 20 on the Y1 and Y2 sides, and the long holes of the side plates 15A and 15A are provided in the recesses 22 and 22, respectively. Connection shafts 17 and 17 inserted through 15c and 15c are arranged to face each other. For this reason, the frame 20 can move up and down together with the connecting shafts 17 and 17.

  That is, as shown in FIG. 4, when the frame 20 is in a holding state where the frame 20 is not pressed in the Z2 direction (the same applies to the initial state), the frame 20 is applied to the connecting shafts 17 and 17 from a first biasing member (not shown). Lifted by biasing force. As shown in FIG. 3, when the frame 20 is pushed in the Z2 direction, the connecting shafts 17 and 17 rotate the link members 15 and 15 in the β2 direction against a biasing member (not shown). For this reason, the state of the socket is set to the retracted state shown in FIG.

  As shown in FIGS. 2, 6, etc., a contact substrate 30 that is detachably provided is held on the lower surface of the opening 11 a of the stage 10.

  The contact substrate 30 has an insulating base 31 made of a resin such as PET. A large number of through holes 32a (see FIG. 7) are regularly drilled in the XY direction with a predetermined number of columns and rows in the base material 31, and in the case shown in FIGS. Arranged in a shape.

  The arrangement shape of the plurality of through holes 32a depends on the arrangement of a plurality of contacts 1a such as BGA provided on the connection surface of the electronic component 1 (semiconductor) to be loaded. It is not limited to a flat “mouth” shape. For example, in the case of the electronic component 1 (semiconductor) in which the contacts 1a are arranged in a planar matrix, the numerous through holes are also arranged in a planar matrix.

  As shown in FIG. 7, a conductive portion 33 plated with copper is formed on the inner peripheral surface of each through hole 32a, and the upper end (end portion on the Z1 side in the drawing) and the lower end (on the Z2 side in the drawing side) of the conductive portion 33 are formed. End portions) are formed with connection portions 33a and 33b exposed on the front surface and the back surface of the base material 31. The connection portion 33 a on the upper end side and the connection portion 33 b on the lower end side are conductively connected via the conductive portion 33.

  Elastic contacts 34 are provided above the individual through holes 32a, and elastic contacts 34 or fixed contacts are provided below the through holes 32a. FIG. 7 shows an example in which a spiral contact 34B as the elastic contact 34 is used below the through hole 32a.

  The spiral contacts 34A and 34B are formed by plating nickel or the like on the surface of a conductive material such as copper, for example, and have a function as an elastic contact excellent in conductivity and elasticity as a whole. Yes. The plurality of spiral contacts 34A and 34B are respectively fixed on the sheet 25 having a plurality of through holes 25a so as not to be separated. In addition, as the sheet | seat 25, the insulating resin which consists of polyimide resin etc. can be used, for example.

  The spiral contactor 34A and the spiral contactor 34B have the same configuration, and have a substantially ring-shaped base 34a on the outer peripheral side thereof. The base part 34a of the upper spiral contactor 34A is connected to the upper connection part 33a, and the base part 34a of the lower spiral contactor 34B is connected to the lower connection part 33b. Therefore, the upper spiral contact 34 </ b> A and the lower spiral contact 34 </ b> B are conductively connected via the conductive portion 33.

  Each of the spiral contacts 34A and 34B has an elastically deforming portion 34d that spirally extends from the winding start end 34b provided on the base portion 34a side toward the winding end 34c on the leading end side, and the winding end 34c is a through hole. It is located at approximately the center (radial center) of 32a. The elastically deforming portions 34d of the spiral contacts 34A and 34B are formed in a convex shape that gradually separates from the base material 31 toward the winding end 34c from the winding start end 34b. Accordingly, the spiral contacts 34A and 34B are in a state of being elastically deformable in the vertical direction (Z1-Z2 direction) at both opening ends of the through hole 32a.

