IT1393346B1 - Dispositivo con componente semiconduttore, e procedimento di fabbricazione - Google Patents

Dispositivo con componente semiconduttore, e procedimento di fabbricazione

Info

Publication number
IT1393346B1
IT1393346B1 ITMI2009A000377A ITMI20090377A IT1393346B1 IT 1393346 B1 IT1393346 B1 IT 1393346B1 IT MI2009A000377 A ITMI2009A000377 A IT MI2009A000377A IT MI20090377 A ITMI20090377 A IT MI20090377A IT 1393346 B1 IT1393346 B1 IT 1393346B1
Authority
IT
Italy
Prior art keywords
semiconductor component
manufacturing procedure
procedure
manufacturing
semiconductor
Prior art date
Application number
ITMI2009A000377A
Other languages
English (en)
Italian (it)
Inventor
Jens Koenig
Dieter Donis
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20090377A1 publication Critical patent/ITMI20090377A1/it
Application granted granted Critical
Publication of IT1393346B1 publication Critical patent/IT1393346B1/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
ITMI2009A000377A 2008-03-17 2009-03-12 Dispositivo con componente semiconduttore, e procedimento di fabbricazione IT1393346B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008014653A DE102008014653A1 (de) 2008-03-17 2008-03-17 Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren

Publications (2)

Publication Number Publication Date
ITMI20090377A1 ITMI20090377A1 (it) 2009-09-18
IT1393346B1 true IT1393346B1 (it) 2012-04-20

Family

ID=40983899

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2009A000377A IT1393346B1 (it) 2008-03-17 2009-03-12 Dispositivo con componente semiconduttore, e procedimento di fabbricazione

Country Status (4)

Country Link
US (1) US8039975B2 (https=)
JP (1) JP2009224783A (https=)
DE (1) DE102008014653A1 (https=)
IT (1) IT1393346B1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG150404A1 (en) * 2007-08-28 2009-03-30 Micron Technology Inc Semiconductor assemblies and methods of manufacturing such assemblies
JP2009170476A (ja) * 2008-01-11 2009-07-30 Panasonic Corp 半導体装置および半導体装置の製造方法
US7863722B2 (en) 2008-10-20 2011-01-04 Micron Technology, Inc. Stackable semiconductor assemblies and methods of manufacturing such assemblies
US9230878B2 (en) 2013-04-12 2016-01-05 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Integrated circuit package for heat dissipation
WO2022159447A1 (en) * 2021-01-20 2022-07-28 Jetcool Technologies Inc. Conformal cooling assembly with substrate fluid-proofing for multi-die electronic assemblies

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120295A (ja) * 1992-10-02 1994-04-28 Mitsubishi Electric Corp 半導体装置
JPH09232482A (ja) * 1996-02-23 1997-09-05 Denso Corp 半導体の表面処理方法および半導体装置
JP3410651B2 (ja) * 1998-02-06 2003-05-26 松下電器産業株式会社 半導体装置及びその製造方法
DE19951945A1 (de) 1999-10-28 2001-05-03 Daimler Chrysler Ag Halbleiterbauelement mit Seitenwandmetallisierung
US6731012B1 (en) * 1999-12-23 2004-05-04 International Business Machines Corporation Non-planar surface for semiconductor chips
DE10249205B3 (de) 2002-10-22 2004-08-05 Siemens Ag Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen
US7288839B2 (en) * 2004-02-27 2007-10-30 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
JP2005260128A (ja) * 2004-03-15 2005-09-22 Yamaha Corp 半導体素子及びそれを備えたウエハレベル・チップサイズ・パッケージ
US7002247B2 (en) * 2004-06-18 2006-02-21 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices
TWI236870B (en) 2004-06-29 2005-07-21 Ind Tech Res Inst Heat dissipation apparatus with microstructure layer and manufacture method thereof

Also Published As

Publication number Publication date
DE102008014653A1 (de) 2009-09-24
US20090230569A1 (en) 2009-09-17
US8039975B2 (en) 2011-10-18
ITMI20090377A1 (it) 2009-09-18
JP2009224783A (ja) 2009-10-01

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