IL187706A - Use of cmp for aluminum mirror and solar cell fabrication - Google Patents
Use of cmp for aluminum mirror and solar cell fabricationInfo
- Publication number
- IL187706A IL187706A IL187706A IL18770607A IL187706A IL 187706 A IL187706 A IL 187706A IL 187706 A IL187706 A IL 187706A IL 18770607 A IL18770607 A IL 18770607A IL 187706 A IL187706 A IL 187706A
- Authority
- IL
- Israel
- Prior art keywords
- polishing
- substrate
- aluminum
- polishing composition
- abrasive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
- B24B13/015—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor of television picture tube viewing panels, headlight reflectors or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/173,518 US8062096B2 (en) | 2005-06-30 | 2005-06-30 | Use of CMP for aluminum mirror and solar cell fabrication |
| PCT/US2006/024789 WO2007120163A2 (en) | 2005-06-30 | 2006-06-22 | Use of cmp for aluminum mirror and solar cell fabrication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL187706A true IL187706A (en) | 2012-07-31 |
Family
ID=37618822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL187706A IL187706A (en) | 2005-06-30 | 2007-11-27 | Use of cmp for aluminum mirror and solar cell fabrication |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US8062096B2 (https=) |
| EP (1) | EP1917122B1 (https=) |
| JP (1) | JP5155858B2 (https=) |
| KR (2) | KR20110112463A (https=) |
| CN (1) | CN101208178A (https=) |
| IL (1) | IL187706A (https=) |
| MY (1) | MY146358A (https=) |
| SG (1) | SG163546A1 (https=) |
| TW (1) | TWI300735B (https=) |
| WO (1) | WO2007120163A2 (https=) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006126072A1 (en) * | 2005-05-27 | 2006-11-30 | Nortel Networks Limited | Circuit-switched and multimedia subsystem voice continuity with bearer path interruption |
| US20070068605A1 (en) * | 2005-09-23 | 2007-03-29 | U.I.T., Llc | Method of metal performance improvement and protection against degradation and suppression thereof by ultrasonic impact |
| JP5599547B2 (ja) * | 2006-12-01 | 2014-10-01 | Mipox株式会社 | 硬質結晶基板研磨方法及び油性研磨スラリー |
| JP2009035461A (ja) * | 2007-08-03 | 2009-02-19 | Asahi Glass Co Ltd | 磁気ディスク用ガラス基板の製造方法 |
| EP2228467A3 (en) * | 2009-03-11 | 2015-08-26 | Fujifilm Corporation | Aluminum alloy substrate and solar cell substrate |
| JP2011025347A (ja) * | 2009-07-24 | 2011-02-10 | Disco Abrasive Syst Ltd | 金属板の加工方法 |
| KR101232813B1 (ko) * | 2009-09-30 | 2013-02-13 | 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 | 스택 장치의 제작을 위한 관통-베이스 웨이퍼 비아를 노출시키는 방법 |
| US20140308155A1 (en) * | 2011-11-25 | 2014-10-16 | Fujimi Incorporated | Method for polishing alloy material and method for producing alloy material |
| KR20150065757A (ko) * | 2012-10-03 | 2015-06-15 | 가부시키가이샤 후지미인코퍼레이티드 | 연마 방법 및 합금 재료의 제조 방법 |
| US8845394B2 (en) | 2012-10-29 | 2014-09-30 | Wayne O. Duescher | Bellows driven air floatation abrading workholder |
| US9233452B2 (en) | 2012-10-29 | 2016-01-12 | Wayne O. Duescher | Vacuum-grooved membrane abrasive polishing wafer workholder |
| US9011207B2 (en) | 2012-10-29 | 2015-04-21 | Wayne O. Duescher | Flexible diaphragm combination floating and rigid abrading workholder |
| US8998678B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Spider arm driven flexible chamber abrading workholder |
| US8998677B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Bellows driven floatation-type abrading workholder |
| US9199354B2 (en) | 2012-10-29 | 2015-12-01 | Wayne O. Duescher | Flexible diaphragm post-type floating and rigid abrading workholder |
