TWI703329B - 供高頻應用的探針卡 - Google Patents

供高頻應用的探針卡 Download PDF

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Publication number
TWI703329B
TWI703329B TW107105487A TW107105487A TWI703329B TW I703329 B TWI703329 B TW I703329B TW 107105487 A TW107105487 A TW 107105487A TW 107105487 A TW107105487 A TW 107105487A TW I703329 B TWI703329 B TW I703329B
Authority
TW
Taiwan
Prior art keywords
contact
probe card
elastic membrane
contact elements
tip
Prior art date
Application number
TW107105487A
Other languages
English (en)
Chinese (zh)
Other versions
TW201831909A (zh
Inventor
史提伐諾 費利希
Original Assignee
義大利商探針科技公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 義大利商探針科技公司 filed Critical 義大利商探針科技公司
Publication of TW201831909A publication Critical patent/TW201831909A/zh
Application granted granted Critical
Publication of TWI703329B publication Critical patent/TWI703329B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Reinforced Plastic Materials (AREA)
  • Medicinal Preparation (AREA)
TW107105487A 2017-02-15 2018-02-14 供高頻應用的探針卡 TWI703329B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT102017000017037 2017-02-15
??102017000017037 2017-02-15
IT102017000017037A IT201700017037A1 (it) 2017-02-15 2017-02-15 Scheda di misura per applicazioni ad alta frequenza

Publications (2)

Publication Number Publication Date
TW201831909A TW201831909A (zh) 2018-09-01
TWI703329B true TWI703329B (zh) 2020-09-01

Family

ID=59579801

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107105487A TWI703329B (zh) 2017-02-15 2018-02-14 供高頻應用的探針卡

Country Status (11)

Country Link
US (1) US11112431B2 (cg-RX-API-DMAC7.html)
EP (1) EP3583431A1 (cg-RX-API-DMAC7.html)
JP (2) JP7306993B2 (cg-RX-API-DMAC7.html)
KR (1) KR102522524B1 (cg-RX-API-DMAC7.html)
CN (1) CN110291407B (cg-RX-API-DMAC7.html)
IT (1) IT201700017037A1 (cg-RX-API-DMAC7.html)
MY (1) MY195983A (cg-RX-API-DMAC7.html)
PH (1) PH12019501889A1 (cg-RX-API-DMAC7.html)
SG (1) SG11201907121WA (cg-RX-API-DMAC7.html)
TW (1) TWI703329B (cg-RX-API-DMAC7.html)
WO (1) WO2018149847A1 (cg-RX-API-DMAC7.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT201700017037A1 (it) * 2017-02-15 2018-08-15 Technoprobe Spa Scheda di misura per applicazioni ad alta frequenza
CN108241078B (zh) * 2017-05-18 2020-06-02 苏州韬盛电子科技有限公司 垂直探针卡
KR102066678B1 (ko) * 2019-10-30 2020-01-15 김재길 범프필름 타입 프로브카드
IT201900024964A1 (it) * 2019-12-20 2021-06-20 Technoprobe Spa Testa di misura per applicazioni a ridotto pitch
CN113433360B (zh) * 2020-03-23 2023-12-01 奥特斯(中国)有限公司 测试适配器、测试设备和测试部件承载件的方法
KR102307942B1 (ko) * 2020-07-13 2021-10-01 양진석 반도체 소자 검사 장치
CN112305395B (zh) * 2020-11-06 2021-05-28 法特迪精密科技（苏州）有限公司 一种探针结构及其安装方法、闭路方法、抗干扰方法
TWI784439B (zh) * 2021-03-12 2022-11-21 冠銓科技實業股份有限公司 應用於高頻量測之測試針座構造
JP7766290B2 (ja) * 2021-03-26 2025-11-10 石福金属興業株式会社 プローブピン用合金材料
US11714105B2 (en) * 2021-03-30 2023-08-01 Enplas Corporation Socket and inspection socket
KR102309675B1 (ko) * 2021-07-30 2021-10-07 김재길 필름 형태의 프로브카드
JP7795316B2 (ja) * 2021-09-27 2026-01-07 株式会社ヨコオ コンタクトユニット及び検査治具
KR102450658B1 (ko) * 2022-09-01 2022-10-06 윌테크놀러지(주) 니들유닛의 팁 길이조절이 용이한 니들블럭
KR102847367B1 (ko) * 2022-10-20 2025-08-18 주식회사 에이엠에스티 프로브 카드 제작 방법
IT202400003139A1 (it) * 2024-02-14 2025-08-14 Technoprobe Spa Scheda di misura per applicazioni ad elevata frequenza
KR102913907B1 (ko) * 2024-06-10 2026-01-19 (주)위드멤스 피검사체의 전기적 특성을 프로빙하는 프로브 카드 어셈블리

Citations (13)

