IL177844A0 - Pre-measurement processing method, exposure system and substrate processing apparatus - Google Patents

Pre-measurement processing method, exposure system and substrate processing apparatus

Info

Publication number
IL177844A0
IL177844A0 IL177844A IL17784406A IL177844A0 IL 177844 A0 IL177844 A0 IL 177844A0 IL 177844 A IL177844 A IL 177844A IL 17784406 A IL17784406 A IL 17784406A IL 177844 A0 IL177844 A0 IL 177844A0
Authority
IL
Israel
Prior art keywords
exposure system
processing apparatus
processing method
substrate processing
measurement processing
Prior art date
Application number
IL177844A
Original Assignee
Nikon Corp
Yuuki Ishii
Hiroyuki Suzuki
Shinichi Okita
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp, Yuuki Ishii, Hiroyuki Suzuki, Shinichi Okita filed Critical Nikon Corp
Publication of IL177844A0 publication Critical patent/IL177844A0/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
IL177844A 2004-03-01 2006-08-31 Pre-measurement processing method, exposure system and substrate processing apparatus IL177844A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004056167 2004-03-01
PCT/JP2005/003156 WO2005083756A1 (en) 2004-03-01 2005-02-25 Pre-measurement processing method, exposure system and substrate processing equipment

Publications (1)

Publication Number Publication Date
IL177844A0 true IL177844A0 (en) 2006-12-31

Family

ID=34908899

Family Applications (1)

Application Number Title Priority Date Filing Date
IL177844A IL177844A0 (en) 2004-03-01 2006-08-31 Pre-measurement processing method, exposure system and substrate processing apparatus

Country Status (5)

Country Link
JP (1) JP4760705B2 (en)
KR (1) KR101144683B1 (en)
IL (1) IL177844A0 (en)
TW (1) TWI395075B (en)
WO (1) WO2005083756A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4449697B2 (en) 2004-10-26 2010-04-14 株式会社ニコン Overlay inspection system
JP4449698B2 (en) 2004-10-26 2010-04-14 株式会社ニコン Overlay inspection system
US7462429B2 (en) * 2005-10-12 2008-12-09 Asml Netherlands B.V. Method and arrangement for correcting thermally-induced field deformations of a lithographically exposed substrate
JP4840684B2 (en) * 2005-11-04 2011-12-21 株式会社ニコン Exposure method
JP4890846B2 (en) * 2005-12-08 2012-03-07 キヤノン株式会社 Measuring apparatus, measuring method, exposure apparatus, and device manufacturing method
KR100922549B1 (en) * 2007-12-24 2009-10-21 주식회사 동부하이텍 A misalignment wafer detecting system and a method of detection for a misalignment wafer
JP2010283242A (en) * 2009-06-05 2010-12-16 Canon Inc Exposure device and method of manufacturing the device
KR101581083B1 (en) * 2010-01-18 2015-12-30 가부시키가이샤 니콘 Exposure method, exposure device, and manufacturing method for device
JP5574749B2 (en) 2010-02-24 2014-08-20 キヤノン株式会社 Determination method and program for determining at least one of exposure condition and mask pattern, and information processing apparatus
JP5686567B2 (en) * 2010-10-19 2015-03-18 キヤノン株式会社 Program and method for determining exposure conditions and mask pattern
JP5638038B2 (en) * 2012-07-12 2014-12-10 キヤノン株式会社 Determination method and program
EP3680717A1 (en) 2015-02-23 2020-07-15 Nikon Corporation Substrate processing system and substrate processing method, and device manufacturing method
TWI768342B (en) * 2015-02-23 2022-06-21 日商尼康股份有限公司 Measurement device, lithography system and exposure apparatus, measurement method and exposure method
KR102239782B1 (en) * 2016-09-30 2021-04-13 가부시키가이샤 니콘 Measurement system and substrate processing system, and device manufacturing method
CN109725506B (en) * 2017-10-31 2020-11-13 上海微电子装备（集团）股份有限公司 Substrate pre-alignment method and device and photoetching machine
JP7034825B2 (en) * 2018-05-16 2022-03-14 株式会社ニューフレアテクノロジー Charged particle beam drawing device and charged particle beam drawing method
JP2020046581A (en) * 2018-09-20 2020-03-26 株式会社Ｓｃｒｅｅｎホールディングス Drawing apparatus and drawing method
JP7042358B2 (en) * 2018-11-01 2022-03-25 東京エレクトロン株式会社 Image processing method and image processing device
US10996572B2 (en) * 2019-02-15 2021-05-04 Applied Materials, Inc. Model based dynamic positional correction for digital lithography tools
JP7369529B2 (en) * 2019-02-28 2023-10-26 株式会社オーク製作所 Exposure equipment and alignment method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276622A (en) * 1985-09-30 1987-04-08 Hitachi Ltd Method and device for reduced projection-type alignment
JPS6298725A (en) * 1985-10-25 1987-05-08 Canon Inc Signal detecting device
JPH0785466B2 (en) * 1986-07-04 1995-09-13 キヤノン株式会社 Positioning device
JP2634620B2 (en) * 1988-03-10 1997-07-30 株式会社日立製作所 Projection type exposure method and apparatus
JP2683075B2 (en) * 1988-12-23 1997-11-26 キヤノン株式会社 Semiconductor manufacturing apparatus and method
JP3391328B2 (en) * 1993-02-08 2003-03-31 株式会社ニコン Alignment method, exposure method using the alignment method, device manufacturing method using the exposure method, device manufactured by the device manufacturing method, alignment apparatus, and exposure apparatus including the alignment apparatus
JP3654597B2 (en) * 1993-07-15 2005-06-02 株式会社ルネサステクノロジ Manufacturing system and manufacturing method
JP4046884B2 (en) * 1999-03-26 2008-02-13 キヤノン株式会社 Position measuring method and semiconductor exposure apparatus using the position measuring method
AU2001232256A1 (en) * 2000-03-02 2001-09-12 Nikon Corporation Position measuring apparatus and aligner

Also Published As

Publication number Publication date
KR20060132743A (en) 2006-12-21
TWI395075B (en) 2013-05-01
JP4760705B2 (en) 2011-08-31
TW200540579A (en) 2005-12-16
WO2005083756A1 (en) 2005-09-09
JPWO2005083756A1 (en) 2007-11-29
KR101144683B1 (en) 2012-05-25

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