IN2014DN04651A - - Google Patents

Info

Publication number
IN2014DN04651A
IN2014DN04651A IN4651DEN2014A IN2014DN04651A IN 2014DN04651 A IN2014DN04651 A IN 2014DN04651A IN 4651DEN2014 A IN4651DEN2014 A IN 4651DEN2014A IN 2014DN04651 A IN2014DN04651 A IN 2014DN04651A
Authority
IN
India
Prior art keywords
epoxy
component
adduct
core
disclosed
Prior art date
Application number
Other languages
English (en)
Inventor
Umesh C Desai
Tien Chieh Chao
Masayuki Nakajima
Kaliappa G Ragunathan
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of IN2014DN04651A publication Critical patent/IN2014DN04651A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C08G59/4276—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
IN4651DEN2014 2011-12-09 2012-12-07 IN2014DN04651A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/315,518 US20120129980A1 (en) 2010-11-19 2011-12-09 Structural adhesive compositions
PCT/US2012/068378 WO2013086277A2 (en) 2011-12-09 2012-12-07 Structural adhesive compositions

Publications (1)

Publication Number Publication Date
IN2014DN04651A true IN2014DN04651A (zh) 2015-04-03

Family

ID=47501441

Family Applications (1)

Application Number Title Priority Date Filing Date
IN4651DEN2014 IN2014DN04651A (zh) 2011-12-09 2012-12-07

Country Status (12)

Country Link
US (1) US20120129980A1 (zh)
EP (1) EP2788397A2 (zh)
KR (1) KR101684752B1 (zh)
CN (1) CN104053694B (zh)
AU (1) AU2012347650B2 (zh)
BR (1) BR112014013594B1 (zh)
CA (1) CA2858186C (zh)
IN (1) IN2014DN04651A (zh)
MX (1) MX2014006899A (zh)
RU (1) RU2595040C2 (zh)
SG (1) SG11201403003SA (zh)
WO (1) WO2013086277A2 (zh)

