IE46109B1 - A method of producing composite reigid-flexible printed-circuit boards - Google Patents
A method of producing composite reigid-flexible printed-circuit boardsInfo
- Publication number
- IE46109B1 IE46109B1 IE254977A IE254977A IE46109B1 IE 46109 B1 IE46109 B1 IE 46109B1 IE 254977 A IE254977 A IE 254977A IE 254977 A IE254977 A IE 254977A IE 46109 B1 IE46109 B1 IE 46109B1
- Authority
- IE
- Ireland
- Prior art keywords
- rigid
- flexible
- layers
- circuit board
- printed
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 15
- 239000002131 composite material Substances 0.000 title claims description 8
- 238000003825 pressing Methods 0.000 claims abstract description 9
- 238000005476 soldering Methods 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Conductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19762657212 DE2657212C3 (de) | 1976-12-17 | 1976-12-17 | Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IE46109L IE46109L (en) | 1978-06-17 |
| IE46109B1 true IE46109B1 (en) | 1983-02-23 |
Family
ID=5995786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IE254977A IE46109B1 (en) | 1976-12-17 | 1977-12-15 | A method of producing composite reigid-flexible printed-circuit boards |
Country Status (10)
| Country | Link |
|---|---|
| BE (1) | BE861966A (Direct) |
| CH (1) | CH630202A5 (Direct) |
| DE (1) | DE2657212C3 (Direct) |
| DK (1) | DK142475C (Direct) |
| FR (1) | FR2374818A1 (Direct) |
| GB (1) | GB1561620A (Direct) |
| IE (1) | IE46109B1 (Direct) |
| IT (1) | IT1091374B (Direct) |
| NL (1) | NL180294C (Direct) |
| SE (1) | SE424132B (Direct) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2946726C2 (de) * | 1979-11-20 | 1982-05-19 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Leiterplatte mit starren und flexiblen Bereichen und Verfahren zu deren Herstellung |
| DE3047197C1 (de) * | 1980-12-15 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung von Leiterplatten,die abschnittsweise relativ starre und demgegenueber relativ flexible Bereiche aufweisen |
| DE3119884C1 (de) * | 1981-05-19 | 1982-11-04 | Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München | Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten |
| DE3140061C1 (de) * | 1981-10-08 | 1983-02-03 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten |
| DE3318717C1 (de) * | 1983-05-21 | 1984-05-30 | Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig & Co KG, 8510 Fürth | Verfahren zum Herstellen von Leiterplatten mit starren und flexiblen Bereichen |
| DE3434672C2 (de) * | 1984-09-21 | 1986-09-11 | Fa. Carl Freudenberg, 6940 Weinheim | Verfahren zur Herstellung von flexiblen Leiterplatten für hohe Biegebeanspruchung |
| DE3535773C1 (en) * | 1985-10-07 | 1987-04-23 | Messerschmitt Boelkow Blohm | Method for producing rigid-flexible multilayer circuits |
| DE3624718A1 (de) * | 1986-07-22 | 1988-01-28 | Schoeller & Co Elektronik | Mehrlagige, starre und flexible bereiche aufweisende leiterplatte |
| DE3624719A1 (de) * | 1986-07-22 | 1988-01-28 | Schoeller & Co Elektronik | Vorlaminat fuer starr-flexible leiterplatten |
| JP2631287B2 (ja) * | 1987-06-30 | 1997-07-16 | 日本メクトロン 株式会社 | 混成多層回路基板の製造法 |
| DE3723414A1 (de) * | 1987-07-15 | 1989-01-26 | Leitron Leiterplatten | Verfahren zur herstellung von gedruckten schaltungen in starrer oder starrflexibler mehrlagentechnik |
| JP2676112B2 (ja) * | 1989-05-01 | 1997-11-12 | イビデン株式会社 | 電子部品搭載用基板の製造方法 |
