IE32507B1 - Improvements in and relating to contact bonding and lead attachment to an electrical device - Google Patents

Improvements in and relating to contact bonding and lead attachment to an electrical device

Info

Publication number
IE32507B1
IE32507B1 IE1435/68A IE143568A IE32507B1 IE 32507 B1 IE32507 B1 IE 32507B1 IE 1435/68 A IE1435/68 A IE 1435/68A IE 143568 A IE143568 A IE 143568A IE 32507 B1 IE32507 B1 IE 32507B1
Authority
IE
Ireland
Prior art keywords
leads
bonding
wafer
frame
needle
Prior art date
Application number
IE1435/68A
Other languages
English (en)
Other versions
IE32507L (en
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of IE32507L publication Critical patent/IE32507L/xx
Publication of IE32507B1 publication Critical patent/IE32507B1/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07632—Compression bonding, e.g. thermocompression bonding
    • H10W72/07633—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/655—Materials of strap connectors of outermost layers of multilayered strap connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
IE1435/68A 1967-12-15 1968-11-25 Improvements in and relating to contact bonding and lead attachment to an electrical device IE32507B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69104067A 1967-12-15 1967-12-15

Publications (2)

Publication Number Publication Date
IE32507L IE32507L (en) 1969-06-15
IE32507B1 true IE32507B1 (en) 1973-08-22

Family

ID=24774930

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1435/68A IE32507B1 (en) 1967-12-15 1968-11-25 Improvements in and relating to contact bonding and lead attachment to an electrical device

Country Status (7)

Country Link
BE (1) BE725468A (https=)
CA (1) CA922021A (https=)
DE (1) DE1813165A1 (https=)
FR (1) FR1597770A (https=)
GB (1) GB1199848A (https=)
IE (1) IE32507B1 (https=)
NL (1) NL6817049A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE758871A (fr) * 1969-11-13 1971-05-12 Philips Nv Procede pour relier des emplacements de contact metalliques de composants electriques avec des conducteurs metalliques d'un substratflasque
US7515693B2 (en) 2004-08-06 2009-04-07 Powerphone, Inc. Call handler systems and methods
CN216483147U (zh) * 2018-12-21 2022-05-10 大陆-特韦斯贸易合伙股份公司及两合公司 传感器

Also Published As

Publication number Publication date
DE1813165A1 (de) 1969-07-03
BE725468A (https=) 1969-06-13
GB1199848A (en) 1970-07-22
CA922021A (en) 1973-02-27
IE32507L (en) 1969-06-15
FR1597770A (https=) 1970-06-29
NL6817049A (https=) 1969-06-17

Similar Documents

Publication Publication Date Title
US4028722A (en) Contact bonded packaged integrated circuit
US5953624A (en) Bump forming method
US4003073A (en) Integrated circuit device employing metal frame means with preformed conductor means
US3330026A (en) Semiconductor terminals and method
KR0129119B1 (ko) 반도체칩의 제거방법 및 제거장치
GB1308269A (en) Lead frames for integrated circuit devices
US3698073A (en) Contact bonding and packaging of integrated circuits
IE32507B1 (en) Improvements in and relating to contact bonding and lead attachment to an electrical device
US3698075A (en) Ultrasonic metallic sheet-frame bonding
JPS6039841A (ja) 予め取り付けた導電性マウント媒体を有する集積回路及びその製造方法
US3961413A (en) Method and apparatus for the assembly of semiconductor devices
JPH0312942A (ja) 半導体装置の封止方法および半導体チップ
US5649981A (en) Tool and fixture for the removal of tab leads bonded to semiconductor die pads
JPH0547833A (ja) Ｔａｂチツプの搭載用基板
US20140239473A1 (en) Wire bonding assembly and method
IE32531B1 (en) Improvements in and relating to contact bonding and lead attachment of an electrical device
JPS62154648A (ja) バンプ形成方法
JP2695370B2 (ja) ボンディングワイヤーの除去方法
JPH06196531A (ja) 半導体装置およびその製造方法
JP2521693B2 (ja) 半導体装置及び半導体装置の製造方法
JPH05283473A (ja) フィルムキャリア半導体装置とその製造方法
JPH05305362A (ja) リードフレームの加工装置
JPS6253931B2 (https=)
JPH0444389A (ja) パッケージ型ｉｃの接続方法
JP2555916B2 (ja) フィルムキャリヤ半導体装置