IL274056A - שיטת ייצור לוח בסיס עבור מודול אלקטרוני - Google Patents

שיטת ייצור לוח בסיס עבור מודול אלקטרוני

Info

Publication number
IL274056A
IL274056A IL274056A IL27405620A IL274056A IL 274056 A IL274056 A IL 274056A IL 274056 A IL274056 A IL 274056A IL 27405620 A IL27405620 A IL 27405620A IL 274056 A IL274056 A IL 274056A
Authority
IL
Israel
Prior art keywords
producing
base plate
electronic module
module
electronic
Prior art date
Application number
IL274056A
Other languages
English (en)
Original Assignee
Doduco Solutions Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doduco Solutions Gmbh filed Critical Doduco Solutions Gmbh
Publication of IL274056A publication Critical patent/IL274056A/he

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
IL274056A 2017-11-13 2020-04-19 שיטת ייצור לוח בסיס עבור מודול אלקטרוני IL274056A (he)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017126590.2A DE102017126590A1 (de) 2017-11-13 2017-11-13 Verfahren zum Herstellen einer Bodenplatte für ein Elektronikmodul
PCT/EP2018/078424 WO2019091734A1 (de) 2017-11-13 2018-10-17 Verfahren zum herstellen einer bodenplatte für ein elektronikmodul

Publications (1)

Publication Number Publication Date
IL274056A true IL274056A (he) 2020-06-30

Family

ID=63915039

Family Applications (1)

Application Number Title Priority Date Filing Date
IL274056A IL274056A (he) 2017-11-13 2020-04-19 שיטת ייצור לוח בסיס עבור מודול אלקטרוני

Country Status (9)

Country Link
US (1) US20200270738A1 (he)
EP (1) EP3710613A1 (he)
JP (1) JP7185689B2 (he)
KR (1) KR20200087131A (he)
CN (1) CN111344430B (he)
CA (1) CA3080428A1 (he)
DE (1) DE102017126590A1 (he)
IL (1) IL274056A (he)
WO (1) WO2019091734A1 (he)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2750436A1 (de) * 1977-11-11 1979-05-17 Degussa Verfahren zur herstellung hartloetfaehiger metallschichten auf keramik
FR2585730B1 (fr) * 1985-08-01 1987-10-09 Centre Nat Rech Scient Procede de depot de metaux en couche mince sur un substrat non metallique, avec depot intermediaire d'hydrures par pulverisation cathodique reactive
US4964962A (en) * 1988-10-08 1990-10-23 Matsushita Electric Works, Ltd. Method for forming conducting metal layer on inorganic substrate
JPH0796702B2 (ja) * 1988-10-08 1995-10-18 松下電工株式会社 無機質基板のメタライゼーションの方法
JPH09104969A (ja) * 1995-08-09 1997-04-22 Matsushita Electric Ind Co Ltd 導体膜およびその形成方法
DE10235277B4 (de) * 2002-08-02 2005-12-29 Leonhardy Gmbh Verfahren zur Befestigung von nicht lötbaren Komponenten auf elektronischen Leiterplatten
EP1524336A1 (de) * 2003-10-18 2005-04-20 Aluminal Oberflächtentechnik GmbH & Co. KG Mit einer Aluminium-/Magnesium-Legierung beschichtete Werkstücke
JP2006083442A (ja) * 2004-09-17 2006-03-30 Seiko Epson Corp 成膜方法、電子デバイス、及び電子機器
KR100807948B1 (ko) * 2007-02-28 2008-02-28 삼성전자주식회사 저저항 금속 배선 형성방법, 금속 배선 구조 및 이를이용하는 표시장치
JP2009129983A (ja) * 2007-11-20 2009-06-11 Toyota Central R&D Labs Inc 接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法
EP2197253A1 (en) * 2008-12-12 2010-06-16 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Method for electric circuit deposition
JP5526632B2 (ja) * 2009-07-14 2014-06-18 三菱マテリアル株式会社 絶縁基板、絶縁回路基板、半導体装置、絶縁基板の製造方法及び絶縁回路基板の製造方法
KR101074550B1 (ko) * 2009-12-29 2011-10-17 엘에스산전 주식회사 파워 모듈 및 그의 제조 방법

Also Published As

Publication number Publication date
WO2019091734A1 (de) 2019-05-16
CN111344430B (zh) 2022-03-15
JP2021502692A (ja) 2021-01-28
CA3080428A1 (en) 2019-05-16
DE102017126590A1 (de) 2019-05-16
KR20200087131A (ko) 2020-07-20
EP3710613A1 (de) 2020-09-23
JP7185689B2 (ja) 2022-12-07
CN111344430A (zh) 2020-06-26
US20200270738A1 (en) 2020-08-27

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