| DE58904878D1 (de) * | 1989-07-15 | 1993-08-12 | Freudenberg Carl Fa | Verfahren zur herstellung von starre und flexible bereiche aufweisenden leiterplatten oder leiterplatten-innenlagen. |
| DE4003345C1 (Direct) * | 1990-02-05 | 1991-08-08 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
| DE4003344C1 (Direct) * | 1990-02-05 | 1991-06-13 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
| DE4131934A1 (de) * | 1991-09-25 | 1993-04-08 | Degussa | Verfahren zur herstellung von starren, in teilbereichen biegbaren gedruckten schaltungen |
| DE4206746C1 (en) * | 1992-03-04 | 1993-06-24 | Degussa Ag, 6000 Frankfurt, De | Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away |
| US6298013B1 (en) | 1993-11-15 | 2001-10-02 | Siemens Aktiengesellschaft | Device for monitoring the travel time of mail shipments |
| DE10248112B4 (de) * | 2002-09-09 | 2007-01-04 | Ruwel Ag | Verfahren zur Herstellung von gedruckten elektrischen Schaltungen |
| DE10243637B4 (de) | 2002-09-19 | 2007-04-26 | Ruwel Ag | Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich sowie Verfahren zur Herstellung von starr-flexiblen Leiterplatten |
| DE20221189U1 (de) * | 2002-09-19 | 2005-05-19 | Ruwel Ag | Leiterplatte mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich |
| DE10258090B4 (de) * | 2002-09-19 | 2009-01-29 | Ruwel Ag | Verfahren zur Herstellung von starr-flexiblen Leiterplatten und Leiterplatten mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich |
| CN113286437B (zh) * | 2021-06-11 | 2021-10-01 | 四川英创力电子科技股份有限公司 | 一种加工软硬结合板的辅助装置及其使用方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3459626A (en) * | 1964-11-06 | 1969-08-05 | Morgan Adhesives Co | Label carrier and release laminate |
| AT256275B (de) * | 1965-06-01 | 1967-08-10 | Philips Nv | Leiterplatte, welche entlang einer durch eine Perforation, Einkerbungen od. dgl. festgelegten Bruchlinie bzw. Bruchlinien in mindestens zwei Leiterplattenteile teilbar ist |
| FR1481461A (fr) * | 1965-06-01 | 1967-05-19 | Philips Nv | Plaque à câblage imprimé |
-
1976
- 1976-12-17 DE DE19762657212 patent/DE2657212C3/de not_active Expired
-
1977
- 1977-11-28 GB GB4940477A patent/GB1561620A/en not_active Expired
- 1977-12-05 NL NL7713431A patent/NL180294C/xx not_active IP Right Cessation
- 1977-12-08 DK DK546677A patent/DK142475C/da active
- 1977-12-15 IE IE254977A patent/IE46109B1/en not_active IP Right Cessation
- 1977-12-15 SE SE7714310A patent/SE424132B/sv unknown
- 1977-12-16 IT IT6982677A patent/IT1091374B/it active
- 1977-12-16 CH CH1554277A patent/CH630202A5/de not_active IP Right Cessation
- 1977-12-16 BE BE6046268A patent/BE861966A/xx not_active IP Right Cessation
- 1977-12-19 FR FR7738326A patent/FR2374818A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| IE46109L (en) | 1978-06-17 |
| NL180294C (nl) | 1987-02-02 |
| DE2657212B2 (de) | 1979-08-09 |
| DK546677A (da) | 1978-06-18 |
| SE7714310L (sv) | 1978-06-18 |
| SE424132B (sv) | 1982-06-28 |
| NL180294B (nl) | 1986-09-01 |
| FR2374818A1 (fr) | 1978-07-13 |
| DE2657212A1 (de) | 1978-06-22 |
| NL7713431A (nl) | 1978-06-20 |
| DK142475B (da) | 1980-11-03 |
| FR2374818B1 (Direct) | 1982-05-21 |
| DK142475C (da) | 1981-03-30 |
| IT1091374B (it) | 1985-07-06 |
| CH630202A5 (en) | 1982-05-28 |
| GB1561620A (en) | 1980-02-27 |
| DE2657212C3 (de) | 1982-09-02 |
| BE861966A (fr) | 1978-06-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Patent lapsed |