IN170183B - - Google Patents
Info
- Publication number
- IN170183B IN170183B IN17/MAS/88A IN17MA1988A IN170183B IN 170183 B IN170183 B IN 170183B IN 17MA1988 A IN17MA1988 A IN 17MA1988A IN 170183 B IN170183 B IN 170183B
- Authority
- IN
- India
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/016—Manufacture or treatment using moulds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Holo Graphy (AREA)
- Electrically Operated Instructional Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Packaging For Recording Disks (AREA)
- External Artificial Organs (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Compression, Expansion, Code Conversion, And Decoders (AREA)
- Non-Volatile Memory (AREA)
- Collating Specific Patterns (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8700446A FR2609821B1 (fr) | 1987-01-16 | 1987-01-16 | Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN170183B true IN170183B (https=) | 1992-02-22 |
Family
ID=9346968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN17/MAS/88A IN170183B (https=) | 1987-01-16 | 1988-01-12 |
Country Status (18)
| Country | Link |
|---|---|
| EP (1) | EP0277854B1 (https=) |
| JP (1) | JPS63239097A (https=) |
| KR (1) | KR880009317A (https=) |
| AT (1) | ATE74456T1 (https=) |
| AU (1) | AU600785B2 (https=) |
| BR (1) | BR8800135A (https=) |
| CA (1) | CA1306058C (https=) |
| DE (1) | DE3869635D1 (https=) |
| DK (1) | DK16988A (https=) |
| ES (1) | ES2031248T3 (https=) |
| FI (1) | FI93156C (https=) |
| FR (1) | FR2609821B1 (https=) |
| GR (1) | GR3004900T3 (https=) |
| IN (1) | IN170183B (https=) |
| NO (1) | NO178089C (https=) |
| NZ (1) | NZ223192A (https=) |
| PT (1) | PT86557A (https=) |
| ZA (1) | ZA88279B (https=) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0825349B2 (ja) * | 1987-10-22 | 1996-03-13 | 日本ユーロテック株式会社 | カードの製造法 |
| US4943708A (en) * | 1988-02-01 | 1990-07-24 | Motorola, Inc. | Data device module having locking groove |
| FR2636755B1 (fr) * | 1988-09-16 | 1992-05-22 | Schlumberger Ind Sa | Procede de realisation de cartes a memoire et cartes obtenues par ledit procede |
| US4961893A (en) * | 1988-04-28 | 1990-10-09 | Schlumberger Industries | Method for manufacturing memory cards |
| EP0361194A3 (de) * | 1988-09-30 | 1991-06-12 | Siemens Aktiengesellschaft | Verfahren zum Umhüllen von elektrischen oder elektronischen Bauelementen oder Baugruppen und Umhüllung für elektrische oder elektronische Bauelemente oder Baugruppen |
| JP2559834B2 (ja) * | 1989-01-12 | 1996-12-04 | 三菱電機株式会社 | Ｉｃカード |
| JPH0687484B2 (ja) * | 1989-04-06 | 1994-11-02 | 三菱電機株式会社 | Ｉｃカード用モジュール |
| US5244840A (en) * | 1989-05-23 | 1993-09-14 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing an encapsulated IC card having a molded frame and a circuit board |
| FR2647571B1 (fr) * | 1989-05-26 | 1994-07-22 | Lemaire Gerard | Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede |
| FR2659157B2 (fr) * | 1989-05-26 | 1994-09-30 | Lemaire Gerard | Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede. |
| FR2650530B1 (fr) * | 1989-08-07 | 1991-11-29 | Schlumberger Ind Sa | Procede de realisation de corps de carte avec graphisme |
| FR2666687A1 (fr) * | 1990-09-06 | 1992-03-13 | Sgs Thomson Microelectronics | Circuit integre a boitier moule comprenant un dissipateur thermique et procede de fabrication. |
| IT1243817B (it) * | 1990-10-09 | 1994-06-28 | Sgs Thomson Microelectronics | Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato |
| DE4038126C2 (de) * | 1990-11-27 | 1993-12-16 | Mannesmann Ag | Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte |
| FI913357A7 (fi) * | 1991-07-10 | 1993-01-11 | Valtion Teknillinen Tutkimuskeskus | Menetelmä ja muotti ruiskupuristetun elektroniikkamodulin valmistamiseksi |
| US5286426A (en) * | 1992-04-01 | 1994-02-15 | Allegro Microsystems, Inc. | Assembling a lead frame between a pair of molding cavity plates |
| DE4401588C2 (de) * | 1994-01-20 | 2003-02-20 | Gemplus Gmbh | Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul |
| DE9422424U1 (de) * | 1994-02-04 | 2002-02-21 | Giesecke & Devrient GmbH, 81677 München | Chipkarte mit einem elektronischen Modul |
| JPH0890600A (ja) * | 1994-09-22 | 1996-04-09 | Rhythm Watch Co Ltd | Ｉｃカード製造金型 |
| DE4435802A1 (de) * | 1994-10-06 | 1996-04-11 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens |
| JP3409943B2 (ja) * | 1995-05-25 | 2003-05-26 | 昭和電工株式会社 | 輸液容器用口栓体及びその製法 |
| FR2735714B1 (fr) * | 1995-06-21 | 1997-07-25 | Schlumberger Ind Sa | Procede pour imprimer un graphisme sur une carte a memoire |