  As shown in FIG. 6, a frame-shaped guide member 35 is provided on the surface of the base material 31 constituting the contact substrate 30 and outside the region where the multiple spiral contacts 34A are formed. . The guide member 35 is formed of a metal foil formed in a frame shape on the base material 31. A part of the guide member 35 is cut out, and a plurality of guide pieces (individually 36A, 36B, 36C, 36D, 36E, and 36F).

  As shown in FIG. 8, each guide piece 36A thru | or 36F is formed with the positioning part 36a which becomes a fixed width dimension from the base end to the middle part, and the inclined part which becomes gradually thin from the inner side to the tip part from the inner side to the outer side. 36b. The base end of the positioning portion 36a is continuous with the guide member 35, and portions bent from the base end in the Z1 direction in the drawing are guide pieces 36A to 36F.

  The positioning portion 36a is formed by using an inner side 35a of the guide member 35 formed in a straight line. Therefore, as shown in FIG. 6, the positioning portion 36a of the guide piece 36A adjacent to the Y1 side and the positioning portion 36a of the guide piece 36B are on the same straight line, and the positioning portion of the guide piece 36C adjacent to the Y2 side is also the same. 36a and the positioning part 36a of the guide piece 36D are on the same straight line. The distance between the positioning portions 36a of the Y1 side guide pieces 36A and 36B and the positioning portions 36a of the Y2 side guide pieces 36C and 36D makes electrical connection using the contact substrate 30. This corresponds to the dimension of the electronic component 1 in the Y direction. Similarly, the distance between the positioning portion 36a of the guide piece 36E on the X2 side and the positioning portion 36a of the guide piece 36F on the X1 side corresponds to the dimension of the electronic component 1 in the X direction. That is, in the surface of the contact substrate 30 shown in FIG. 6, the area surrounded by the guide pieces 36A to 36F (sides 35a, 35a, 35a, 35a inside the guide member 35) is actually loaded with the electronic component 1. This is the loading area 30A. The loading area 30 </ b> A is provided in the opening 11 a in the stage 10. And the front-end | tip of the inclination part 36b of each guide piece 36A thru | or 36F is the structure which inclines toward the outer side rather than the side 35a inside the guide member 35. As shown in FIG.

  Note that the inner side 35a of the guide member 35 is provided on the inner side of a virtual straight line connecting the surfaces of the positioning corners 11b and 11b located at the four corners separately in the X direction or the Y direction. . For this reason, by using the guide pieces 36A to 36F, the electronic component 1 can be finely positioned in the horizontal direction.

  When the electronic component 1 is loaded into the loading area 30A, the side surface of the package forming the electronic component 1 comes into contact with the inclined portions 36b of the guide pieces 36A to 36F. For this reason, the electronic component 1 can be guided to the loading region 30A in the opening 11a using the inclined portions 36b of the guide pieces 36A to 36F. For this reason, it becomes possible to make each contact 1a of the electronic component 1 and each spiral contact 34A on the contact substrate 30 face each other.

  The guide member 35 and the guide piece 36 can be formed by performing a plurality of processes such as plating and etching. The contact substrate including the guide member can be formed, for example, by applying nickel plating that gives an elastic force to the surface of a metal foil such as copper and performing an etching process so as to have a predetermined shape. In addition, the spiral contact 34A can be simultaneously formed in the same process.

  For this reason, the guide member 35 can be formed on the base material 31 with high accuracy like the spiral contactor. Therefore, the horizontal displacement of the electronic component 1 loaded in the loading region 30A can be reduced, and the individual contact 1a of the electronic component 1 and the individual spiral contact 34A on the contact substrate 30 can be made high. It becomes possible to oppose the accuracy. Therefore, the connection between the electronic component 1 and the contact substrate 30 can be reliably performed.

