DE102008014653A1 - Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren - Google Patents

Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren Download PDF

Info

Publication number
DE102008014653A1
DE102008014653A1 DE102008014653A DE102008014653A DE102008014653A1 DE 102008014653 A1 DE102008014653 A1 DE 102008014653A1 DE 102008014653 A DE102008014653 A DE 102008014653A DE 102008014653 A DE102008014653 A DE 102008014653A DE 102008014653 A1 DE102008014653 A1 DE 102008014653A1
Authority
DE
Germany
Prior art keywords
surface structure
protective
semiconductor device
semiconductor
semiconductor component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102008014653A
Other languages
German (de)
English (en)
Inventor
Dieter Donis
Jens Koenig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE102008014653A priority Critical patent/DE102008014653A1/de
Priority to ITMI2009A000377A priority patent/IT1393346B1/it
Priority to US12/404,766 priority patent/US8039975B2/en
Priority to JP2009062611A priority patent/JP2009224783A/ja
Publication of DE102008014653A1 publication Critical patent/DE102008014653A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
DE102008014653A 2008-03-17 2008-03-17 Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren Withdrawn DE102008014653A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102008014653A DE102008014653A1 (de) 2008-03-17 2008-03-17 Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren
ITMI2009A000377A IT1393346B1 (it) 2008-03-17 2009-03-12 Dispositivo con componente semiconduttore, e procedimento di fabbricazione
US12/404,766 US8039975B2 (en) 2008-03-17 2009-03-16 Device comprising a semiconductor component, and a manufacturing method
JP2009062611A JP2009224783A (ja) 2008-03-17 2009-03-16 半導体構成素子を備える装置、および半導体構成素子を備える装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008014653A DE102008014653A1 (de) 2008-03-17 2008-03-17 Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren

Publications (1)

Publication Number Publication Date
DE102008014653A1 true DE102008014653A1 (de) 2009-09-24

Family

ID=40983899

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008014653A Withdrawn DE102008014653A1 (de) 2008-03-17 2008-03-17 Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren

Country Status (4)

Country Link
US (1) US8039975B2 (https=)
JP (1) JP2009224783A (https=)
DE (1) DE102008014653A1 (https=)
IT (1) IT1393346B1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG150404A1 (en) * 2007-08-28 2009-03-30 Micron Technology Inc Semiconductor assemblies and methods of manufacturing such assemblies
JP2009170476A (ja) * 2008-01-11 2009-07-30 Panasonic Corp 半導体装置および半導体装置の製造方法
US7863722B2 (en) 2008-10-20 2011-01-04 Micron Technology, Inc. Stackable semiconductor assemblies and methods of manufacturing such assemblies
US9230878B2 (en) 2013-04-12 2016-01-05 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Integrated circuit package for heat dissipation
WO2022159447A1 (en) * 2021-01-20 2022-07-28 Jetcool Technologies Inc. Conformal cooling assembly with substrate fluid-proofing for multi-die electronic assemblies

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19951945A1 (de) 1999-10-28 2001-05-03 Daimler Chrysler Ag Halbleiterbauelement mit Seitenwandmetallisierung
DE10249205B3 (de) 2002-10-22 2004-08-05 Siemens Ag Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen
US20060005952A1 (en) 2004-06-29 2006-01-12 Lan-Kai Yeh Heat dissipating appatatus having micro-structure layer and method of fabricating the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120295A (ja) * 1992-10-02 1994-04-28 Mitsubishi Electric Corp 半導体装置
JPH09232482A (ja) * 1996-02-23 1997-09-05 Denso Corp 半導体の表面処理方法および半導体装置
JP3410651B2 (ja) * 1998-02-06 2003-05-26 松下電器産業株式会社 半導体装置及びその製造方法
US6731012B1 (en) * 1999-12-23 2004-05-04 International Business Machines Corporation Non-planar surface for semiconductor chips
US7288839B2 (en) * 2004-02-27 2007-10-30 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
JP2005260128A (ja) * 2004-03-15 2005-09-22 Yamaha Corp 半導体素子及びそれを備えたウエハレベル・チップサイズ・パッケージ
US7002247B2 (en) * 2004-06-18 2006-02-21 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19951945A1 (de) 1999-10-28 2001-05-03 Daimler Chrysler Ag Halbleiterbauelement mit Seitenwandmetallisierung
DE10249205B3 (de) 2002-10-22 2004-08-05 Siemens Ag Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen
US20060005952A1 (en) 2004-06-29 2006-01-12 Lan-Kai Yeh Heat dissipating appatatus having micro-structure layer and method of fabricating the same