| DE19625228C2 (de) * | 1996-06-24 | 1998-05-14 | Siemens Ag | Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse |
| EP0890928A3 (en) * | 1997-07-10 | 2001-06-13 | Sarnoff Corporation | Transmission apparatus and remotely identifying an electronically coded article |
| EP0938060A1 (de) * | 1998-02-20 | 1999-08-25 | ESEC Management SA | Verfahren zur Herstellung eines Chipobjektes und Chipobjekt |
| WO2000019513A1 (de) * | 1998-09-29 | 2000-04-06 | Tyco Electronics Logistics Ag | Verfahren zum eingiessen eines flachen elektronikmoduls in einem kunststoffkartenkörper durch thermoplastisches spritzgiessen |
| FR2895547B1 (fr) * | 2005-12-26 | 2008-06-06 | Oberthur Card Syst Sa | Procede de fabrication d'une carte a microcircuit |
| ATE551668T1 (de) | 2006-11-17 | 2012-04-15 | Oberthur Technologies | Verfahren zur herstellung einer entität und entsprechende vorrichtung |
| ES2928212T3 (es) | 2016-07-27 | 2022-11-16 | Composecure Llc | Componentes electrónicos sobremoldeados para tarjetas de transacción y procedimientos de fabricación de las mismas |
| US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
| US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
| US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
| US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| AU2018330181B2 (en) | 2017-09-07 | 2022-03-31 | Composecure, Llc | Transaction card with embedded electronic components and process for manufacture |
| KR102931665B1 (ko) | 2017-10-18 | 2026-02-26 | 컴포시큐어 엘.엘.씨. | 윈도우 또는 윈도우 패턴 및 선택적인 백라이팅을 갖는 금속, 세라믹, 또는 세라믹 코팅된 트랜잭션 카드 |
| USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
| CN116852632A (zh) * | 2023-07-04 | 2023-10-10 | 中国银行股份有限公司 | 卡片制作装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3029667A1 (de) * | 1980-08-05 | 1982-03-11 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-baustein |
| FR2520541A1 (fr) * | 1982-01-22 | 1983-07-29 | Flonic Sa | Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede |
| JPS6086850A (ja) * | 1983-10-18 | 1985-05-16 | Dainippon Printing Co Ltd | Ｉｃカ−ド |
| JPS60146383A (ja) * | 1984-01-10 | 1985-08-02 | Dainippon Printing Co Ltd | Ｉｃカ−ド |
| JPS61222712A (ja) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | 樹脂封止成形体の製造方法 |
| JPS6232094A (ja) * | 1985-08-05 | 1987-02-12 | カシオ計算機株式会社 | Ｉｃカ−ド |
-
1987
- 1987-01-16 FR FR8700446A patent/FR2609821B1/fr not_active Expired
-
1988
- 1988-01-11 AU AU10160/88A patent/AU600785B2/en not_active Ceased
- 1988-01-12 IN IN17/MAS/88A patent/IN170183B/en unknown
- 1988-01-12 KR KR1019880000153A patent/KR880009317A/ko not_active Withdrawn
- 1988-01-13 JP JP63005678A patent/JPS63239097A/ja active Pending
- 1988-01-14 NZ NZ223192A patent/NZ223192A/xx unknown
- 1988-01-14 FI FI880152A patent/FI93156C/fi not_active IP Right Cessation
- 1988-01-14 DK DK016988A patent/DK16988A/da not_active Application Discontinuation
- 1988-01-14 EP EP88400068A patent/EP0277854B1/fr not_active Expired - Lifetime
- 1988-01-14 ES ES198888400068T patent/ES2031248T3/es not_active Expired - Lifetime
- 1988-01-14 AT AT88400068T patent/ATE74456T1/de not_active IP Right Cessation
- 1988-01-14 DE DE8888400068T patent/DE3869635D1/de not_active Revoked
- 1988-01-15 BR BR8800135A patent/BR8800135A/pt not_active IP Right Cessation
- 1988-01-15 NO NO880166A patent/NO178089C/no unknown
- 1988-01-15 PT PT86557A patent/PT86557A/pt not_active Application Discontinuation
- 1988-01-15 ZA ZA880279A patent/ZA88279B/xx unknown
- 1988-01-15 CA CA000556637A patent/CA1306058C/en not_active Expired - Lifetime
-
1992
- 1992-06-11 GR GR920401244T patent/GR3004900T3/el unknown
Also Published As
| Publication number | Publication date |
|---|---|
| AU600785B2 (en) | 1990-08-23 |
| DE3869635D1 (de) | 1992-05-07 |
| FR2609821B1 (fr) | 1989-03-31 |
| GR3004900T3 (https=) | 1993-04-28 |
| EP0277854A1 (fr) | 1988-08-10 |
| BR8800135A (pt) | 1988-08-23 |
| DK16988A (da) | 1988-07-17 |
| AU1016088A (en) | 1988-07-21 |
| PT86557A (pt) | 1989-01-30 |
| FI93156B (fi) | 1994-11-15 |
| DK16988D0 (da) | 1988-01-14 |
| FI880152L (fi) | 1988-07-17 |
| NO880166D0 (no) | 1988-01-15 |
| EP0277854B1 (fr) | 1992-04-01 |
| ZA88279B (en) | 1988-07-01 |
| NO178089C (no) | 1996-01-17 |
| CA1306058C (en) | 1992-08-04 |
| KR880009317A (ko) | 1988-09-14 |
| ES2031248T3 (es) | 1992-12-01 |
| NO880166L (no) | 1988-07-18 |
| NO178089B (no) | 1995-10-09 |
| FI93156C (fi) | 1995-02-27 |
| ATE74456T1 (de) | 1992-04-15 |
| FI880152A0 (fi) | 1988-01-14 |
| JPS63239097A (ja) | 1988-10-05 |
| NZ223192A (en) | 1989-09-27 |
| FR2609821A1 (fr) | 1988-07-22 |