  Note that the contact substrate 30 configured as described above is detachable from the lower surface of the opening 11 a of the stage 10. For this reason, if a plurality of contact substrates 30 having different arrangements of the spiral contacts 34A, guide members 35, etc. are prepared, and the contact substrate 30 is selected and used in accordance with the type of the electronic component 1, one contact substrate 30 is used. It becomes possible to correspond to a plurality of electronic components 1 with the socket. In this case, it is only necessary to replace the contact substrate 30 according to the type of the electronic component 1, and it is not necessary to replace the entire socket. Therefore, the cost required for the burn-in test can be kept low.

Next, the operation of the electronic component socket will be described.
9 to 11 show the operating state of the electronic component socket, FIG. 9 is a sectional view of the socket showing an initial state before the electronic component is loaded, and FIG. 10 shows the retracted state in which the lever is retracted. 11 is a sectional view of the socket showing a holding state in which the electronic component is held, FIG. 12 is a partial sectional view showing the operation of the guide piece when the electronic component is loaded in the loading area, and FIG. 13 is movable. It is a fragmentary sectional view of the socket which shows operation | movement of a lever. 10 corresponds to FIG. 3, FIG. 11 corresponds to FIG. 4, and corresponds to the case seen from the direction of the white arrow shown in FIG. 3 and FIG. In FIG. 13, only one of the pair of movable levers is shown and the other movable lever is omitted, but the operation of the other movable lever is the same.

(initial state)
First, in the initial state shown in FIG. 9, the frame 20 is at an upper position in the Z1 direction. In this state, the link members 15 and 15 are in the first position (i) rotated in the β1 direction. The lever bodies 13A and 13A of the movable levers 13 and 13 are rotated by the second urging members 18 and 18 in the α1 direction approaching each other. The movable levers 13 and 13 are in an inclined posture in which the tip ends of the lever main bodies 13A and 13A protrude inward from each other at a position above the loading region 30A in the opening 11a. That is, at the first position (i), the electronic component 1 cannot be mounted from the loading port 21 to the loading region 30A, and therefore the electronic component 1 is not mounted in the socket by mistake.

  In the first position (i), the stoppers 13c and 13c provided on the support pieces 13B and 13B are in contact with the inclined surfaces 12c and 12c at positions near the slopes of the cam wall portions 12C and 12C. For this reason, the movable levers 13 and 13 do not rotate in the α1 and α1 directions more than necessary. For this reason, at the first position (i), the tips of the pair of movable levers 13 and 13 are prevented from coming into contact with each other, and the movable levers 13 and 13 are prevented from pressing the surface of the contact substrate 30. Therefore, even when the burn-in test is exposed to a high temperature environment, it is possible to prevent deformation of the movable levers 13 and 13 and the contact substrate 30 due to contact. For this reason, it becomes possible to hold the electronic component 1 with high accuracy, and the problem of poor contact between the contact 1a of the electronic component 1 and the spiral contact 34A on the contact substrate side is less likely to occur. it can.

  When the length of the link member 15 between the convex portion 12d and the rotation shaft 14 is L, the perpendicular PP passing through the rotation shaft 14 and the inclination angle of the link member 15 with respect to the perpendicular PP are θ. The height position of the rotation shaft 14 with respect to the convex portion 12d is in a state of L cos θ.

(Transition operation from the initial state (first position) to the retracted state (second position))
Next, as shown in FIG. 10, when the frame 20 is pressed in the Z2 direction and moved downward, the link members 15 and 15 connected to the connecting shafts 17 and 17 are rotated in the β2 and β2 directions, respectively. It is done. For this reason, the movable levers 13 and 13 are rotated from the first position (i) shown in FIG. 9 to the second position (ii) shown in FIG. In the second position (ii), the postures of the movable levers 13 and 13 are substantially perpendicular to the horizontal plane. For this reason, the height position of the rotation shaft 14 with respect to the convex portion 12d is L, and the rotation shaft 14 has a length L (1) while moving from the first position (i) to the second position (ii). −cos θ) is moved upward (Z1 direction). That is, in this socket, when the frame 20 is pressed, the entire movable lever 13 is lifted vertically upward by a distance corresponding to the length L (1-cos θ).

