CA922021A - Contact bonding and packaging of integrated circuits - Google Patents

Contact bonding and packaging of integrated circuits

Info

Publication number
CA922021A
CA922021A CA035878A CA35878A CA922021A CA 922021 A CA922021 A CA 922021A CA 035878 A CA035878 A CA 035878A CA 35878 A CA35878 A CA 35878A CA 922021 A CA922021 A CA 922021A
Authority
CA
Canada
Prior art keywords
packaging
integrated circuits
contact bonding
bonding
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA035878A
Inventor
J. Geyer Harry
W. Helda Robert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of CA922021A publication Critical patent/CA922021A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
CA035878A 1967-12-15 1968-11-22 Contact bonding and packaging of integrated circuits Expired CA922021A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69104067A 1967-12-15 1967-12-15

Publications (1)

Publication Number Publication Date
CA922021A true CA922021A (en) 1973-02-27

Family

ID=24774930

Family Applications (1)

Application Number Title Priority Date Filing Date
CA035878A Expired CA922021A (en) 1967-12-15 1968-11-22 Contact bonding and packaging of integrated circuits

Country Status (7)

Country Link
BE (1) BE725468A (en)
CA (1) CA922021A (en)
DE (1) DE1813165A1 (en)
FR (1) FR1597770A (en)
GB (1) GB1199848A (en)
IE (1) IE32507B1 (en)
NL (1) NL6817049A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE758871A (en) * 1969-11-13 1971-05-12 Philips Nv METHOD FOR CONNECTING METAL CONTACT LOCATIONS OF ELECTRICAL COMPONENTS WITH METAL CONDUCTORS OF A FLASK SUBSTRATE
US7515693B2 (en) 2004-08-06 2009-04-07 Powerphone, Inc. Call handler systems and methods

Also Published As

Publication number Publication date
BE725468A (en) 1969-06-13
FR1597770A (en) 1970-06-29
IE32507L (en) 1969-06-15
DE1813165A1 (en) 1969-07-03
NL6817049A (en) 1969-06-17
GB1199848A (en) 1970-07-22
IE32507B1 (en) 1973-08-22

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