JPS57161086A - Manufacture of cu and cu alloy plate and bar to be plated with metal - Google Patents
Manufacture of cu and cu alloy plate and bar to be plated with metalInfo
- Publication number
- JPS57161086A JPS57161086A JP4822081A JP4822081A JPS57161086A JP S57161086 A JPS57161086 A JP S57161086A JP 4822081 A JP4822081 A JP 4822081A JP 4822081 A JP4822081 A JP 4822081A JP S57161086 A JPS57161086 A JP S57161086A
- Authority
- JP
- Japan
- Prior art keywords
- rolling
- plated
- annealing
- remove
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Abstract
PURPOSE: To prevent the occurrence of blister on a plated surface by chemically polishing a Cu or Cu alloy ingot after annealing in the final stage of a cold rolling process, subjecting it to final finish rolling, and carrying out degreasing to remove the stuck rolling oil and chemically polishing compound.
CONSTITUTION: A Cu or Cu alloy ingot is cold rolled by repeating annealing, pickling and rolling as a cycle. After annealing in the final stage of the cold rolling process the rolled ingot is chemically polished by dipping in a mixed soln. consisting of sulfuric acid, nitric acid and water to thoroughly remove a metallic oxide film or its analogue formed on the surface. It is continuously subjected to final rolling and degreased to remove the stuck rolling oil and chemically polishing compound. When the resulting Cu or Cu alloy plate or bar is plated with Ag or the like, blister is not caused to the plated surface.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4822081A JPS6017838B2 (en) | 1981-03-31 | 1981-03-31 | Method for manufacturing Cu and Cu alloy plates and strips to which metal plating is applied |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4822081A JPS6017838B2 (en) | 1981-03-31 | 1981-03-31 | Method for manufacturing Cu and Cu alloy plates and strips to which metal plating is applied |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57161086A true JPS57161086A (en) | 1982-10-04 |
JPS6017838B2 JPS6017838B2 (en) | 1985-05-07 |
Family
ID=12797325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4822081A Expired JPS6017838B2 (en) | 1981-03-31 | 1981-03-31 | Method for manufacturing Cu and Cu alloy plates and strips to which metal plating is applied |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6017838B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3828700A1 (en) * | 1987-09-16 | 1989-04-06 | Nat Semiconductor Corp | COPPER PLATED PAPER FRAME FOR SEMICONDUCTOR PLASTIC HOUSING |
JPH01159397A (en) * | 1987-12-16 | 1989-06-22 | Nippon Mining Co Ltd | Production of tin or tin alloy plated material subjected to reflow treatment |
-
1981
- 1981-03-31 JP JP4822081A patent/JPS6017838B2/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3828700A1 (en) * | 1987-09-16 | 1989-04-06 | Nat Semiconductor Corp | COPPER PLATED PAPER FRAME FOR SEMICONDUCTOR PLASTIC HOUSING |
DE3828700C2 (en) * | 1987-09-16 | 2002-04-18 | Nat Semiconductor Corp | Copper plated lead frame for semiconductor plastic packages |
JPH01159397A (en) * | 1987-12-16 | 1989-06-22 | Nippon Mining Co Ltd | Production of tin or tin alloy plated material subjected to reflow treatment |
Also Published As
Publication number | Publication date |
---|---|
JPS6017838B2 (en) | 1985-05-07 |
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