| US9039488B2 (en) | 2012-10-29 | 2015-05-26 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
| US9604339B2 (en) | 2012-10-29 | 2017-03-28 | Wayne O. Duescher | Vacuum-grooved membrane wafer polishing workholder |
| EP2915859A4 (en) | 2012-10-31 | 2015-10-28 | Fujimi Inc | POLISHING COMPOSITION |
| CN102941528B (zh) * | 2012-11-20 | 2014-12-17 | 中国人民解放军国防科学技术大学 | 具有高精度超光滑表面的铝合金材料及抛光盘、抛光液和抛光方法 |
| JP6622963B2 (ja) * | 2013-01-04 | 2019-12-18 | 株式会社フジミインコーポレーテッド | 合金材料の研磨方法及び合金材料の製造方法 |
| JP6438191B2 (ja) * | 2013-12-10 | 2018-12-12 | 三菱瓦斯化学株式会社 | ポリカーボネート樹脂フィルムおよびそれを用いた成形体 |
| JP2015203080A (ja) * | 2014-04-15 | 2015-11-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US20180297173A1 (en) * | 2015-04-07 | 2018-10-18 | Hewlett-Packard Development Company, L.P. | Methods of Polishing |
| WO2018191485A1 (en) * | 2017-04-14 | 2018-10-18 | Cabot Microelectronics Corporation | Chemical-mechanical processing slurry and methods for processing a nickel substrate surface |
| US10926378B2 (en) | 2017-07-08 | 2021-02-23 | Wayne O. Duescher | Abrasive coated disk islands using magnetic font sheet |
| KR102777772B1 (ko) * | 2018-11-27 | 2025-03-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법 |
| US11691241B1 (en) * | 2019-08-05 | 2023-07-04 | Keltech Engineering, Inc. | Abrasive lapping head with floating and rigid workpiece carrier |
| KR102349153B1 (ko) * | 2019-12-16 | 2022-01-10 | 주식회사 포스코 | 알루미늄 합금용 연마 용액, 그 제조방법 및 이를 이용한 연마 방법 |
| CN116141214B (zh) * | 2022-08-04 | 2024-08-27 | 华侨大学 | 一种可循环利用的混合磨料抛光膜的制备方法 |
Family Cites Families (51)
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|---|---|---|---|---|
| US3662501A (en) * | 1971-01-28 | 1972-05-16 | Ibm | Method for polishing magnetic oxide materials |
| US4769046A (en) | 1985-07-25 | 1988-09-06 | Fujimi Kanmazai Kogyo Kabushiki Kaisha Of Japan | Process for polishing surface of memory hard disc |
| DE3629582A1 (de) | 1986-08-30 | 1988-03-03 | Basf Ag | Verfahren zur oberflaechenbearbeitung scheibenfoermiger vernickelter aluminiumsubstrate |
| JPS63288620A (ja) | 1987-05-22 | 1988-11-25 | Kobe Steel Ltd | アルミニウムの電解複合超鏡面加工方法 |
| JPH01246068A (ja) * | 1988-03-29 | 1989-10-02 | Kobe Steel Ltd | アルミニウム合金基板の鏡面仕上げ方法 |
| SU1629353A1 (ru) * | 1988-08-17 | 1991-02-23 | Предприятие П/Я В-2750 | Раствор дл виброхимического шлифовани деталей из алюминиевых сплавов |
| JPH02185365A (ja) * | 1989-01-12 | 1990-07-19 | Kobe Steel Ltd | アルミニウム合金平板基盤の研磨方法 |
| US5230833A (en) | 1989-06-09 | 1993-07-27 | Nalco Chemical Company | Low sodium, low metals silica polishing slurries |
| US4959113C1 (en) | 1989-07-31 | 2001-03-13 | Rodel Inc | Method and composition for polishing metal surfaces |
| US5196353A (en) | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
| US5209816A (en) * | 1992-06-04 | 1993-05-11 | Micron Technology, Inc. | Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing |
| US6614529B1 (en) | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| JPH06313164A (ja) * | 1993-04-28 | 1994-11-08 | Fujimi Inkooporeetetsudo:Kk | 研磨用組成物 |
| US5658183A (en) | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| US5433651A (en) | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
| JP3270282B2 (ja) | 1994-02-21 | 2002-04-02 | 株式会社東芝 | 半導体製造装置及び半導体装置の製造方法 |
| JP3313505B2 (ja) | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
| US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
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| US5863838A (en) | 1996-07-22 | 1999-01-26 | Motorola, Inc. | Method for chemically-mechanically polishing a metal layer |
