JPS54142160A - Solder coating formation - Google Patents
Solder coating formationInfo
- Publication number
- JPS54142160A JPS54142160A JP4980678A JP4980678A JPS54142160A JP S54142160 A JPS54142160 A JP S54142160A JP 4980678 A JP4980678 A JP 4980678A JP 4980678 A JP4980678 A JP 4980678A JP S54142160 A JPS54142160 A JP S54142160A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- water
- acid
- lead
- oxide layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE: Pickling, water rinse, flux coating, drying, solder coating processes are used in treating metal surface for soldering, thereby preventing oxide layer formation so that well-soldered printed circuit is effectively produced.
CONSTITUTION: In the process of seldering external lead wire of transistors, the lead surface is first washed with nitric acid, gydrochloric acid to remove surface oxide layer followed by water rinse removing the acid. The deposited water is removed by alcohol cleaning and the surface is coated with flux (flux:thinner= 100:5 wt%). Then forced dried by cooled air, leaving no stained water spot to prevent reoxidation. The lead is next dipped into rosin based flux solution to be followed by immersion in Sn-Pb solder bath at about 250°C. The process thus eliminates conventional manual alcohol wiping to enhance work efficiency with the result that oxide formation by water is completely prevented.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4980678A JPS54142160A (en) | 1978-04-28 | 1978-04-28 | Solder coating formation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4980678A JPS54142160A (en) | 1978-04-28 | 1978-04-28 | Solder coating formation |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54142160A true JPS54142160A (en) | 1979-11-06 |
Family
ID=12841370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4980678A Pending JPS54142160A (en) | 1978-04-28 | 1978-04-28 | Solder coating formation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54142160A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0513522A2 (en) * | 1991-05-09 | 1992-11-19 | Aldo Castoldi | Process and apparatus for welding components on printed circuit plates by means of a solder bath |
-
1978
- 1978-04-28 JP JP4980678A patent/JPS54142160A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0513522A2 (en) * | 1991-05-09 | 1992-11-19 | Aldo Castoldi | Process and apparatus for welding components on printed circuit plates by means of a solder bath |
EP0513522A3 (en) * | 1991-05-09 | 1993-02-03 | Aldo Castoldi | Process and apparatus for welding components on printed circuit plates by means of a solder bath |
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