JPS57203792A - Production of metal plated cu, cu alloy plate and rod material - Google Patents
Production of metal plated cu, cu alloy plate and rod materialInfo
- Publication number
- JPS57203792A JPS57203792A JP8548382A JP8548382A JPS57203792A JP S57203792 A JPS57203792 A JP S57203792A JP 8548382 A JP8548382 A JP 8548382A JP 8548382 A JP8548382 A JP 8548382A JP S57203792 A JPS57203792 A JP S57203792A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- subjected
- annealing
- rolling
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To make the formation of plating films which are entirely free from generation of blisters on the metal-plated surfaces by subjecting plate materials and rod materials of Cu or Cu alloys to chemical polishing prior to final finishing of cold rolling.
CONSTITUTION: A cast ingot of Cu is hot-rolled to a plate-like blank material. This material is descaled by facing to a required plate thickness; further, in a cold rolling stage, it is subjected repeatedly to rolling-annealing-pickling to the plate thickness prior to finish rolling, after which it is subjected to annealing of the final stage and is further removed thoroughly of the metallic oxide films formed during said annealing by a chemical polishing treatment wherein it is treated with an acidic soln. of extremely strong oxidative property such as a bright treating soln. This is further subjected to finish rolling, whereby the Cu plate material of a desired thickness is obtained. This plate mateial is subjected to pretreatments such as degreasing, etching or the like, then to electroplating of desired metals, whereby the metal-plated Cu plate material is obtd.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8548382A JPS57203792A (en) | 1982-05-20 | 1982-05-20 | Production of metal plated cu, cu alloy plate and rod material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8548382A JPS57203792A (en) | 1982-05-20 | 1982-05-20 | Production of metal plated cu, cu alloy plate and rod material |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4843479A Division JPS55141591A (en) | 1979-04-19 | 1979-04-19 | Manufacture of metal plating cu and cu alloy plate and filament material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57203792A true JPS57203792A (en) | 1982-12-14 |
JPS6114234B2 JPS6114234B2 (en) | 1986-04-17 |
Family
ID=13860155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8548382A Granted JPS57203792A (en) | 1982-05-20 | 1982-05-20 | Production of metal plated cu, cu alloy plate and rod material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57203792A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61201762A (en) * | 1985-03-05 | 1986-09-06 | Furukawa Electric Co Ltd:The | Manufacture of bar material for electronic equipment part |
DE3828700A1 (en) * | 1987-09-16 | 1989-04-06 | Nat Semiconductor Corp | COPPER PLATED PAPER FRAME FOR SEMICONDUCTOR PLASTIC HOUSING |
-
1982
- 1982-05-20 JP JP8548382A patent/JPS57203792A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61201762A (en) * | 1985-03-05 | 1986-09-06 | Furukawa Electric Co Ltd:The | Manufacture of bar material for electronic equipment part |
DE3828700A1 (en) * | 1987-09-16 | 1989-04-06 | Nat Semiconductor Corp | COPPER PLATED PAPER FRAME FOR SEMICONDUCTOR PLASTIC HOUSING |
DE3828700C2 (en) * | 1987-09-16 | 2002-04-18 | Nat Semiconductor Corp | Copper plated lead frame for semiconductor plastic packages |
Also Published As
Publication number | Publication date |
---|---|
JPS6114234B2 (en) | 1986-04-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5759307A (en) | Method of producing a cold-rolled strip in one pass | |
JPH0225430B2 (en) | ||
US2904413A (en) | Process of bright dipping zinc base alloys | |
JPS62161915A (en) | Manufacture of grain-oriented silicon steel sheet with superlow iron loss | |
US4786337A (en) | Method of treating aluminum-lithium alloys | |
JPS57203792A (en) | Production of metal plated cu, cu alloy plate and rod material | |
US2271375A (en) | Process of coating metal surfaces | |
JPS56102562A (en) | Manufacture of al alloy plate for packing | |
US3832147A (en) | Composite article comprising three dissimilar metals | |
JPS56102565A (en) | Manufacture of al alloy plate for packing | |
US2383434A (en) | Oxidation removing process | |
JPS63174748A (en) | Method for continuous drawing of ti and ti alloy wire rod for cold forging | |
US2462197A (en) | Etching method | |
JPS56127762A (en) | Preparation of aluminum alloy plated steel plate with excellent corrosion resistance and processability | |
US2213952A (en) | Process for treating metal surfaces | |
US2109675A (en) | Method of eliminating embrittlement and corrosion of pickled metal | |
JPS57161086A (en) | Manufacture of cu and cu alloy plate and bar to be plated with metal | |
US2601864A (en) | Composition for and method of descaling metal parts | |
JPS61210125A (en) | Manufacture of grain-oriented silicon steel sheet having extremely superior magnetic property | |
CN114574685B (en) | Method for regulating and controlling surface and mechanical properties of short-process continuous casting and rolling plain carbon steel hot rolled strip steel | |
JPS5741394A (en) | Post treatment method for continuous annealed material | |
JPS63282293A (en) | Electroplating method for stainless steel sheet with zn, ni, or cu | |
US2918415A (en) | Antimony plating process | |
JPS57154312A (en) | Manufacture of wire rod of titanium or titanium alloy | |
SU953017A1 (en) | Solution for electrochemical working of brass articles |