| US5872633A (en) | 1996-07-26 | 1999-02-16 | Speedfam Corporation | Methods and apparatus for detecting removal of thin film layers during planarization |
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| US6350176B1 (en) * | 1999-02-01 | 2002-02-26 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | High quality optically polished aluminum mirror and process for producing |
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| JP2002059357A (ja) * | 2000-08-23 | 2002-02-26 | Toray Ind Inc | 研磨パッドおよび研磨装置ならびに研磨方法 |
| JP2002100592A (ja) * | 2000-09-20 | 2002-04-05 | Rodel Nitta Co | 研磨パッド |
| US6461227B1 (en) | 2000-10-17 | 2002-10-08 | Cabot Microelectronics Corporation | Method of polishing a memory or rigid disk with an ammonia-and/or halide-containing composition |
| US6612911B2 (en) * | 2001-01-16 | 2003-09-02 | Cabot Microelectronics Corporation | Alkali metal-containing polishing system and method |
| TW548437B (en) | 2001-03-02 | 2003-08-21 | Unaxis Balzers Ag | Optical component and its production method as well as optical switch |
| JP2003100682A (ja) * | 2001-09-25 | 2003-04-04 | Jsr Corp | 半導体ウエハ用研磨パッド |
| US6821897B2 (en) * | 2001-12-05 | 2004-11-23 | Cabot Microelectronics Corporation | Method for copper CMP using polymeric complexing agents |
| JP3749867B2 (ja) * | 2002-03-08 | 2006-03-01 | 株式会社東芝 | アルミニウム系金属用研磨液および半導体装置の製造方法 |
| US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
| JP2004014744A (ja) * | 2002-06-06 | 2004-01-15 | Toray Ind Inc | 研磨パッド、研磨装置、およびそれを用いた研磨方法 |
| JP3997152B2 (ja) * | 2002-12-26 | 2007-10-24 | 花王株式会社 | 研磨液組成物 |
| US6896591B2 (en) * | 2003-02-11 | 2005-05-24 | Cabot Microelectronics Corporation | Mixed-abrasive polishing composition and method for using the same |
| US6921177B2 (en) * | 2003-02-24 | 2005-07-26 | Raytheon Company | High precision mirror, and a method of making it |
| JP2005001059A (ja) * | 2003-06-12 | 2005-01-06 | Sumitomo Bakelite Co Ltd | 研磨用積層体 |
| US20050159085A1 (en) * | 2003-10-30 | 2005-07-21 | Scott Brandon S. | Method of chemically mechanically polishing substrates |
-
2005
- 2005-06-30 US US11/173,518 patent/US8062096B2/en not_active Expired - Fee Related
-
2006
- 2006-06-22 WO PCT/US2006/024789 patent/WO2007120163A2/en not_active Ceased
- 2006-06-22 KR KR1020117020418A patent/KR20110112463A/ko not_active Ceased
- 2006-06-22 JP JP2008519451A patent/JP5155858B2/ja active Active
- 2006-06-22 CN CNA200680023157XA patent/CN101208178A/zh active Pending
- 2006-06-22 SG SG201004697-7A patent/SG163546A1/en unknown
- 2006-06-22 EP EP06851111.2A patent/EP1917122B1/en not_active Not-in-force
- 2006-06-22 KR KR1020077030643A patent/KR101178338B1/ko not_active Expired - Fee Related
- 2006-06-28 MY MYPI20063084A patent/MY146358A/en unknown
- 2006-06-29 TW TW095123553A patent/TWI300735B/zh not_active IP Right Cessation
-
2007
- 2007-11-27 IL IL187706A patent/IL187706A/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| JP5155858B2 (ja) | 2013-03-06 |
| US8062096B2 (en) | 2011-11-22 |
| KR101178338B1 (ko) | 2012-08-29 |
| WO2007120163A2 (en) | 2007-10-25 |
| MY146358A (en) | 2012-08-15 |
| TWI300735B (en) | 2008-09-11 |
| SG163546A1 (en) | 2010-08-30 |
| JP2008544868A (ja) | 2008-12-11 |
| CN101208178A (zh) | 2008-06-25 |
| TW200714406A (en) | 2007-04-16 |
| US20070010098A1 (en) | 2007-01-11 |
| EP1917122A2 (en) | 2008-05-07 |
| WO2007120163A3 (en) | 2008-02-28 |
| KR20110112463A (ko) | 2011-10-12 |
| KR20080015471A (ko) | 2008-02-19 |
| EP1917122B1 (en) | 2018-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed | ||
| KB | Patent renewed |