IL177844A0 - Pre-measurement processing method, exposure system and substrate processing apparatus - Google Patents

Pre-measurement processing method, exposure system and substrate processing apparatus

Info

Publication number
IL177844A0
IL177844A0 IL177844A IL17784406A IL177844A0 IL 177844 A0 IL177844 A0 IL 177844A0 IL 177844 A IL177844 A IL 177844A IL 17784406 A IL17784406 A IL 17784406A IL 177844 A0 IL177844 A0 IL 177844A0
Authority
IL
Israel
Prior art keywords
exposure system
processing apparatus
processing method
substrate processing
measurement processing
Prior art date
Application number
IL177844A
Other languages
English (en)
Original Assignee
Nikon Corp
Yuuki Ishii
Hiroyuki Suzuki
Shinichi Okita
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp, Yuuki Ishii, Hiroyuki Suzuki, Shinichi Okita filed Critical Nikon Corp
Publication of IL177844A0 publication Critical patent/IL177844A0/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
IL177844A 2004-03-01 2006-08-31 Pre-measurement processing method, exposure system and substrate processing apparatus IL177844A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004056167 2004-03-01
PCT/JP2005/003156 WO2005083756A1 (ja) 2004-03-01 2005-02-25 事前計測処理方法、露光システム及び基板処理装置

Publications (1)

Publication Number Publication Date
IL177844A0 true IL177844A0 (en) 2006-12-31

Family

ID=34908899

Family Applications (1)

Application Number Title Priority Date Filing Date
IL177844A IL177844A0 (en) 2004-03-01 2006-08-31 Pre-measurement processing method, exposure system and substrate processing apparatus

Country Status (5)

Country Link
JP (1) JP4760705B2 (ja)
KR (1) KR101144683B1 (ja)
IL (1) IL177844A0 (ja)
TW (1) TWI395075B (ja)
WO (1) WO2005083756A1 (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4449697B2 (ja) 2004-10-26 2010-04-14 株式会社ニコン 重ね合わせ検査システム
JP4449698B2 (ja) 2004-10-26 2010-04-14 株式会社ニコン 重ね合わせ検査システム
US7462429B2 (en) * 2005-10-12 2008-12-09 Asml Netherlands B.V. Method and arrangement for correcting thermally-induced field deformations of a lithographically exposed substrate
JP4840684B2 (ja) * 2005-11-04 2011-12-21 株式会社ニコン 露光方法
JP4890846B2 (ja) * 2005-12-08 2012-03-07 キヤノン株式会社 計測装置、計測方法、露光装置、及びデバイス製造方法
KR100922549B1 (ko) * 2007-12-24 2009-10-21 주식회사 동부하이텍 오정렬 발생 기판 검출 장치 및 방법
JP2010283242A (ja) * 2009-06-05 2010-12-16 Canon Inc 露光装置およびデバイス製造方法
KR101581083B1 (ko) * 2010-01-18 2015-12-30 가부시키가이샤 니콘 노광 방법, 노광 장치, 및 디바이스 제조 방법
JP5574749B2 (ja) 2010-02-24 2014-08-20 キヤノン株式会社 露光条件及びマスクパターンのうち少なくとも一方を決定する決定方法及びプログラム、情報処理装置
JP5686567B2 (ja) * 2010-10-19 2015-03-18 キヤノン株式会社 露光条件及びマスクパターンを決定するプログラム及び方法
JP5638038B2 (ja) * 2012-07-12 2014-12-10 キヤノン株式会社 決定方法及びプログラム
CN111948912A (zh) 2015-02-23 2020-11-17 株式会社尼康 基板处理系统及基板处理方法、以及组件制造方法
WO2016136690A1 (ja) * 2015-02-23 2016-09-01 株式会社ニコン 計測装置、リソグラフィシステム及び露光装置、並びに管理方法、重ね合わせ計測方法及びデバイス製造方法
KR102239782B1 (ko) * 2016-09-30 2021-04-13 가부시키가이샤 니콘 계측 시스템 및 기판 처리 시스템, 그리고 디바이스 제조 방법
CN109725506B (zh) * 2017-10-31 2020-11-13 上海微电子装备（集团）股份有限公司 一种基底预对准方法和装置以及一种光刻机
JP7034825B2 (ja) * 2018-05-16 2022-03-14 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
JP2020046581A (ja) * 2018-09-20 2020-03-26 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法
WO2020090206A1 (ja) * 2018-11-01 2020-05-07 東京エレクトロン株式会社 画像処理方法及び画像処理装置
US10996572B2 (en) * 2019-02-15 2021-05-04 Applied Materials, Inc. Model based dynamic positional correction for digital lithography tools
JP7369529B2 (ja) * 2019-02-28 2023-10-26 株式会社オーク製作所 露光装置およびアライメント方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276622A (ja) * 1985-09-30 1987-04-08 Hitachi Ltd 縮小投影式アライメント方法及びその装置
JPS6298725A (ja) * 1985-10-25 1987-05-08 Canon Inc 信号検出装置
JPH0785466B2 (ja) * 1986-07-04 1995-09-13 キヤノン株式会社 位置合せ装置
JP2634620B2 (ja) * 1988-03-10 1997-07-30 株式会社日立製作所 投影式露光方法およびその装置
JP2683075B2 (ja) * 1988-12-23 1997-11-26 キヤノン株式会社 半導体製造装置及び方法
JP3391328B2 (ja) * 1993-02-08 2003-03-31 株式会社ニコン 位置合わせ方法、その位置合わせ方法を用いた露光方法、その露光方法を用いたデバイス製造方法、そのデバイス製造方法で製造されたデバイス、並びに位置合わせ装置、その位置合わせ装置を備えた露光装置
JP3654597B2 (ja) * 1993-07-15 2005-06-02 株式会社ルネサステクノロジ 製造システムおよび製造方法
JP4046884B2 (ja) * 1999-03-26 2008-02-13 キヤノン株式会社 位置計測方法および該位置計測法を用いた半導体露光装置
WO2001065591A1 (fr) * 2000-03-02 2001-09-07 Nikon Corporation Appareil de mesure de position et dispositif d'alignement

Also Published As

Publication number Publication date
KR20060132743A (ko) 2006-12-21
KR101144683B1 (ko) 2012-05-25
TW200540579A (en) 2005-12-16
JP4760705B2 (ja) 2011-08-31
TWI395075B (zh) 2013-05-01
WO2005083756A1 (ja) 2005-09-09
JPWO2005083756A1 (ja) 2007-11-29

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