JPS6276622A - Method and device for reduced projection-type alignment - Google Patents
Method and device for reduced projection-type alignmentInfo
- Publication number
- JPS6276622A JPS6276622A JP60215002A JP21500285A JPS6276622A JP S6276622 A JPS6276622 A JP S6276622A JP 60215002 A JP60215002 A JP 60215002A JP 21500285 A JP21500285 A JP 21500285A JP S6276622 A JPS6276622 A JP S6276622A
- Authority
- JP
- Japan
- Prior art keywords
- alignment
- alignment pattern
- error
- illumination light
- detected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005286 illumination Methods 0.000 abstract 4
- 238000001514 detection method Methods 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
Abstract
PURPOSE: To remove the decrease in alignment accuracy due to the resist coat ing irregularity by a method wherein the position of an alignment pattern is detected with the single color illumination light with the same wavelength as the wavelength of white illumination light and alignment illumination light, and the difference in the both position detecting signals is obtained so as to compensate the amount of the alignment.
CONSTITUTION: An alignment pattern detection error between the white and single color is detected on a few chips on a wafer with a subpattern detection system. Then, a vertual origin (xs, ys) where the error is minimum is obtained on the basis of the error data. An alignment pattern detection error ex* (x. y) ey* (x, y) is analogized on an arbitrary position, that is to say, on all the chip, and the data is stored in a memory. The center position xa of the wafer alignment pattern, ideally, under the white illumination light with higher accuracy by using the amount of the detected error ex* (x, y) that has been obtained and stored and providing compensation to it. An amount of the alignment is obtained from the center position xa of the compensated wafer alignment pattern and the center position xr of the reticle alignment pattern so as to move the stage in the direction of x a few.
COPYRIGHT: (C)1987,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60215002A JPH0467772B2 (en) | 1985-09-30 | 1985-09-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60215002A JPH0467772B2 (en) | 1985-09-30 | 1985-09-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6276622A true JPS6276622A (en) | 1987-04-08 |
JPH0467772B2 JPH0467772B2 (en) | 1992-10-29 |
Family
ID=16665076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60215002A Expired - Lifetime JPH0467772B2 (en) | 1985-09-30 | 1985-09-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0467772B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02170515A (en) * | 1988-12-23 | 1990-07-02 | Canon Inc | Exposure system |
WO2005083756A1 (en) * | 2004-03-01 | 2005-09-09 | Nikon Corporation | Pre-measurement processing method, exposure system and substrate processing equipment |
US7728953B2 (en) | 2004-03-01 | 2010-06-01 | Nikon Corporation | Exposure method, exposure system, and substrate processing apparatus |
-
1985
- 1985-09-30 JP JP60215002A patent/JPH0467772B2/ja not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02170515A (en) * | 1988-12-23 | 1990-07-02 | Canon Inc | Exposure system |
WO2005083756A1 (en) * | 2004-03-01 | 2005-09-09 | Nikon Corporation | Pre-measurement processing method, exposure system and substrate processing equipment |
JPWO2005083756A1 (en) * | 2004-03-01 | 2007-11-29 | 株式会社ニコン | Pre-measurement processing method, exposure system, and substrate processing apparatus |
US7728953B2 (en) | 2004-03-01 | 2010-06-01 | Nikon Corporation | Exposure method, exposure system, and substrate processing apparatus |
JP4760705B2 (en) * | 2004-03-01 | 2011-08-31 | 株式会社ニコン | Pre-measurement processing method, exposure system, and substrate processing apparatus |
TWI395075B (en) * | 2004-03-01 | 2013-05-01 | 尼康股份有限公司 | Prior measurement processing method, exposure system and substrate processing device |
Also Published As
Publication number | Publication date |
---|---|
JPH0467772B2 (en) | 1992-10-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |