IL108503A - Self leveling membrane test probe - Google Patents

Self leveling membrane test probe

Info

Publication number
IL108503A
IL108503A IL108503A IL10850394A IL108503A IL 108503 A IL108503 A IL 108503A IL 108503 A IL108503 A IL 108503A IL 10850394 A IL10850394 A IL 10850394A IL 108503 A IL108503 A IL 108503A
Authority
IL
Israel
Prior art keywords
membrane
intermediate area
test probe
contacts
support frame
Prior art date
Application number
IL108503A
Other languages
English (en)
Other versions
IL108503A0 (en
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of IL108503A0 publication Critical patent/IL108503A0/xx
Publication of IL108503A publication Critical patent/IL108503A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
IL108503A 1993-02-25 1994-01-31 Self leveling membrane test probe IL108503A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/023,189 US5461326A (en) 1993-02-25 1993-02-25 Self leveling and self tensioning membrane test probe

Publications (2)

Publication Number Publication Date
IL108503A0 IL108503A0 (en) 1994-05-30
IL108503A true IL108503A (en) 1997-03-18

Family

ID=21813605

Family Applications (1)

Application Number Title Priority Date Filing Date
IL108503A IL108503A (en) 1993-02-25 1994-01-31 Self leveling membrane test probe

Country Status (5)

Country Link
US (1) US5461326A (ja)
EP (1) EP0613013A1 (ja)
JP (1) JP2591904B2 (ja)
KR (1) KR940019577A (ja)
IL (1) IL108503A (ja)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
KR0140034B1 (ko) 1993-12-16 1998-07-15 모리시다 요이치 반도체 웨이퍼 수납기, 반도체 웨이퍼의 검사용 집적회로 단자와 프로브 단자와의 접속방법 및 그 장치, 반도체 집적회로의 검사방법, 프로브카드 및 그 제조방법
JP2978720B2 (ja) * 1994-09-09 1999-11-15 東京エレクトロン株式会社 プローブ装置
JPH10505162A (ja) * 1994-09-09 1998-05-19 マイクロモジュール・システムズ 回路のメンブレンプローブ
JPH0883825A (ja) * 1994-09-09 1996-03-26 Tokyo Electron Ltd プローブ装置
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
JP3414593B2 (ja) * 1996-06-28 2003-06-09 日本発条株式会社 導電性接触子
US6060891A (en) * 1997-02-11 2000-05-09 Micron Technology, Inc. Probe card for semiconductor wafers and method and system for testing wafers
US6798224B1 (en) * 1997-02-11 2004-09-28 Micron Technology, Inc. Method for testing semiconductor wafers
TW369601B (en) * 1997-06-17 1999-09-11 Advantest Corp Probe card
US5990695A (en) * 1998-01-16 1999-11-23 Packard Hughes Interconnect Co. Membrane test probe
US6252414B1 (en) 1998-08-26 2001-06-26 International Business Machines Corporation Method and apparatus for testing circuits having different configurations with a single test fixture
JP2000182701A (ja) * 1998-12-18 2000-06-30 Honda Tsushin Kogyo Co Ltd プローブピンとその製造方法及びコネクタ
US6466044B1 (en) 1999-10-21 2002-10-15 Dell Products L.P. Through connector circuit test apparatus
US6255834B1 (en) * 1999-10-21 2001-07-03 Dell Usa, L.P. Test fixture having a floating self-centering connector
US7262611B2 (en) 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
US6734690B1 (en) * 2000-04-29 2004-05-11 Hewlett-Packard Development Company, L.P. Back pressure test fixture to allow probing of integrated circuit package signals
US6496001B1 (en) 2000-11-14 2002-12-17 International Business Machines Corporation System and method for probe mechanism planarization
JP4559733B2 (ja) 2002-01-25 2010-10-13 株式会社アドバンテスト プローブカード及びプローブカードの製造方法
US6682229B2 (en) * 2002-03-01 2004-01-27 Hon Hai Precision Ind. Co., Ltd. Optical fiber array
EP1488245B1 (en) * 2002-03-05 2007-08-22 Rika Denshi America, Inc. Apparatus for interfacing electronic packages and test equipment
KR20040022647A (ko) * 2002-09-09 2004-03-16 삼성전자주식회사 집적 회로 칩 테스트를 위한 캔티레버형 푸르브 카드
US6765397B2 (en) * 2002-11-21 2004-07-20 International Business Machines Corporation Apparatus and method for testing land grid array modules
JP4465995B2 (ja) 2003-07-02 2010-05-26 株式会社日立製作所 プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法
US7071715B2 (en) * 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
GB0412728D0 (en) * 2004-06-08 2004-07-07 Cooke Michael Novel electroplated IC probe card designs
WO2006007440A1 (en) * 2004-06-16 2006-01-19 Rika Denshi America, Inc. Electrical test probes, methods of making, and methods of using
EP2273279A1 (en) 2005-04-27 2011-01-12 Aehr Test Systems, Inc. Apparatus for testing electronic devices
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
JP4785190B2 (ja) * 2006-03-15 2011-10-05 大西電子株式会社 半導体デバイス用検査ソケット
JP4902248B2 (ja) * 2006-04-07 2012-03-21 株式会社日本マイクロニクス 電気的接続装置
JP4841298B2 (ja) * 2006-04-14 2011-12-21 株式会社日本マイクロニクス プローブシートの製造方法
JP2008082912A (ja) * 2006-09-28 2008-04-10 Micronics Japan Co Ltd 電気的接続装置
WO2008058949A2 (de) * 2006-11-16 2008-05-22 Siemens Aktiengesellschaft Sensorelement, vorrichtung und verfahren zur inspektion einer leiterbahnstruktur, herstellungsverfahren für sensorelement
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
JP5209460B2 (ja) * 2008-12-22 2013-06-12 モレックス インコーポレイテド 同軸コネクタ
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
JP5588851B2 (ja) * 2010-12-14 2014-09-10 株式会社日本マイクロニクス 電気的接続装置及びその製造方法
US8939252B2 (en) * 2012-11-11 2015-01-27 David Sanborn Protective material for acoustic transmission
US9633883B2 (en) 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
US11469057B2 (en) * 2015-12-30 2022-10-11 Schneider Electric Industries Sas Adjustable contactor
CN205303357U (zh) * 2015-12-30 2016-06-08 施耐德电器工业公司 可调节的接触器
US10261108B2 (en) 2016-07-12 2019-04-16 International Business Machines Corporation Low force wafer test probe with variable geometry
US10444260B2 (en) 2016-07-12 2019-10-15 International Business Machines Corporation Low force wafer test probe
US10141215B2 (en) * 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
KR20230021177A (ko) 2017-03-03 2023-02-13 에어 테스트 시스템즈 일렉트로닉스 테스터
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
CN116457670A (zh) 2020-10-07 2023-07-18 雅赫测试系统公司 电子测试器
CN114200278B (zh) * 2021-11-29 2022-12-27 强一半导体（苏州）有限公司 一种薄膜探针卡及其探针头
CN114200279B (zh) * 2021-11-29 2023-03-14 强一半导体（苏州）有限公司 一种薄膜探针卡及其探针头

