JPS5484835A - Surface treatment of al and al alloy for soldering - Google Patents
Surface treatment of al and al alloy for solderingInfo
- Publication number
- JPS5484835A JPS5484835A JP15171077A JP15171077A JPS5484835A JP S5484835 A JPS5484835 A JP S5484835A JP 15171077 A JP15171077 A JP 15171077A JP 15171077 A JP15171077 A JP 15171077A JP S5484835 A JPS5484835 A JP S5484835A
- Authority
- JP
- Japan
- Prior art keywords
- water
- washed
- plating
- sec
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000838 Al alloy Inorganic materials 0.000 title 1
- 238000005476 soldering Methods 0.000 title 1
- 238000004381 surface treatment Methods 0.000 title 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 5
- 238000007747 plating Methods 0.000 abstract 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 238000005260 corrosion Methods 0.000 abstract 2
- 230000007797 corrosion Effects 0.000 abstract 2
- 229910017604 nitric acid Inorganic materials 0.000 abstract 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910001096 P alloy Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 1
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 abstract 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 abstract 1
- 239000001509 sodium citrate Substances 0.000 abstract 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 abstract 1
- 235000011121 sodium hydroxide Nutrition 0.000 abstract 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/026—Deposition of sublayers, e.g. adhesion layers or pre-applied alloying elements or corrosion protection
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
PURPOSE:To raise adhesion, corrosion resistance, and solderability by the procedure in which a pretreatment for plating is made, then Zn-replacement is made, then a nickel-phosphorus alloy plating is applied, and then a solderable copper plating is made. CONSTITUTION:In the first place, a part to be treated is cleansed with Trichlene, etched with 5% caustic soda at 40 deg.C for 10 sec., and then washed with water. Then, it is treated for smut removal with nitric acid at ordinary temperature for approx. 30 sec., and then dipped, after sufficient water washing, in a Zn-replacement solution at 15 to 25 deg.C for 1 min. to form Zn film and then washed with water. Then, it is treated with nitric acid for the removal of Zn film at ordinary temperature for 30 sec. and then washed with water and subsequently dipped in a solution containing 30 g/l nickel nitrate, 15 g/l sodium hypophosphite, and 10 g/l sodium citrate at 90 deg.C for 5 min. to form Ni film approx. 0.5 microns in thick with P crystals. Afterwards, it is washed with water and then coated with solderable Cu plating. Thus, the enhancement of adhesion, corrosion resistance, and solderability can be attained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52151710A JPS6015706B2 (en) | 1977-12-19 | 1977-12-19 | Surface treatment method of Al and Al alloy for soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52151710A JPS6015706B2 (en) | 1977-12-19 | 1977-12-19 | Surface treatment method of Al and Al alloy for soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5484835A true JPS5484835A (en) | 1979-07-06 |
| JPS6015706B2 JPS6015706B2 (en) | 1985-04-20 |
Family
ID=15524569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52151710A Expired JPS6015706B2 (en) | 1977-12-19 | 1977-12-19 | Surface treatment method of Al and Al alloy for soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6015706B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58187260A (en) * | 1982-04-26 | 1983-11-01 | Mitsubishi Electric Corp | Solder sticking method to aluminum metal |
| EP0153369A1 (en) * | 1983-08-22 | 1985-09-04 | Enthone | Electroless nickel plating of aluminum. |
| JPH01201484A (en) * | 1987-10-06 | 1989-08-14 | Hitachi Ltd | Chemical nickel plating liquid and method of using said liquid |
| CN102226283A (en) * | 2011-05-18 | 2011-10-26 | 王定志 | Surface treatment method of spray gun |
| JP2015010233A (en) * | 2013-06-26 | 2015-01-19 | 富士電機機器制御株式会社 | Aluminum conductor for electrification |
| CN105803432A (en) * | 2016-03-15 | 2016-07-27 | 国网安徽省电力公司电力科学研究院 | Preparation method for Cu/Al composite board with Ni-P alloy layer as interfacial barrier layer |
-
1977
- 1977-12-19 JP JP52151710A patent/JPS6015706B2/en not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58187260A (en) * | 1982-04-26 | 1983-11-01 | Mitsubishi Electric Corp | Solder sticking method to aluminum metal |
| EP0153369A1 (en) * | 1983-08-22 | 1985-09-04 | Enthone | Electroless nickel plating of aluminum. |
| JPH01201484A (en) * | 1987-10-06 | 1989-08-14 | Hitachi Ltd | Chemical nickel plating liquid and method of using said liquid |
| CN102226283A (en) * | 2011-05-18 | 2011-10-26 | 王定志 | Surface treatment method of spray gun |
| JP2015010233A (en) * | 2013-06-26 | 2015-01-19 | 富士電機機器制御株式会社 | Aluminum conductor for electrification |
| CN105803432A (en) * | 2016-03-15 | 2016-07-27 | 国网安徽省电力公司电力科学研究院 | Preparation method for Cu/Al composite board with Ni-P alloy layer as interfacial barrier layer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6015706B2 (en) | 1985-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE2014285C3 (en) | Process for preparing aluminum or aluminum alloy surfaces for electroless nickel plating | |
| DE797690T1 (en) | PRODUCTION OF PRINTED CIRCUITS | |
| US2734837A (en) | Surface treatment of titanium or | |
| US2662831A (en) | Method of bonding copper to aluminum or aluminum alloys | |
| JPS5484835A (en) | Surface treatment of al and al alloy for soldering | |
| EP0190465A3 (en) | Process for electroplating amorphous alloys | |
| DE2555257A1 (en) | CATALYST SOLUTION | |
| JP3276765B2 (en) | Method of forming electrode terminals of chip fixed resistor | |
| DE3322156C2 (en) | Acid chemical tinning bath | |
| JPS597359B2 (en) | Metsuki method | |
| JPS5858296A (en) | Method for plating stainless steel blank with gold | |
| JPS57140891A (en) | Pretreating solution for silver plating | |
| GB1007252A (en) | Electroplating on aluminium and its alloys | |
| JPS6340864B2 (en) | ||
| GB593763A (en) | Improvements in or relating to processes for covering the surfaces of aluminium or aluminium alloy articles with adherent and protective metallic coatings | |
| JPS6047913B2 (en) | How to apply gold plating directly to stainless steel | |
| SU382774A1 (en) | ^ Ya-; l &: -; sesh | |
| DE2448148C3 (en) | ||
| JPS6436788A (en) | Pretreatment for plating titanium material with noble metal | |
| DE2215364C3 (en) | Process for gold-plating tungsten or molybdenum electrodes | |
| DE1812040C3 (en) | Process for chemical nickel plating of the surfaces of aluminum and aluminum alloys | |
| GB1464048A (en) | Processes for the manufacture of aluminium articles coated with metals | |
| JPH02281749A (en) | Manufacture of lead frame | |
| JPS57188664A (en) | Electroless plating method for insulation substrate | |
| JPS55107796A (en) | Copper ground plating method for aluminum base basic material |