  As described above, the urging forces in the directions α1 and α1 always act on the movable levers 13 and 13. For this reason, while the movable levers 13 and 13 are moved from the first position (i) to the second position (ii), the stoppers 13c and 13c are inclined surfaces 12c, which are upper edges of the cam walls 12C and 12C. Continue to contact 12c. That is, the stoppers 13c and 13c slide on the slopes 12c and 12c from the downhill side to the uphill side. For this reason, the movable levers 13 and 13 move from the posture in which the lever main body 13A is tilted to the posture parallel to the perpendicular line PP (the vertical posture with respect to the horizontal plane) during the operation of climbing the inclined surfaces 12c and 12c. Gradually change.

  When the movable levers 13 and 13 move from the first position (i) to the second position (ii), the distance between the pair of movable levers 13 and 13 increases. That is, in the socket, the movable levers 13 and 13 are retracted to the side position away from the loading area 30A, so that the electronic component 1 can be loaded into the loading area 30A via the loading port 21.

(Operation when loading electronic parts)
The electronic component 1 is loaded into the loading area 30A through the loading port 21 in the second position (ii) in which the frame 20 is pushed downward. At this time, since the electronic component 1 is guided such that the side surface of the package is guided by the guide slope 12B1 provided inside the guide wall 12B, the electronic component 1 is surely placed in the loading region 30A provided in the opening 11a. Can lead to.

  Further, when the electronic component 1 is pushed toward the bottom of the loading port 21, the four corners of the package of the electronic component 1 enter the positioning corners 11b provided at the four corners of the opening 11a (see FIG. 3). . Thereby, rough positioning of the electronic component 1 in the horizontal direction can be performed (coarse positioning).

  As shown in FIG. 12, when the electronic component 1 is pushed in the bottom direction (Z2 direction) of the loading port 21, the lower end 1A of the package of the electronic component 1 comes into contact with the inclined portion 36b provided on the guide pieces 36A to 36F. When the electronic component 1 is further pushed in, the electronic component 1 can be moved downward in the figure while the lower end 1A of the package is guided by the inclined portion 36b and the positioning portion 36a continuous therewith. As a result, the electronic component 1 can be positioned at an appropriate position on the loading area 30A. Thereby, each contact 1a formed on the connection surface of the electronic component 1 and each spiral contact 34A provided on the contact substrate 30 can be brought into contact with each other with high accuracy.

(Transition from evacuation state to retention state)
As shown in FIG. 11, when the pressing force that has pushed the frame 20 downward is released, the frame 20 is pushed upward (Z1 direction) by a biasing force of a first biasing member (not shown). Thus, the link members 15 and 15 are rotated in the β1 direction via the connecting shafts 17 and 17, respectively.

  When the link members 15 and 15 are respectively rotated in the β1 direction, the movable levers 13 and 13 are moved in directions approaching each other to reach the first position (i) where the link members 15 and 15 advance to the upper portion of the loading region 30A.

  In the process in which the movable levers 13 and 13 move from the second position (ii) shown in FIG. 10 to the first position (i) shown in FIG. 11, the stoppers 13c and 13c move the slopes 12c and 12c from the uphill to the downhill. Slide down while descending.

  Here, as shown in FIG. 13, the rotation trajectory (first trajectory) tt of the rotation shaft 14 provided at the tip of the link member 15 is a circle with a radius L centered on the convex portion 12d. A part (arc) is formed. On the other hand, the slope 12c formed at the upper edge of the cam wall 12C is formed by an inclined surface (second locus) having a predetermined inclination angle. The rotation trajectory tt of the rotation shaft 14 coincides with the trajectory of the control slope 12c when the controlled piece 13c reaches the position on the slope of the control slope 12c rotated most in the β1 direction. Yes, when turning in the β2 direction, the turning trajectory tt is gradually separated from the control slope 12c.

