JPS55107796A - Copper ground plating method for aluminum base basic material - Google Patents
Copper ground plating method for aluminum base basic materialInfo
- Publication number
- JPS55107796A JPS55107796A JP1570479A JP1570479A JPS55107796A JP S55107796 A JPS55107796 A JP S55107796A JP 1570479 A JP1570479 A JP 1570479A JP 1570479 A JP1570479 A JP 1570479A JP S55107796 A JPS55107796 A JP S55107796A
- Authority
- JP
- Japan
- Prior art keywords
- water
- basic material
- plating
- washing
- bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To make the thickness of the above mentioned copper plating uniform and to improve the adhesive and anticorrosive properties, by removing the surface oxidation coating of Al base basic material with a specified acid water solution and carrying out electroplating with cupurous cyanide plating solution after forming bonder substitution film.
CONSTITUTION: Al base basic material removed fat by trichloroethylene preliminarily, is washed by water and alkali etching is carried out and then, the above material is washed by water again. Next, the basic material is dipped in the water solution containing nitric acid and a small amount of sulfuric acid and oxidation film on the surface is removed. Then, the above material is dipped in the water solution containing Zn; 68wt%, Cu; 8wt%, Ni; 6wt%, so called bonder solution, after washing by water and bonder substitution film mainly composed of Zn, is formed on the surface of the basic material. Processes on and after oxidation film removal, are repeated after washing by water. High speed plating of the basic material is carried out using plating solution mainly composed of cuprous cyanide and controlling pH at 10.5W11.0 at the next process and next, regular plating is carried out. The last product plated silver or tin, is obtained drying after washing by water.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1570479A JPS5914558B2 (en) | 1979-02-14 | 1979-02-14 | Copper plating method for aluminum base material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1570479A JPS5914558B2 (en) | 1979-02-14 | 1979-02-14 | Copper plating method for aluminum base material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55107796A true JPS55107796A (en) | 1980-08-19 |
JPS5914558B2 JPS5914558B2 (en) | 1984-04-05 |
Family
ID=11896148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1570479A Expired JPS5914558B2 (en) | 1979-02-14 | 1979-02-14 | Copper plating method for aluminum base material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5914558B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7586241B2 (en) | 2005-11-24 | 2009-09-08 | Murata Manufacturing Co., Ltd. | Electroacoustic transducer |
-
1979
- 1979-02-14 JP JP1570479A patent/JPS5914558B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7586241B2 (en) | 2005-11-24 | 2009-09-08 | Murata Manufacturing Co., Ltd. | Electroacoustic transducer |
Also Published As
Publication number | Publication date |
---|---|
JPS5914558B2 (en) | 1984-04-05 |
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