FR1597770A - - Google Patents

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Publication number
FR1597770A
FR1597770A FR1597770DA FR1597770A FR 1597770 A FR1597770 A FR 1597770A FR 1597770D A FR1597770D A FR 1597770DA FR 1597770 A FR1597770 A FR 1597770A
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France
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
FR1597770D 1967-12-15 1968-12-10 Expired FR1597770A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69104067A 1967-12-15 1967-12-15

Publications (1)

Publication Number Publication Date
FR1597770A true FR1597770A (fr) 1970-06-29

Family

ID=24774930

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1597770D Expired FR1597770A (fr) 1967-12-15 1968-12-10

Country Status (7)

Country Link
BE (1) BE725468A (fr)
CA (1) CA922021A (fr)
DE (1) DE1813165A1 (fr)
FR (1) FR1597770A (fr)
GB (1) GB1199848A (fr)
IE (1) IE32507B1 (fr)
NL (1) NL6817049A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE758871A (fr) * 1969-11-13 1971-05-12 Philips Nv Procede pour relier des emplacements de contact metalliques de composants electriques avec des conducteurs metalliques d'un substratflasque
US7515693B2 (en) 2004-08-06 2009-04-07 Powerphone, Inc. Call handler systems and methods

Also Published As

Publication number Publication date
BE725468A (fr) 1969-06-13
IE32507L (en) 1969-06-15
DE1813165A1 (de) 1969-07-03
NL6817049A (fr) 1969-06-17
GB1199848A (en) 1970-07-22
CA922021A (en) 1973-02-27
IE32507B1 (en) 1973-08-22

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