  For this reason, when the link member 15 is rotated in the β2 direction, the controlled piece 13c is in a position on the slope of the control slope 12c, and when the link member 15 is rotated in the β1 direction, the controlled pieces 13c, 13c. Slides on the control slopes 12c, 12c from the hill to the hill. When the link member 15 rotates most in the β1 direction, the controlled pieces 13c and 13c are separated from the control slopes 12c and 12c. At this time, when the electronic component 1 is not present in the loading area 30A, the movable levers 13 and 13 are pushed forward by the urging force of the second urging members 18 and 18 so that the pressing portion 13b protrudes forward from the rotating shaft 14. The first position (i) in the inclined posture is reached (see FIG. 9).

  On the other hand, as shown in FIG. 11, when the electronic component 1 is provided in the loading area 30A, the pressing portions 13b and 13b of the movable levers 13 and 13 are electronic at positions on both sides in the width direction (Y direction). It contacts the upper surface of the component 1 and presses it downward in the figure.

  More specifically, the movable levers 13 and 13 move from the second position (ii) toward the first position (i) along the rotation locus (first locus) tt of the rotation shaft 14. . At this time, the movement of the movable lever 13 is dominant in the horizontal direction, and the stoppers 13c and 13c are separated from the inclined surfaces 12c and 12c during the movement. Accordingly, the lever main bodies 13A and 13A rotate in the α1 direction around the rotation shafts 14 and 14, respectively.

  Further, when the movable levers 13 and 13 are rotated along the rotation locus (first locus) tt of the rotation shaft 14 to the end in the β1 direction, the movement of the movable levers 13 and 13 is the rotation locus t. Due to the relationship between -t and the shape of the slope 12c, the movement in the vertical direction becomes dominant. Accordingly, the movable levers 13 and 13 are lowered along the vertical direction, and the pressing portions 13b and 13b press the upper surface of the electronic component 1 from almost right above. Thereby, the electronic component 1 is held in the loading area 30A in the socket. At the same time, the electrical connection between the individual contacts 1 a formed on the connection surface of the electronic component 1 and the individual spiral contacts 34 A provided on the contact substrate 30 is achieved.

  Thus, in the present invention, when the electronic component 1 is held, the link member 15 first rotates in the β1 direction, and then the movable lever 13 rotates in the α1 direction. For this reason, the rotation operation | movement at the time of hold | maintaining the electronic component 1 can be allocated to the movable lever 13 and the link member 15 which are two members, respectively, and the operation amount (rotation angle and rotation radius) of one member. Can be reduced. Therefore, unlike the prior art, the angle and the turning radius for turning the latch lever do not increase. Therefore, the space required during operation can be reduced, that is, a small socket can be obtained.

(Operation when releasing electronic components)
Next, in order to take out the electronic component 1 held in the socket, the frame 20 is pressed in the Z2 direction in the drawing and moved downward. Then, the link members 15 and 15 connected to the connecting shafts 17 and 17 are rotated in the β2 and β2 directions, respectively, and the movable levers 13 and 13 are shown in FIG. 10 from the first position (i) shown in FIG. It is rotated to the second position (ii). The operation at this time is the reverse of the operation for shifting from the retracted state to the retained state. That is, the movable levers 13 and 13 are first lifted vertically upward to release the pressure on the electronic component 1 and then moved horizontally toward the second position (ii) to set the retracted state. Is done.

  As described above, in the socket of the present invention, when the electronic component 1 is attached and detached, the pressing portion 13b of the movable levers 13 and 13 does not slide on the upper surface of the electronic component 1, and is applied vertically from almost right above. Since the pressure can be applied and the pressure can be released, the probability that contact marks are formed on the upper surface of the electronic component 1 can be reduced. Therefore, it is possible to reduce the defective product occurrence rate of the electronic component 1.

