IN2012DN01784A - - Google Patents

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Publication number
IN2012DN01784A
IN2012DN01784A IN1784DEN2012A IN2012DN01784A IN 2012DN01784 A IN2012DN01784 A IN 2012DN01784A IN 1784DEN2012 A IN1784DEN2012 A IN 1784DEN2012A IN 2012DN01784 A IN2012DN01784 A IN 2012DN01784A
Authority
IN
India
Prior art keywords
shielding
electrically conductive
electronic component
conductive shielding
circuit board
Prior art date
Application number
Other languages
English (en)
Inventor
Volker Weeber
Heinrich Barth
Ralph Schertlen
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of IN2012DN01784A publication Critical patent/IN2012DN01784A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
IN1784DEN2012 2009-12-10 2010-11-25 IN2012DN01784A (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200910054517 DE102009054517B4 (de) 2009-12-10 2009-12-10 Elektronisches Steuergerät
PCT/EP2010/068171 WO2011069828A1 (de) 2009-12-10 2010-11-25 Elektronisches steuergerät

Publications (1)

Publication Number Publication Date
IN2012DN01784A true IN2012DN01784A (enrdf_load_stackoverflow) 2015-06-05

Family

ID=43607705

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1784DEN2012 IN2012DN01784A (enrdf_load_stackoverflow) 2009-12-10 2010-11-25

Country Status (6)

Country Link
US (1) US8929078B2 (enrdf_load_stackoverflow)
EP (1) EP2510765B1 (enrdf_load_stackoverflow)
CN (1) CN102656961B (enrdf_load_stackoverflow)
DE (1) DE102009054517B4 (enrdf_load_stackoverflow)
IN (1) IN2012DN01784A (enrdf_load_stackoverflow)
WO (1) WO2011069828A1 (enrdf_load_stackoverflow)

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JP6075267B2 (ja) * 2013-10-29 2017-02-08 日立金属株式会社 光アンプモジュール
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DE102014212540A1 (de) * 2014-06-30 2015-12-31 Robert Bosch Gmbh Fahrzeug mit verbesserter Batterieabschirmung
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US20160135282A1 (en) * 2014-11-07 2016-05-12 Kabushiki Kaisha Toshiba Electronic apparatus
JP6328044B2 (ja) * 2014-12-09 2018-05-23 カルソニックカンセイ株式会社 電子ユニット
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DE102015206480A1 (de) * 2015-04-10 2016-10-13 Robert Bosch Gmbh Steuergerät
US10061363B2 (en) * 2015-09-04 2018-08-28 Apple Inc. Combination parallel path heatsink and EMI shield
JP6528620B2 (ja) * 2015-09-15 2019-06-12 株式会社オートネットワーク技術研究所 回路構成体および電気接続箱
KR101998343B1 (ko) * 2016-02-26 2019-07-09 삼성전자주식회사 냉각 구조를 포함하는 전자 장치
US10624240B2 (en) * 2016-04-29 2020-04-14 Hewlett Packard Enterprise Development Lp First and second shields for thermal isolation
US20180042144A1 (en) * 2016-08-03 2018-02-08 Kuei-Piao Lee Method of Cooling Electric-Vehicle Controller
DE102017212968B4 (de) * 2016-08-05 2024-02-01 Robert Bosch Gmbh Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren
DE102016115453B4 (de) * 2016-08-19 2023-10-19 Krohne Ag Messgerät mit Wärmeleitvorrichtung, Wärmeleitvorrichtung und Verfahren
TWM541686U (zh) * 2016-12-27 2017-05-11 Micro-Star Int'l Co Ltd 電子裝置
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US20220195373A1 (en) * 2020-12-17 2022-06-23 NearField Atomics Inc. Incubator with a magnetically-quiet incubator chamber and methods of making and using
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Also Published As

Publication number Publication date
CN102656961B (zh) 2015-11-25
CN102656961A (zh) 2012-09-05
EP2510765A1 (de) 2012-10-17
WO2011069828A1 (de) 2011-06-16
DE102009054517B4 (de) 2011-12-29
EP2510765B1 (de) 2013-11-06
DE102009054517A1 (de) 2011-06-16
US20120300405A1 (en) 2012-11-29
US8929078B2 (en) 2015-01-06

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