JPS55107796A - Copper ground plating method for aluminum base basic material - Google Patents

Copper ground plating method for aluminum base basic material

Info

Publication number
JPS55107796A
JPS55107796A JP1570479A JP1570479A JPS55107796A JP S55107796 A JPS55107796 A JP S55107796A JP 1570479 A JP1570479 A JP 1570479A JP 1570479 A JP1570479 A JP 1570479A JP S55107796 A JPS55107796 A JP S55107796A
Authority
JP
Japan
Prior art keywords
water
basic material
plating
washing
bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1570479A
Other languages
Japanese (ja)
Other versions
JPS5914558B2 (en
Inventor
Norinaga Momose
Tomonobu Ogasawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1570479A priority Critical patent/JPS5914558B2/en
Publication of JPS55107796A publication Critical patent/JPS55107796A/en
Publication of JPS5914558B2 publication Critical patent/JPS5914558B2/en
Expired legal-status Critical Current

Links

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  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To make the thickness of the above mentioned copper plating uniform and to improve the adhesive and anticorrosive properties, by removing the surface oxidation coating of Al base basic material with a specified acid water solution and carrying out electroplating with cupurous cyanide plating solution after forming bonder substitution film.
CONSTITUTION: Al base basic material removed fat by trichloroethylene preliminarily, is washed by water and alkali etching is carried out and then, the above material is washed by water again. Next, the basic material is dipped in the water solution containing nitric acid and a small amount of sulfuric acid and oxidation film on the surface is removed. Then, the above material is dipped in the water solution containing Zn; 68wt%, Cu; 8wt%, Ni; 6wt%, so called bonder solution, after washing by water and bonder substitution film mainly composed of Zn, is formed on the surface of the basic material. Processes on and after oxidation film removal, are repeated after washing by water. High speed plating of the basic material is carried out using plating solution mainly composed of cuprous cyanide and controlling pH at 10.5W11.0 at the next process and next, regular plating is carried out. The last product plated silver or tin, is obtained drying after washing by water.
COPYRIGHT: (C)1980,JPO&Japio
JP1570479A 1979-02-14 1979-02-14 Copper plating method for aluminum base material Expired JPS5914558B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1570479A JPS5914558B2 (en) 1979-02-14 1979-02-14 Copper plating method for aluminum base material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1570479A JPS5914558B2 (en) 1979-02-14 1979-02-14 Copper plating method for aluminum base material

Publications (2)

Publication Number Publication Date
JPS55107796A true JPS55107796A (en) 1980-08-19
JPS5914558B2 JPS5914558B2 (en) 1984-04-05

Family

ID=11896148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1570479A Expired JPS5914558B2 (en) 1979-02-14 1979-02-14 Copper plating method for aluminum base material

Country Status (1)

Country Link
JP (1) JPS5914558B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7586241B2 (en) 2005-11-24 2009-09-08 Murata Manufacturing Co., Ltd. Electroacoustic transducer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7586241B2 (en) 2005-11-24 2009-09-08 Murata Manufacturing Co., Ltd. Electroacoustic transducer

Also Published As

Publication number Publication date
JPS5914558B2 (en) 1984-04-05

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