CN105648493A - Preprocessing method for copper and copper alloy brazing parts before silver plating - Google Patents
Preprocessing method for copper and copper alloy brazing parts before silver plating Download PDFInfo
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- CN105648493A CN105648493A CN201410649458.XA CN201410649458A CN105648493A CN 105648493 A CN105648493 A CN 105648493A CN 201410649458 A CN201410649458 A CN 201410649458A CN 105648493 A CN105648493 A CN 105648493A
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Abstract
The invention provides a preprocessing method for copper and copper alloy brazing parts before silver plating. The preprocessing method comprises the following steps that A, the parts are processed according to HB/Z5074 before brazing; B, the parts are brazed, and welded joints are polished; C, the parts are sequentially subjected to inspection and acceptance before plating, degreasing through an organic solvent, hanging, chemical degreasing, cleaning through flowing hot water cleaning and cleaning through flowing cold water according to the traditional HB/Z5074 technological procedure; D, the parts are subjected to bright dipping treatment; and E, the parts are subjected to activating treatment. The copper and copper alloy brazing parts required to be silver-plated are preprocessed according to the technological method, a blackening phenomena occurring at the edges of the welded joints is avoided; meanwhile, the problem that a plurality of pinholes exist in the surface of plating is solved, the appearance, the binding force and the electrical conductivity of the silver plating all meet requirements, and the quality is further improved.
Description
Technical field
The invention belongs to field of material surface modification, particularly to a kind of copper and the silver-plated front preprocess method of copper alloy soldered component
Background technology
Some aviation copper alloy parts requires to do silver-plated process after brazing to ensure its satisfactory electrical conductivity. Ensure silvering quality, pretreatment before silver-plated is extremely important, if the silver-plated front pretreatment of part is bad, will directly affect silver coating quality, cause the outward appearance of part, adhesion, electric conductivity and antiseptic property not to reach requirement, finally affect payment and the use of part.
If requiring after we have found that soldering aborning that silver-plated copper alloy parts directly carries out silver-plated front pretreatment by navigation mark HB/Z5074 " electrosilvering technique ", capital occurs turning black in commissure, by HB5074 through silver-plated in advance or leaching silver after silver-plated, the blackout of commissure all cannot hide, and have more pin hole, cause part to pay. It is silver-plated that the preprocessing technical method of HB5074 is not suitable for brazed copper part.
Finding that part all can occur that weld seam turns black in pre-etching solution and three acid gloss etch solution through test, the material of this pitchy is the mixture of Argentous sulfide. and silver oxide, all cannot remove in follow-up washing and acid treating solution.
Although copper part is had by three acid etch used by HB/Z5074 pre-treatment well goes out light action, but there will be pitchy in commissure, by attempting a lot of formula, we have found that copper alloy is had to the solution of good light-out effect is many makes commissure blackout occur because of strong oxidisability through test of many times; Although the more weak solution of acid or oxidisability does not result in weld seam blackout, but the gloss finish effect of part is bad, affect silver-plated after adhesion and outward appearance, and sulphuric acid also can butt welded seam place color impact.
The pretreating process flow process of HB/Z5074:
Technological process
A. check and accept before plating
B. with trichloroethylene steam or other Solvent degreasing
C. extension is filled
D. electrochemical deoiling
Tank liquor formula:
Technological parameter:
Temperature 70 C��90 DEG C
Process time oil only eliminates.
DEG C e.70��washing 1min��the 5min of 90 DEG C;
F. room temperature washing 1min��2min;
G. pre-etch
Tank liquor formula
Sulphuric acid 50g/l��80g/l
Hydrochloric acid 20g/l��30g/l
H. room temperature washing 1min��2min;
I. bright pickling
Tank liquor formula:
Sulphuric acid 502ml
Hydrochloric acid 3ml
Nitric acid 139ml
Technological parameter:
Temperature room temperature
Time 2s��30s
J. room temperature washing 1min��2min;
K. weak corrosion
Tank liquor formula
Sulphuric acid (hydrochloric acid) 100g/l��150g/l
H. room temperature washing 1min��2min;
L. room temperature washing 1min��2min;
Summary of the invention
It is an object of the invention to: solve copper and copper alloy soldered component by the pretreating process before general copper alloy plating carry out silver-plated before pretreatment time produce weld seam blackout problem.