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4636722A (en) * 1984-05-21 1987-01-13 Probe-Rite, Inc. High density probe-head with isolated and shielded transmission lines
JPH0833413B2 (ja) * 1986-01-07 1996-03-29 ヒューレット・パッカード・カンパニー 試験用プロ−ブ
JPS63252438A (ja) * 1987-03-11 1988-10-19 Yokogawa Hewlett Packard Ltd 自動表面清浄装置
DE68909811D1 (de) * 1988-03-01 1993-11-18 Hewlett Packard Co IC-Testsonde auf Membranbasis mit präzise positionierten Kontakten.
US4906920A (en) * 1988-10-11 1990-03-06 Hewlett-Packard Company Self-leveling membrane probe
GB8901817D0 (en) * 1989-01-27 1989-03-15 Stag Electronic Designs Apparatus for testing an electrical device
US4975638A (en) * 1989-12-18 1990-12-04 Wentworth Laboratories Test probe assembly for testing integrated circuit devices
US5334029A (en) * 1993-05-11 1994-08-02 At&T Bell Laboratories High density connector for stacked circuit boards

Also Published As

Publication number Publication date
JPH077056A (ja) 1995-01-10
IL108503A0 (en) 1994-05-30
US5461326A (en) 1995-10-24
JP2591904B2 (ja) 1997-03-19
EP0613013A1 (en) 1994-08-31
KR940019577A (ko) 1994-09-14

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