IT1139570B - Metodo per formare un collegamento mediante un filo metallico - Google Patents

Metodo per formare un collegamento mediante un filo metallico

Info

Publication number
IT1139570B
IT1139570B IT24731/81A IT2473181A IT1139570B IT 1139570 B IT1139570 B IT 1139570B IT 24731/81 A IT24731/81 A IT 24731/81A IT 2473181 A IT2473181 A IT 2473181A IT 1139570 B IT1139570 B IT 1139570B
Authority
IT
Italy
Prior art keywords
connection
metallic wire
metallic
wire
Prior art date
Application number
IT24731/81A
Other languages
English (en)
Italian (it)
Other versions
IT8124731A0 (it
Inventor
De Pas Hermanus Antonius Van
Johannes Bernardus Pet Janssen
Wilhelmus Jan Jacob Lorenz
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of IT8124731A0 publication Critical patent/IT8124731A0/it
Application granted granted Critical
Publication of IT1139570B publication Critical patent/IT1139570B/it

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Classifications

    • HELECTRICITY
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    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
IT24731/81A 1980-10-29 1981-10-27 Metodo per formare un collegamento mediante un filo metallico IT1139570B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8005922A NL8005922A (nl) 1980-10-29 1980-10-29 Werkwijze voor het vormen van een draadverbinding.

Publications (2)

Publication Number Publication Date
IT8124731A0 IT8124731A0 (it) 1981-10-27
IT1139570B true IT1139570B (it) 1986-09-24

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IT24731/81A IT1139570B (it) 1980-10-29 1981-10-27 Metodo per formare un collegamento mediante un filo metallico

Country Status (18)

Country Link
JP (1) JPS5916409B2 (ko)
KR (1) KR890000585B1 (ko)
AU (1) AU546818B2 (ko)
BE (1) BE890887A (ko)
BR (1) BR8106902A (ko)
CA (1) CA1178664A (ko)
CH (1) CH654142A5 (ko)
DD (1) DD205294A5 (ko)
DE (1) DE3141842A1 (ko)
ES (1) ES8301390A1 (ko)
FR (1) FR2493044B1 (ko)
GB (1) GB2086297B (ko)
HK (1) HK40885A (ko)
IT (1) IT1139570B (ko)
MY (1) MY8500623A (ko)
NL (1) NL8005922A (ko)
PL (1) PL133893B1 (ko)
SG (1) SG21984G (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation
US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
US4476366A (en) * 1983-02-01 1984-10-09 Fairchild Camera & Instrument Corp. Controlled bonding wire ball formation
US4594493A (en) * 1983-07-25 1986-06-10 Fairchild Camera & Instrument Corp. Method and apparatus for forming ball bonds
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
US5628922A (en) * 1995-07-14 1997-05-13 Motorola, Inc. Electrical flame-off wand
DE19618320A1 (de) * 1996-04-30 1997-11-13 F&K Delvotec Bondtechnik Gmbh Vorrichtung zum "Ball"-Bonden
JP2003163235A (ja) * 2001-11-29 2003-06-06 Shinkawa Ltd ワイヤボンディング装置
TWI229022B (en) * 2002-06-20 2005-03-11 Esec Trading Sa Device with electrodes for the formation of a ball at the end of a wire
WO2014054305A1 (ja) * 2012-10-05 2014-04-10 株式会社新川 酸化防止ガス吹き出しユニット

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH568656A5 (en) * 1974-03-20 1975-10-31 Transistor Ag Welding of contact blobs to semiconductor lead wires - uses electric DC light arc of preset current strength for melting lead wire end
NL7406783A (nl) * 1974-05-21 1975-11-25 Philips Nv Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.
GB1536872A (en) * 1975-05-15 1978-12-20 Welding Inst Electrical inter-connection method and apparatus
GB1468974A (en) * 1975-05-23 1977-03-30 Ferranti Ltd Manufacture of semiconductor devices
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus

Also Published As

Publication number Publication date
BE890887A (fr) 1982-04-27
FR2493044B1 (fr) 1986-03-28
ES506580A0 (es) 1982-11-16
CH654142A5 (de) 1986-01-31
ES8301390A1 (es) 1982-11-16
IT8124731A0 (it) 1981-10-27
PL233586A1 (ko) 1982-05-10
DD205294A5 (de) 1983-12-21
KR890000585B1 (ko) 1989-03-21
SG21984G (en) 1985-01-04
KR830008394A (ko) 1983-11-18
GB2086297B (en) 1983-12-21
AU7689381A (en) 1982-05-06
DE3141842A1 (de) 1982-10-21
MY8500623A (en) 1985-12-31
NL8005922A (nl) 1982-05-17
PL133893B1 (en) 1985-07-31
FR2493044A1 (fr) 1982-04-30
JPS57102036A (en) 1982-06-24
DE3141842C2 (ko) 1990-09-20
CA1178664A (en) 1984-11-27
BR8106902A (pt) 1982-07-13
HK40885A (en) 1985-05-31
AU546818B2 (en) 1985-09-19
JPS5916409B2 (ja) 1984-04-16
GB2086297A (en) 1982-05-12

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