Technical solution of the present invention provides a kind of copper and the silver-plated front preprocess method of copper alloy soldered component, comprises the following steps:
A, before carrying out soldering first to part by HB/Z5074 process;
B, soldered component butt welded seam carry out grinding process;
C, does part order according to HB/Z5074 conventional process flow: examination before plating, Solvent degreasing, dress extension, electrochemical deoiling, flowing hot water wash, flowing cool water wash operation;
D, makes optical processing to part;
E, does activation processing to part.
Preferably, the tank liquor formula that described step D uses is: chromic anhydride 280g/l��300g/l, sulphuric acid 20g/l��30g/l, and surplus is water; Technological parameter is: at room temperature process 5s��10s.
Preferably, the tank liquor formula that described step E uses is: hydrochloric acid 45%��55% (volume ratio), and surplus is water; Technological parameter is: at room temperature process 3s��6s.
Preferably, the tank liquor formula that described step D uses is: chromic anhydride 290g/l, sulphuric acid 20g/l; The tank liquor formula that described step E uses is: hydrochloric acid 50% (volume ratio), surplus is water.
It is an advantage of the current invention that, by this process, the silver-plated copper of requirement and copper alloy soldered component are carried out pretreatment, no longer there is blackout phenomenon in weld edge, solve the problem that coating surface exists more pin hole simultaneously, silvering outward appearance, adhesion and electric conductivity all can reach requirement, and quality obtains further raising.
Accompanying drawing explanation
Below accompanying drawing of the present invention is illustrated:
Fig. 1 is the silver-plated front preprocess method flow chart of copper alloy soldered component.
Detailed description of the invention
The embodiment of the present invention provides the preferred version of a kind of copper and the silver-plated front preprocess method of copper alloy soldered component, comprises the following steps:
A, before carrying out soldering first to part by HB/Z5074 process; It is poor that this operation is primarily directed to piece surface state, has the part of thick and heavy oxide skin. First go before brazing part is processed glossy condition, it is to avoid after having welded, carry out the weld seam blackout phenomenon that three acid gloss finish cause.
B, soldered component butt welded seam carry out grinding process. After soldering, butt welded seam carries out grinding process, polishes clean by solder and welding agent, can reduce pin hole and occur.
C, plates front examination according to HB/Z5074 conventional process flow, Solvent degreasing, dress extension, electrochemical deoiling, flowing hot water wash, flowing cool water wash operation to part.
D, makes optical processing and cleans with flowing cool water part, and light output groove formula of liquid and technological parameter are as follows:
Tank liquor formula:
Chromic anhydride 280g/l��300g/l
Sulphuric acid 20g/l��30g/l
Technological parameter:
Temperature room temperature
Process time 5s��10s
Carrying out optical processing by the tank liquor of this operation and parameter, commissure does not have blackout phenomenon.Should strictly controlling during process the light time, overlong time can cause commissure variable color, and the time is too short does not have out light action. Preferably, light output groove formula of liquid is chromic anhydride 290g/l, and sulphuric acid 20g/l surplus is water.
E, does activation processing and cleans with flowing cool water part, and tank liquor formula and technological parameter are as follows:
Tank liquor formula (volume ratio):
Hydrochloric acid 45%��55%
Water surplus
Technological parameter:
Temperature room temperature
Time 3s��6s
Both do not had blackout with the part after hydrochloric acid activation, the front activation to piece surface of leaching silver can have been played simultaneously. Preferably, activated bath formula of liquid is: hydrochloric acid 50% (volume ratio), and surplus is water.
Claims (4)
1. a copper and the silver-plated front preprocess method of copper alloy soldered component, it is characterised in that comprise the following steps:
A, before carrying out soldering first to part by HB/Z5074 process;
B, soldered component butt welded seam carry out grinding process;
C, does part order according to HB/Z5074 conventional process flow: examination before plating, Solvent degreasing, dress extension, electrochemical deoiling, flowing hot water wash, flowing cool water wash operation;
D, makes optical processing to part;
E, does activation processing to part.
2. method according to claim 1, it is characterised in that the tank liquor formula that described step D uses is: chromic anhydride 280g/l��300g/l, sulphuric acid 20g/l��30g/l, and surplus is water; Technological parameter is: at room temperature process 5s��10s.
3. method according to claim 2, it is characterised in that the tank liquor formula that described step E uses is: hydrochloric acid 45%��55% (volume ratio), and surplus is water; Technological parameter is: at room temperature process 3s��6s.
4. method according to claim 3, it is characterised in that the tank liquor formula that described step D uses is: chromic anhydride 290g/l, sulphuric acid 20g/l; The tank liquor formula that described step E uses is: hydrochloric acid 50% (volume ratio), surplus is water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410649458.XA CN105648493A (en) | 2014-11-14 | 2014-11-14 | Preprocessing method for copper and copper alloy brazing parts before silver plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410649458.XA CN105648493A (en) | 2014-11-14 | 2014-11-14 | Preprocessing method for copper and copper alloy brazing parts before silver plating |
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| Publication Number | Publication Date |
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| CN105648493A true CN105648493A (en) | 2016-06-08 |
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| CN201410649458.XA Pending CN105648493A (en) | 2014-11-14 | 2014-11-14 | Preprocessing method for copper and copper alloy brazing parts before silver plating |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110592573A (en) * | 2019-10-23 | 2019-12-20 | 中国航发贵州红林航空动力控制科技有限公司 | Chemical passivation process method for copper and copper alloy thin-wall parts |
| CN111155124A (en) * | 2020-01-06 | 2020-05-15 | 中航力源液压股份有限公司 | Copper alloy surface cleaning method |
| CN112609220A (en) * | 2020-12-10 | 2021-04-06 | 西安铁路信号有限责任公司 | Method for surface pretreatment of relay copper alloy part |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6456884A (en) * | 1987-08-27 | 1989-03-03 | Dainippon Printing Co Ltd | Chemical polishing method for copper and copper alloy |
| CN101008095A (en) * | 2006-09-27 | 2007-08-01 | 沈阳飞机工业（集团）有限公司 | Pulse silver-coating method |
| CN103789802A (en) * | 2014-02-28 | 2014-05-14 | 西安交通大学 | Electrosilvering method after copper base surface nanocrystallization processing |
-
2014
- 2014-11-14 CN CN201410649458.XA patent/CN105648493A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6456884A (en) * | 1987-08-27 | 1989-03-03 | Dainippon Printing Co Ltd | Chemical polishing method for copper and copper alloy |
| CN101008095A (en) * | 2006-09-27 | 2007-08-01 | 沈阳飞机工业（集团）有限公司 | Pulse silver-coating method |
| CN103789802A (en) * | 2014-02-28 | 2014-05-14 | 西安交通大学 | Electrosilvering method after copper base surface nanocrystallization processing |
Non-Patent Citations (3)
| Title |
|---|
| 中国航空工业总公司: "《电镀银工艺 HB/Z 5074-93》", 31 July 1994, 中国航空工业总公司第三零一研究所 * |
| 付明: ""铍青铜零件电镀银的前处理工艺改进"", 《电镀与涂饰》 * |
| 王娟等: "《钎焊及扩散焊技术》", 30 March 2013, 化学工业出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110592573A (en) * | 2019-10-23 | 2019-12-20 | 中国航发贵州红林航空动力控制科技有限公司 | Chemical passivation process method for copper and copper alloy thin-wall parts |
| CN111155124A (en) * | 2020-01-06 | 2020-05-15 | 中航力源液压股份有限公司 | Copper alloy surface cleaning method |
| CN111155124B (en) * | 2020-01-06 | 2022-04-22 | 中航力源液压股份有限公司 | Copper alloy surface cleaning method |
| CN112609220A (en) * | 2020-12-10 | 2021-04-06 | 西安铁路信号有限责任公司 | Method for surface pretreatment of relay copper alloy part |
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