JPS57161086A - Manufacture of cu and cu alloy plate and bar to be plated with metal - Google Patents

Manufacture of cu and cu alloy plate and bar to be plated with metal

Info

Publication number
JPS57161086A
JPS57161086A JP4822081A JP4822081A JPS57161086A JP S57161086 A JPS57161086 A JP S57161086A JP 4822081 A JP4822081 A JP 4822081A JP 4822081 A JP4822081 A JP 4822081A JP S57161086 A JPS57161086 A JP S57161086A
Authority
JP
Japan
Prior art keywords
rolling
plated
annealing
remove
bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4822081A
Other languages
Japanese (ja)
Other versions
JPS6017838B2 (en
Inventor
Rensei Futatsuka
Akito Okamura
Mitsuzo Motoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP4822081A priority Critical patent/JPS6017838B2/en
Publication of JPS57161086A publication Critical patent/JPS57161086A/en
Publication of JPS6017838B2 publication Critical patent/JPS6017838B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)

Abstract

PURPOSE: To prevent the occurrence of blister on a plated surface by chemically polishing a Cu or Cu alloy ingot after annealing in the final stage of a cold rolling process, subjecting it to final finish rolling, and carrying out degreasing to remove the stuck rolling oil and chemically polishing compound.
CONSTITUTION: A Cu or Cu alloy ingot is cold rolled by repeating annealing, pickling and rolling as a cycle. After annealing in the final stage of the cold rolling process the rolled ingot is chemically polished by dipping in a mixed soln. consisting of sulfuric acid, nitric acid and water to thoroughly remove a metallic oxide film or its analogue formed on the surface. It is continuously subjected to final rolling and degreased to remove the stuck rolling oil and chemically polishing compound. When the resulting Cu or Cu alloy plate or bar is plated with Ag or the like, blister is not caused to the plated surface.
COPYRIGHT: (C)1982,JPO&Japio
JP4822081A 1981-03-31 1981-03-31 Method for manufacturing Cu and Cu alloy plates and strips to which metal plating is applied Expired JPS6017838B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4822081A JPS6017838B2 (en) 1981-03-31 1981-03-31 Method for manufacturing Cu and Cu alloy plates and strips to which metal plating is applied

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4822081A JPS6017838B2 (en) 1981-03-31 1981-03-31 Method for manufacturing Cu and Cu alloy plates and strips to which metal plating is applied

Publications (2)

Publication Number Publication Date
JPS57161086A true JPS57161086A (en) 1982-10-04
JPS6017838B2 JPS6017838B2 (en) 1985-05-07

Family

ID=12797325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4822081A Expired JPS6017838B2 (en) 1981-03-31 1981-03-31 Method for manufacturing Cu and Cu alloy plates and strips to which metal plating is applied

Country Status (1)

Country Link
JP (1) JPS6017838B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3828700A1 (en) * 1987-09-16 1989-04-06 Nat Semiconductor Corp COPPER PLATED PAPER FRAME FOR SEMICONDUCTOR PLASTIC HOUSING
JPH01159397A (en) * 1987-12-16 1989-06-22 Nippon Mining Co Ltd Production of tin or tin alloy plated material subjected to reflow treatment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3828700A1 (en) * 1987-09-16 1989-04-06 Nat Semiconductor Corp COPPER PLATED PAPER FRAME FOR SEMICONDUCTOR PLASTIC HOUSING
DE3828700C2 (en) * 1987-09-16 2002-04-18 Nat Semiconductor Corp Copper plated lead frame for semiconductor plastic packages
JPH01159397A (en) * 1987-12-16 1989-06-22 Nippon Mining Co Ltd Production of tin or tin alloy plated material subjected to reflow treatment

Also Published As

Publication number Publication date
JPS6017838B2 (en) 1985-05-07

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