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JP2010118580A (ja) 2008-11-14 2010-05-27 Toshiba Corp 不揮発性半導体記憶装置
US20120128499A1 (en) * 2010-11-19 2012-05-24 Desai Umesh C Structural adhesive compositions
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US20140150970A1 (en) * 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10294375B2 (en) * 2011-09-30 2019-05-21 Ppg Industries Ohio, Inc. Electrically conductive coatings containing graphenic carbon particles
EP2879989A1 (en) * 2012-08-03 2015-06-10 OCV Intellectual Capital, LLC Improved fiberglass reinforced composites
KR101719944B1 (ko) * 2013-03-04 2017-03-24 신닛테츠스미킨 카부시키카이샤 충격 흡수 부품
CN105377940B (zh) * 2013-06-14 2018-09-25 Ppg工业俄亥俄公司 结构黏合剂组合物
CN105378019A (zh) * 2013-07-24 2016-03-02 陶氏环球技术有限责任公司 可固化组合物
CN104004482A (zh) * 2014-06-13 2014-08-27 江苏悦达新材料科技有限公司 一种环氧/有机硅/石墨烯杂化高导热胶粘剂及其制备方法
GB201411586D0 (en) * 2014-06-30 2014-08-13 Hexcel Composites Ltd Adhesive composition
DE102014226826A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Epoxidharz-Zusammensetzung
US11242427B2 (en) 2015-10-20 2022-02-08 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
CN106118571A (zh) * 2016-06-28 2016-11-16 四川东树新材料有限公司 风电叶片用含石墨烯结构胶黏剂及其制备方法
JP7011656B2 (ja) * 2016-10-28 2022-01-26 ダウ グローバル テクノロジーズ エルエルシー 改善された低温耐衝撃性を有する衝突耐久性エポキシ接着剤
US11739241B2 (en) 2017-06-23 2023-08-29 Ddp Specialty Electronic Material Us, Llc High temperature epoxy adhesive formulations
CA3076352A1 (en) 2017-09-20 2019-03-28 Ppg Industries Ohio, Inc. Two-component structural adhesive
CN111727211A (zh) * 2018-02-09 2020-09-29 Ppg工业俄亥俄公司 涂料组合物
KR102610546B1 (ko) 2018-09-20 2023-12-05 피피지 인더스트리즈 오하이오 인코포레이티드 티올-함유 조성물
WO2020077333A1 (en) 2018-10-12 2020-04-16 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
BR112021008212A8 (pt) * 2018-10-29 2022-06-07 Zephyros Inc Material, uso do material e método para adesão de um primeiro substrato a um segundo substrato
FR3098817A1 (fr) 2019-07-16 2021-01-22 Ppg Industries Ohio, Inc. Compositions contenant des charges thermiquement conductrices
KR20220047609A (ko) 2019-08-23 2022-04-18 피피지 인더스트리즈 오하이오 인코포레이티드 코팅 조성물
WO2021040864A1 (en) 2019-08-23 2021-03-04 Prc-Desoto International, Inc. Coating compositions
MX2022002241A (es) 2019-08-23 2022-05-06 Ppg Ind Ohio Inc Sistemas y métodos para resistencia al cizallamiento del recubrimiento mejorada y desplazamiento de adhesivos estructurales de dos componentes.
KR20220051217A (ko) * 2019-08-23 2022-04-26 피피지 인더스트리즈 오하이오 인코포레이티드 2-성분 구조적 접착제의 개선된 중첩전단강도 및 변위를 위한 시스템 및 방법
MX2022003390A (es) 2019-09-23 2022-04-19 Ppg Ind Ohio Inc Composiciones curables.
US20230019038A1 (en) 2019-12-11 2023-01-19 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
CN115244142B (zh) 2020-02-26 2024-05-10 Ppg工业俄亥俄公司 经涂覆的基材及其制备方法
CA3168168A1 (en) 2020-02-26 2021-09-02 Sijmen J. VISSER Two-layer dielectric coating
WO2021173941A1 (en) 2020-02-26 2021-09-02 Ppg Industries Ohio, Inc. Thermally conductive and electrically insulating powder coating compositions
WO2021211722A1 (en) 2020-04-15 2021-10-21 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
US20230183445A1 (en) 2020-04-15 2023-06-15 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
MX2022012970A (es) 2020-04-15 2023-01-05 Ppg Ind Ohio Inc Composiciones que contienen agentes de relleno térmicamente conductores.
WO2021211182A1 (en) 2020-04-15 2021-10-21 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
CA3175415A1 (en) 2020-04-15 2021-10-21 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
WO2021211185A1 (en) 2020-04-15 2021-10-21 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
EP4263727A1 (en) 2020-12-18 2023-10-25 PPG Industries Ohio Inc. Thermally conductive and electrically insulating and/or fire-retardant electrodepositable coating compositions
EP4314187A1 (en) 2021-03-26 2024-02-07 PPG Industries Ohio Inc. Coating compositions
WO2023102525A1 (en) 2021-12-02 2023-06-08 Ppg Industries Ohio, Inc. Coating compositions
CN114752334B (zh) * 2022-04-11 2023-10-20 中国航发北京航空材料研究院 一种耐湿热贮存稳定的中温固化环氧结构胶膜及制备方法
WO2023240057A1 (en) 2022-06-06 2023-12-14 Ppg Industries Ohio, Inc. Coating compositions
WO2024040260A1 (en) * 2022-08-19 2024-02-22 Ppg Industries Ohio, Inc. Coating compositions
WO2024044576A1 (en) 2022-08-22 2024-02-29 Ppg Industries Ohio, Inc. Coating compositions
CN116042150A (zh) * 2022-12-30 2023-05-02 浙江抟原复合材料有限公司 一种lng船围护系统用低温环氧树脂及其制备方法

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Also Published As

Publication number Publication date
CA2858186A1 (en) 2013-06-13
AU2012347650B2 (en) 2015-09-17
RU2014127905A (ru) 2016-02-10
KR101684752B1 (ko) 2016-12-08
WO2013086277A3 (en) 2013-08-15
AU2012347650A1 (en) 2014-06-26
KR20140101838A (ko) 2014-08-20
BR112014013594B1 (pt) 2021-01-05
MX2014006899A (es) 2015-05-15
WO2013086277A2 (en) 2013-06-13
CN104053694B (zh) 2016-08-17
RU2595040C2 (ru) 2016-08-20
US20120129980A1 (en) 2012-05-24
BR112014013594A2 (pt) 2017-06-13
CN104053694A (zh) 2014-09-17
EP2788397A2 (en) 2014-10-15
CA2858186C (en) 2016-06-07
BR112014013594A8 (pt) 2017-06-13
SG11201403003SA (en) 2014-07-30

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