IT1248383B - Procedimento e apparecchiatura per la saldatura dei componenti su piastre di circuiti stampati mediante bagno di leghe saldanti - Google Patents
Procedimento e apparecchiatura per la saldatura dei componenti su piastre di circuiti stampati mediante bagno di leghe saldantiInfo
- Publication number
- IT1248383B IT1248383B ITMI911268A ITMI911268A IT1248383B IT 1248383 B IT1248383 B IT 1248383B IT MI911268 A ITMI911268 A IT MI911268A IT MI911268 A ITMI911268 A IT MI911268A IT 1248383 B IT1248383 B IT 1248383B
- Authority
- IT
- Italy
- Prior art keywords
- welding
- bath
- components
- equipment
- plates
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 229910045601 alloy Inorganic materials 0.000 title abstract 2
- 239000000956 alloy Substances 0.000 title abstract 2
- 238000011010 flushing procedure Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 230000003068 static effect Effects 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
Un procedimento e una relativa apparecchiatura per la saldatura dei componenti su piastre di circuiti stampati mediante bagno di leghe saldanti allo stato fuso, con le tecniche ad onda, a stramazzo, a vibrazione, statiche etc, comprendente in successione le seguenti fasi: flussatura (2), preriscaldamento (3), almeno un lavaggio (4, 5), eventuale sostituzione solventi (6), ulteriore flussatura (7), eventuale preriscaldamento (8), saldatura (9) ed eventuale lavaggio blando (10), in cui le fasi da (4) a (8) sono eseguite in atmosfera controllata o sottovuoto.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI911268A IT1248383B (it) | 1991-05-09 | 1991-05-09 | Procedimento e apparecchiatura per la saldatura dei componenti su piastre di circuiti stampati mediante bagno di leghe saldanti |
EP19920105955 EP0513522A3 (en) | 1991-05-09 | 1992-04-07 | Process and apparatus for welding components on printed circuit plates by means of a solder bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI911268A IT1248383B (it) | 1991-05-09 | 1991-05-09 | Procedimento e apparecchiatura per la saldatura dei componenti su piastre di circuiti stampati mediante bagno di leghe saldanti |
Publications (3)
Publication Number | Publication Date |
---|---|
ITMI911268A0 ITMI911268A0 (it) | 1991-05-09 |
ITMI911268A1 ITMI911268A1 (it) | 1992-11-09 |
IT1248383B true IT1248383B (it) | 1995-01-11 |
Family
ID=11359868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI911268A IT1248383B (it) | 1991-05-09 | 1991-05-09 | Procedimento e apparecchiatura per la saldatura dei componenti su piastre di circuiti stampati mediante bagno di leghe saldanti |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0513522A3 (it) |
IT (1) | IT1248383B (it) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2357258A (en) * | 1999-12-15 | 2001-06-20 | Invicta Contract Eng Ltd | A wave soldering machine with means for heating liquid flux |
US10881007B2 (en) | 2017-10-04 | 2020-12-29 | International Business Machines Corporation | Recondition process for BGA using flux |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4009816A (en) * | 1975-09-02 | 1977-03-01 | Alpha Metals, Inc. | Method and apparatus for increasing efficiency of a foam fluxer used in wave soldering of printed wiring boards |
JPS54142160A (en) * | 1978-04-28 | 1979-11-06 | Hitachi Ltd | Solder coating formation |
SE458837B (sv) * | 1988-03-15 | 1989-05-16 | Ericsson Telefon Ab L M | Foerfarande foer att avlaegsna foeroreningar fraan ett foeremaal, exempelvis ett kretskort, som ska loedas |
-
1991
- 1991-05-09 IT ITMI911268A patent/IT1248383B/it active IP Right Grant
-
1992
- 1992-04-07 EP EP19920105955 patent/EP0513522A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
ITMI911268A0 (it) | 1991-05-09 |
EP0513522A2 (en) | 1992-11-19 |
EP0513522A3 (en) | 1993-02-03 |
ITMI911268A1 (it) | 1992-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted |