JPS54142160A - Solder coating formation - Google Patents

Solder coating formation

Info

Publication number
JPS54142160A
JPS54142160A JP4980678A JP4980678A JPS54142160A JP S54142160 A JPS54142160 A JP S54142160A JP 4980678 A JP4980678 A JP 4980678A JP 4980678 A JP4980678 A JP 4980678A JP S54142160 A JPS54142160 A JP S54142160A
Authority
JP
Japan
Prior art keywords
flux
water
acid
lead
oxide layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4980678A
Other languages
Japanese (ja)
Inventor
Tadashi Oshio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4980678A priority Critical patent/JPS54142160A/en
Publication of JPS54142160A publication Critical patent/JPS54142160A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: Pickling, water rinse, flux coating, drying, solder coating processes are used in treating metal surface for soldering, thereby preventing oxide layer formation so that well-soldered printed circuit is effectively produced.
CONSTITUTION: In the process of seldering external lead wire of transistors, the lead surface is first washed with nitric acid, gydrochloric acid to remove surface oxide layer followed by water rinse removing the acid. The deposited water is removed by alcohol cleaning and the surface is coated with flux (flux:thinner= 100:5 wt%). Then forced dried by cooled air, leaving no stained water spot to prevent reoxidation. The lead is next dipped into rosin based flux solution to be followed by immersion in Sn-Pb solder bath at about 250°C. The process thus eliminates conventional manual alcohol wiping to enhance work efficiency with the result that oxide formation by water is completely prevented.
COPYRIGHT: (C)1979,JPO&Japio
JP4980678A 1978-04-28 1978-04-28 Solder coating formation Pending JPS54142160A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4980678A JPS54142160A (en) 1978-04-28 1978-04-28 Solder coating formation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4980678A JPS54142160A (en) 1978-04-28 1978-04-28 Solder coating formation

Publications (1)

Publication Number Publication Date
JPS54142160A true JPS54142160A (en) 1979-11-06

Family

ID=12841370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4980678A Pending JPS54142160A (en) 1978-04-28 1978-04-28 Solder coating formation

Country Status (1)

Country Link
JP (1) JPS54142160A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0513522A2 (en) * 1991-05-09 1992-11-19 Aldo Castoldi Process and apparatus for welding components on printed circuit plates by means of a solder bath

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0513522A2 (en) * 1991-05-09 1992-11-19 Aldo Castoldi Process and apparatus for welding components on printed circuit plates by means of a solder bath
EP0513522A3 (en) * 1991-05-09 1993-02-03 Aldo Castoldi Process and apparatus for welding components on printed circuit plates by means of a solder bath

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