IL257488B - התקן זכרון מוליך למחצה לא נדיף - Google Patents
התקן זכרון מוליך למחצה לא נדיףInfo
- Publication number
- IL257488B IL257488B IL257488A IL25748818A IL257488B IL 257488 B IL257488 B IL 257488B IL 257488 A IL257488 A IL 257488A IL 25748818 A IL25748818 A IL 25748818A IL 257488 B IL257488 B IL 257488B
- Authority
- IL
- Israel
- Prior art keywords
- memory device
- semiconductor memory
- volatile semiconductor
- volatile
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
- H10B43/35—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Read Only Memory (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015195638A JP5951096B1 (ja) | 2015-10-01 | 2015-10-01 | 不揮発性半導体記憶装置 |
PCT/JP2016/078202 WO2017057242A1 (ja) | 2015-10-01 | 2016-09-26 | 不揮発性半導体記憶装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
IL257488A IL257488A (he) | 2018-04-30 |
IL257488B true IL257488B (he) | 2020-01-30 |
Family
ID=56375206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL257488A IL257488B (he) | 2015-10-01 | 2018-02-12 | התקן זכרון מוליך למחצה לא נדיף |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5951096B1 (he) |
KR (1) | KR102437353B1 (he) |
CN (1) | CN108076670B (he) |
IL (1) | IL257488B (he) |
SG (1) | SG11201801237PA (he) |
TW (1) | TWI597827B (he) |
WO (1) | WO2017057242A1 (he) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7026537B2 (ja) * | 2018-03-07 | 2022-02-28 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
JP7450283B2 (ja) * | 2022-05-31 | 2024-03-15 | 株式会社フローディア | 不揮発性メモリセル及び不揮発性半導体記憶装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4058232B2 (ja) * | 2000-11-29 | 2008-03-05 | 株式会社ルネサステクノロジ | 半導体装置及びicカード |
CN1291491C (zh) * | 2002-11-12 | 2006-12-20 | 旺宏电子股份有限公司 | 半导体元件及其制作方法 |
JP2005142354A (ja) * | 2003-11-06 | 2005-06-02 | Matsushita Electric Ind Co Ltd | 不揮発性半導体記憶装置及びその駆動方法及びその製造方法 |
DE112004003019T5 (de) * | 2004-11-30 | 2008-01-03 | Spansion LLC, Santa Clara | Nicht-flüchtiges Speicherbauelement und Verfahren zu dessen Herstellung |
JP4772429B2 (ja) * | 2005-08-29 | 2011-09-14 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置 |
JP4171032B2 (ja) * | 2006-06-16 | 2008-10-22 | 株式会社東芝 | 半導体装置及びその製造方法 |
KR20100080190A (ko) * | 2008-12-31 | 2010-07-08 | 주식회사 동부하이텍 | 플래시메모리 소자 및 그 제조 방법 |
US20110204374A1 (en) * | 2009-01-20 | 2011-08-25 | Sharp Kabushiki Kaisha | Thin film diode and method for fabricating the same |
JP2011129816A (ja) * | 2009-12-21 | 2011-06-30 | Renesas Electronics Corp | 半導体装置 |
JP5538024B2 (ja) * | 2010-03-29 | 2014-07-02 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置 |
KR101979299B1 (ko) * | 2012-12-26 | 2019-09-03 | 에스케이하이닉스 주식회사 | 비휘발성 메모리 장치 및 그 제조방법 |
JP6168792B2 (ja) * | 2013-02-28 | 2017-07-26 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
-
2015
- 2015-10-01 JP JP2015195638A patent/JP5951096B1/ja active Active
-
2016
- 2016-09-26 WO PCT/JP2016/078202 patent/WO2017057242A1/ja active Application Filing
- 2016-09-26 SG SG11201801237PA patent/SG11201801237PA/en unknown
- 2016-09-26 KR KR1020177037428A patent/KR102437353B1/ko active IP Right Grant
- 2016-09-26 CN CN201680036107.9A patent/CN108076670B/zh active Active
- 2016-09-30 TW TW105131527A patent/TWI597827B/zh active
-
2018
- 2018-02-12 IL IL257488A patent/IL257488B/he active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN108076670A (zh) | 2018-05-25 |
IL257488A (he) | 2018-04-30 |
SG11201801237PA (en) | 2018-03-28 |
WO2017057242A1 (ja) | 2017-04-06 |
KR20180064329A (ko) | 2018-06-14 |
TWI597827B (zh) | 2017-09-01 |
KR102437353B1 (ko) | 2022-08-30 |
JP2017069478A (ja) | 2017-04-06 |
TW201717322A (zh) | 2017-05-16 |
CN108076670B (zh) | 2021-12-03 |
JP5951096B1 (ja) | 2016-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201802573UA (en) | Semiconductor memory device | |
HK1253883A1 (zh) | 半導體器件 | |
HK1251728A1 (zh) | 半導體裝置 | |
SG10201707339PA (en) | Semiconductor device | |
GB2542933B (en) | Operating parameters for flash memory devices | |
HK1245998A1 (zh) | 半導體器件 | |
GB201610192D0 (en) | Quantum memory device | |
SG2013069489A (en) | Nonvolatile semiconductor memory device | |
TWI563631B (en) | Semiconductor Device | |
IL254101A0 (he) | התקן זיכרון מוליך למחצה | |
TWI560856B (en) | Semiconductor memory device | |
HK1222476A1 (zh) | 半導體器件 | |
HK1252338A1 (zh) | 半導體器件 | |
GB2551082B (en) | On-chip semiconductor device having enhanced variability | |
SG11202006092XA (en) | Memory device | |
SG10201905122TA (en) | Semiconductor memory device | |
HK1249276A1 (zh) | 半導體器件 | |
SG10201911466SA (en) | Semiconductor memory devices | |
TWI562158B (en) | Non-volatile memory device and controller | |
SG11202102625VA (en) | Semiconductor memory device | |
HK1244353A1 (zh) | 半導體器件 | |
IL269012A (he) | מכשיר אחסון מוליך למחצה שאינו נדיף | |
IL267292A (he) | זיכרון בלתי-נדיף | |
SG11202008495TA (en) | Semiconductor memory device | |
IL257640B (he) | התקן איחסון מוליך למחצה לא נדיף |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed |