JPS6456884A - Chemical polishing method for copper and copper alloy - Google Patents

Chemical polishing method for copper and copper alloy

Info

Publication number
JPS6456884A
JPS6456884A JP21408387A JP21408387A JPS6456884A JP S6456884 A JPS6456884 A JP S6456884A JP 21408387 A JP21408387 A JP 21408387A JP 21408387 A JP21408387 A JP 21408387A JP S6456884 A JPS6456884 A JP S6456884A
Authority
JP
Japan
Prior art keywords
soln
copper
oxide
acidic
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21408387A
Other languages
Japanese (ja)
Inventor
Hideji Sagara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP21408387A priority Critical patent/JPS6456884A/en
Publication of JPS6456884A publication Critical patent/JPS6456884A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To improve the glossiness of a product and reliability in finishing by using a mixture of sulfuric acid and an org. carboxylic acid as an acidic soln. in the method wherein an oxide coating film is formed on a copper material degreased with an alkaline soln. and the film is removed by the acidic soln. CONSTITUTION:The copper and copper alloy are degreased with an alkaline soln. to regulate the surface roughness and to clean the surface, then washed with water, and pickled. The material thus treated is dipped in a lustering soln. consisting essentially of an acidic soln. such as H2O2 to form an oxide on the material surface. The material is then washed with a large amt. of pure water, and then dipped in a brightening soln. consisting of a mixture of sulfuric acid and an org. carboxylic acid such as formic acid and acetic acid. By this method, the films of both cuprous oxide and cupric oxide can be removed from the material irrespective of the size and shape of the material, the films are evenly removed, and an excellent finished product exhibiting high glossiness can be obtained.
JP21408387A 1987-08-27 1987-08-27 Chemical polishing method for copper and copper alloy Pending JPS6456884A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21408387A JPS6456884A (en) 1987-08-27 1987-08-27 Chemical polishing method for copper and copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21408387A JPS6456884A (en) 1987-08-27 1987-08-27 Chemical polishing method for copper and copper alloy

Publications (1)

Publication Number Publication Date
JPS6456884A true JPS6456884A (en) 1989-03-03

Family

ID=16649956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21408387A Pending JPS6456884A (en) 1987-08-27 1987-08-27 Chemical polishing method for copper and copper alloy

Country Status (1)

Country Link
JP (1) JPS6456884A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105648493A (en) * 2014-11-14 2016-06-08 陕西飞机工业（集团）有限公司 Preprocessing method for copper and copper alloy brazing parts before silver plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105648493A (en) * 2014-11-14 2016-06-08 陕西飞机工业（集团）有限公司 Preprocessing method for copper and copper alloy brazing parts before silver plating

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