Also Published As

Publication number Publication date
IT1393346B1 (it) 2012-04-20
US20090230569A1 (en) 2009-09-17
US8039975B2 (en) 2011-10-18
ITMI20090377A1 (it) 2009-09-18
JP2009224783A (ja) 2009-10-01

Similar Documents

Publication Publication Date Title
DE202020101204U1 (de) Photovoltaikzellenstrang und Photovoltaikzellenmodul
DE102012212963B4 (de) Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
DE102009045385A1 (de) Verfahren zum Verschließen eines Grabens eines mikromechanischen Bauelements
DE102008014653A1 (de) Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren
DE102010033437A1 (de) Elektrische Verbindungsanordnung und elektrisches Verbindungselement sowie Akkumulatoranordnung dafür
DE112015002024T5 (de) Halbleitervorrichtung
DE102009046467B4 (de) Leiterbahnstanzgitter mit einer speziellen Oberflächenkontur sowie Steuergerät mit einem solchen Leiterbahnstanzgitter
WO2015172946A1 (de) Bipolarplatte und schichtstruktur auf der bipolarplatte
EP2988903B1 (de) Verfahren zur vereinzelung von chips aus einem wafer und hergestellte chips davon
DE102007053067A1 (de) Verfahren zur Herstellung eines Halbleiterbauelementes und Halbleiterbauelement
DE102004048201A1 (de) Schicht zwischen Grenzflächen unterschiedlicher Komponenten in Halbleiterbauteilen, sowie Verfahren zu deren Herstellung
DE102021106596B4 (de) Halbleitervorrichtung und Herstellungsverfahren einer Halbleitervorrichtung
WO2018224183A1 (de) Led-filament
DE102013202532A1 (de) Verfahren zur Herstellung eines Spenders, Spender sowie Werkzeug hierfür
DE102017117165A1 (de) Elektronisches Bauteil und Verfahren zur Herstellung eines elektronischen Bauteils
DE102010008618A1 (de) Halbleitervorrichtung
WO2012152307A1 (de) Bauelementträgerverbund mit einer bauelementträgerbereiche abtrennenden grabenstruktur und verfahren zur herstellung einer mehrzahl von bauelementträgerbereichen
DE102016116298A1 (de) Anordnung mit Träger und optoelektronischem Bauelement
DE102014014473B4 (de) Verfahren zum Herstellen einer Halbleiteranordnung sowie entsprechende Halbleiteranordnung
DE102012222685A1 (de) Bauteilverbund und dessen Verwendung
DE102011016566A1 (de) Leiterrahmen für optoelektronische Bauelemente und Verfahren zur Herstellung optoelektronischer Bauelemente
DE102019006851B3 (de) Verfahren zur Herstellung eines elektrisch leitenden Kontaktelements, elektrisch leitendes Kontaktelement und Hülse mit einem elektrisch leitenden Kontaktelement
DE102023130702A1 (de) Halbleitervorrichtung
DE102013224899A1 (de) Varistorpaste, optoelektronisches Bauelement, Verfahren zum Herstellen einer Varistorpaste und Verfahren zum Herstellen eines Varistorelements
DE102017203217A1 (de) Kontaktanordnung

Legal Events

Date Code Title Description
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20141001