JPS57203792A - Production of metal plated cu, cu alloy plate and rod material - Google Patents

Production of metal plated cu, cu alloy plate and rod material

Info

Publication number
JPS57203792A
JPS57203792A JP8548382A JP8548382A JPS57203792A JP S57203792 A JPS57203792 A JP S57203792A JP 8548382 A JP8548382 A JP 8548382A JP 8548382 A JP8548382 A JP 8548382A JP S57203792 A JPS57203792 A JP S57203792A
Authority
JP
Japan
Prior art keywords
plate
subjected
annealing
rolling
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8548382A
Other languages
Japanese (ja)
Other versions
JPS6114234B2 (en
Inventor
Akito Okamura
Mitsuzo Motoki
Rensei Futatsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP8548382A priority Critical patent/JPS57203792A/en
Publication of JPS57203792A publication Critical patent/JPS57203792A/en
Publication of JPS6114234B2 publication Critical patent/JPS6114234B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To make the formation of plating films which are entirely free from generation of blisters on the metal-plated surfaces by subjecting plate materials and rod materials of Cu or Cu alloys to chemical polishing prior to final finishing of cold rolling.
CONSTITUTION: A cast ingot of Cu is hot-rolled to a plate-like blank material. This material is descaled by facing to a required plate thickness; further, in a cold rolling stage, it is subjected repeatedly to rolling-annealing-pickling to the plate thickness prior to finish rolling, after which it is subjected to annealing of the final stage and is further removed thoroughly of the metallic oxide films formed during said annealing by a chemical polishing treatment wherein it is treated with an acidic soln. of extremely strong oxidative property such as a bright treating soln. This is further subjected to finish rolling, whereby the Cu plate material of a desired thickness is obtained. This plate mateial is subjected to pretreatments such as degreasing, etching or the like, then to electroplating of desired metals, whereby the metal-plated Cu plate material is obtd.
COPYRIGHT: (C)1982,JPO&Japio
JP8548382A 1982-05-20 1982-05-20 Production of metal plated cu, cu alloy plate and rod material Granted JPS57203792A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8548382A JPS57203792A (en) 1982-05-20 1982-05-20 Production of metal plated cu, cu alloy plate and rod material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8548382A JPS57203792A (en) 1982-05-20 1982-05-20 Production of metal plated cu, cu alloy plate and rod material

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP4843479A Division JPS55141591A (en) 1979-04-19 1979-04-19 Manufacture of metal plating cu and cu alloy plate and filament material

Publications (2)

Publication Number Publication Date
JPS57203792A true JPS57203792A (en) 1982-12-14
JPS6114234B2 JPS6114234B2 (en) 1986-04-17

Family

ID=13860155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8548382A Granted JPS57203792A (en) 1982-05-20 1982-05-20 Production of metal plated cu, cu alloy plate and rod material

Country Status (1)

Country Link
JP (1) JPS57203792A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61201762A (en) * 1985-03-05 1986-09-06 Furukawa Electric Co Ltd:The Manufacture of bar material for electronic equipment part
DE3828700A1 (en) * 1987-09-16 1989-04-06 Nat Semiconductor Corp COPPER PLATED PAPER FRAME FOR SEMICONDUCTOR PLASTIC HOUSING

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61201762A (en) * 1985-03-05 1986-09-06 Furukawa Electric Co Ltd:The Manufacture of bar material for electronic equipment part
DE3828700A1 (en) * 1987-09-16 1989-04-06 Nat Semiconductor Corp COPPER PLATED PAPER FRAME FOR SEMICONDUCTOR PLASTIC HOUSING
DE3828700C2 (en) * 1987-09-16 2002-04-18 Nat Semiconductor Corp Copper plated lead frame for semiconductor plastic packages

Also Published As

Publication number Publication date
JPS6114234B2 (en) 1986-04-17

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