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US20040046579A1 (en) * 2002-05-08 2004-03-11 Formfactor, Inc. High performance probe system
TW589453B (en) * 1998-12-02 2004-06-01 Formfactor Inc Lithographic contact elements
TW200425374A (en) * 2003-05-01 2004-11-16 Celerity Res Inc Device probing using a matching device
TW200606436A (en) * 2004-07-07 2006-02-16 Cascade Microtech Inc Probe head having a membrane suspended probe
US20080061808A1 (en) * 2006-09-12 2008-03-13 Sammy Mok Compliance partitioning in testing of integrated circuits
TW200908450A (en) * 2007-06-14 2009-02-16 Alps Electric Co Ltd Socket for electronic component
US20090212798A1 (en) * 2008-02-27 2009-08-27 Susumu Kasukabe Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device
TW201003075A (en) * 2008-07-01 2010-01-16 Taiwan Semiconductor Mfg Semiconductor test probe card space transformer
TW201140095A (en) * 2010-02-05 2011-11-16 Advantest Corp Electronic device test apparatus
TW201202710A (en) * 2010-05-19 2012-01-16 Gunsei Kimoto Probe
TW201316014A (zh) * 2011-10-12 2013-04-16 Advantest Corp 測試裝置、測試方法以及裝置介面
TW201512678A (zh) * 2013-07-11 2015-04-01 Johnstech Int Corp 測試裝置以及用於微電路及晶圓級ｉｃ測試的方法
TW201625962A (zh) * 2014-12-04 2016-07-16 技術探測股份有限公司 包括垂直探針之測試頭

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JPH0936188A (ja) * 1995-07-14 1997-02-07 Tokyo Electron Ltd プローブ装置に用いられるプローブカードデバイス
TW369601B (en) * 1997-06-17 1999-09-11 Advantest Corp Probe card
US6965244B2 (en) * 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
US6759861B2 (en) * 2002-07-30 2004-07-06 Intel Corporation Thin film probe card contact drive system
JP2004144742A (ja) * 2002-10-02 2004-05-20 Renesas Technology Corp プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法
TWI236723B (en) * 2002-10-02 2005-07-21 Renesas Tech Corp Probe sheet, probe card, semiconductor inspection device, and manufacturing method for semiconductor device
US7129730B2 (en) * 2004-12-15 2006-10-31 Chipmos Technologies (Bermuda) Ltd. Probe card assembly
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KR20090019384A (ko) * 2007-08-21 2009-02-25 주식회사 세지 반도체 웨이퍼 검사용 프로브카드
JP2010175371A (ja) * 2009-01-29 2010-08-12 Yokowo Co Ltd 検査ソケット
JP2011038930A (ja) * 2009-08-12 2011-02-24 Renesas Electronics Corp プローブカード及び被検査装置のテスト方法
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CN105531593B (zh) * 2013-05-06 2019-05-03 佛姆法克特股份有限公司 用于测试电子器件的探针卡组件
US9709599B2 (en) * 2014-01-09 2017-07-18 Taiwan Semiconductor Manufacturing Co., Ltd. Membrane probe card
JP6721302B2 (ja) * 2015-08-10 2020-07-15 東京特殊電線株式会社 両面回路基板の検査装置
IT201700017037A1 (it) * 2017-02-15 2018-08-15 Technoprobe Spa Scheda di misura per applicazioni ad alta frequenza
IT201700017061A1 (it) * 2017-02-15 2018-08-15 Technoprobe Spa Scheda di misura perfezionata per applicazioni ad alta frequenza

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW589453B (en) * 1998-12-02 2004-06-01 Formfactor Inc Lithographic contact elements
US20040046579A1 (en) * 2002-05-08 2004-03-11 Formfactor, Inc. High performance probe system
TW200425374A (en) * 2003-05-01 2004-11-16 Celerity Res Inc Device probing using a matching device
TW200606436A (en) * 2004-07-07 2006-02-16 Cascade Microtech Inc Probe head having a membrane suspended probe
US20080061808A1 (en) * 2006-09-12 2008-03-13 Sammy Mok Compliance partitioning in testing of integrated circuits
TW200908450A (en) * 2007-06-14 2009-02-16 Alps Electric Co Ltd Socket for electronic component
US20090212798A1 (en) * 2008-02-27 2009-08-27 Susumu Kasukabe Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device
TW201003075A (en) * 2008-07-01 2010-01-16 Taiwan Semiconductor Mfg Semiconductor test probe card space transformer
TW201140095A (en) * 2010-02-05 2011-11-16 Advantest Corp Electronic device test apparatus
TW201202710A (en) * 2010-05-19 2012-01-16 Gunsei Kimoto Probe
TW201316014A (zh) * 2011-10-12 2013-04-16 Advantest Corp 測試裝置、測試方法以及裝置介面
TW201512678A (zh) * 2013-07-11 2015-04-01 Johnstech Int Corp 測試裝置以及用於微電路及晶圓級ｉｃ測試的方法
TW201625962A (zh) * 2014-12-04 2016-07-16 技術探測股份有限公司 包括垂直探針之測試頭

Also Published As

Publication number Publication date
EP3583431A1 (en) 2019-12-25
US11112431B2 (en) 2021-09-07
SG11201907121WA (en) 2019-09-27
JP2023085418A (ja) 2023-06-20
KR20190112155A (ko) 2019-10-02
US20190361050A1 (en) 2019-11-28
CN110291407B (zh) 2022-06-07
IT201700017037A1 (it) 2018-08-15
MY195983A (en) 2023-02-27
CN110291407A (zh) 2019-09-27
WO2018149847A1 (en) 2018-08-23
KR102522524B1 (ko) 2023-04-14
JP2020507771A (ja) 2020-03-12
JP7306993B2 (ja) 2023-07-11
PH12019501889A1 (en) 2020-07-06
TW201831909A (zh) 2018-09-01

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