  Moreover, the movable levers 13 and 13 can press the upper surface near the center, not the both ends of the electronic component 1 in the width direction. For this reason, the width dimension of the electronic component 1 in the vertical and horizontal directions (XY directions) is smaller than the vertical and horizontal inner dimensions of the opening portion 11a and is larger than the opposing distance between the one movable lever 13 and the other movable lever 13 in the holding state. If it is within a large range, it can be held using the socket of the present invention. That is, the socket of the present invention can hold not only one size of electronic component 1 but also a plurality of types of electronic components 1 having different sizes.

  In the above embodiment, the spiral contact is shown as an example of the elastic contact 34A, but the elastic contact used in the socket of the present invention is not limited to the spiral contact. For example, a membrane-type contact with an elastic film made of rubber or elastomer attached to the back of a dome-shaped metal film. The tip of the contact can be bent into a generally U shape and the whole can be elastically deformed. A spring pin (contact pin), a stressed metal, a contact probe (see Japanese Patent Application Laid-Open No. 2002-357622), or an elastic contact such as a bamboo shoot spring may be used.

  However, when the elastic contact 34 has a spiral shape, the spiral elastic deformation portion 34d surrounds the contact 1a regardless of the shape of the contact 1a of the electronic component 1. Since it becomes easy to deform | transform, it is preferable at the point which the contact area of the said elastic deformation part 34d and the said contactor 1a spreads, and the contact property with the said contactor 1a can be ensured.

An exploded perspective view showing a socket for electronic parts according to the present invention, The perspective view which shows the stage which comprises a socket, A cross-sectional perspective view of a socket for electronic components showing a retracted state in which electronic components can be taken in and out, A cross-sectional perspective view of a socket for electronic components showing a state in which the electronic components are held; Partial sectional view showing the movable lever from the side, A plan view showing a contact substrate, An enlarged cross-sectional view showing a spiral contact as an elastic contact, The perspective view which expands and shows a guide piece, Sectional view of the socket showing the initial state before electronic components are loaded, Sectional view of the socket showing the retracted state with the lever retracted, Sectional view of the socket showing the holding state holding the electronic component, Partial sectional view showing the operation of the guide piece when the electronic component is loaded in the loading area, Partial sectional view of the socket showing the operation of the movable lever,

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 1a Contact 10 Stage 11a Opening part 11b Positioning corner part 12 Wall part 12A Support wall part 12B Guide wall part 12B1 Guide slope 12C Cam wall part 12c Slope (2nd locus | trajectory)
12d Convex part (first axis)
13 Movable lever (holding member)
13A Lever body 13B Supporting piece 13b Pressing part 13c Stopper 14 Rotating shaft (second shaft)
15 Link member 17 Connecting shaft 18 Biasing member (holding member)
20 Frame 21 Loading port 25 Sheet 30 Contact substrate 30A Loading area 31 Base material 32a, 32b Through hole 33 Conducting portion 34 Elastic contact 34A, 34B Spiral contact 35 Guide member 35a Sides 36, 36A, 36B, 36C inside guide member , 36D, 36E, 36F Guide piece 36a Positioning portion 36b Inclined portion tt Rotation locus of the rotation shaft (first locus)

Claims (3)

The electronic component is movably provided between a first position for holding the electronic component and a second position allowing the electronic component to be taken in and out, and the electronic component is pressed and held when the first position is reached. And a biasing member that applies a biasing force to rotate the movable lever from the second position toward the first position,
When holding the electronic component, after the movable lever reaches the first position, the movable lever moves downward along a direction perpendicular to the upper surface of the electronic component to attach the upper surface of the electronic component to the attachment. Hold down with power,
When the electronic component is released from the holding state, the movable lever moves upward along the vertical direction to release the biasing force, and then is retracted to the second position. Socket for parts.   The electronic component socket according to claim 1, wherein the pair of rotating levers are provided at positions symmetrical to each other.   A link member that rotatably supports the movable lever along a first trajectory, and a slope that supports the link member rotatably and controls the attitude of the rotary lever along the second trajectory. The socket for electronic components of Claim 1 or 2 provided with the cam wall part provided with.

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