IE32507B1 - Improvements in and relating to contact bonding and lead attachment to an electrical device - Google Patents

Improvements in and relating to contact bonding and lead attachment to an electrical device

Info

Publication number
IE32507B1
IE32507B1 IE1435/68A IE143568A IE32507B1 IE 32507 B1 IE32507 B1 IE 32507B1 IE 1435/68 A IE1435/68 A IE 1435/68A IE 143568 A IE143568 A IE 143568A IE 32507 B1 IE32507 B1 IE 32507B1
Authority
IE
Ireland
Prior art keywords
leads
bonding
wafer
frame
needle
Prior art date
Application number
IE1435/68A
Other versions
IE32507L (en
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of IE32507L publication Critical patent/IE32507L/en
Publication of IE32507B1 publication Critical patent/IE32507B1/en

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Classifications

    • H—ELECTRICITY
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

1,199,848. Integrated circuits. MOTOROLA ..Inc. 22 Nov., 1968 [15 Dec., 1967], No. 55557/68. Heading H1K [Also in Division B3] Leads are attached to raised coplanar aluminium bonding pads 12 on an integrated circuit wafer 11 by aligning the free ends of leads 24 (Fig. 6) extending inwardly from a frame member 21 with the pads and bonding them thereto in a single step. This is effected without heating by sandwiching the lead ends between the block and an anvil 32 no larger than the block itself and applying pressure and transverse high frequency vibrations (60 kc./s.) to the assembly via bonding needle 33. The free ends 54 of leads extending inwards from a larger frame member 51 of heavier gauge material such as nickel, copper, steel or KOVAR (RTM) are then aligned with portions of the first leads and bonded to them. Parts of the first leads extending beyond the bonds are removed before or (as shown) after this last operation. A number of frames 21 are preferably stamped or etched from a continuous strip of aluminium or copper 2 mils thick so that they can be wound on spools and run through the bonding apparatus in a continuous process. The anvil 32, bonding needle 33 and the backside of the wafer are roughened to facilitate communication of vibrations from the needle to the bonding areas. Lateral spread of the end of each tapered lead 24 during bonding causes it to kink adjacent the bond into the recess 35 provided for the purpose so that the leads stand proud of the edge of the wafer. Although leads 24 may be soldered, brazed, or bonded by a thermocompression or ultrasonic technique to those of frame 51 it is preferred to form resistance welds using a cylindrical welding element (Fig. 8, not shown). If desired, before this operation, the wafer and leads are stuck to a supporting disc of ceramic (shown in phantom) with epoxy resin or between two such discs. Finally leads 24 are severed from the first frame with the aid of a cylindrical knife edge or by simply ripping away the frame. The resulting elements may be potted in resin or mounted in ceramic flatpacks before removal from the second frames. [GB1199848A]
IE1435/68A 1967-12-15 1968-11-25 Improvements in and relating to contact bonding and lead attachment to an electrical device IE32507B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69104067A 1967-12-15 1967-12-15

Publications (2)

Publication Number Publication Date
IE32507L IE32507L (en) 1969-06-15
IE32507B1 true IE32507B1 (en) 1973-08-22

Family

ID=24774930

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1435/68A IE32507B1 (en) 1967-12-15 1968-11-25 Improvements in and relating to contact bonding and lead attachment to an electrical device

Country Status (7)

Country Link
BE (1) BE725468A (en)
CA (1) CA922021A (en)
DE (1) DE1813165A1 (en)
FR (1) FR1597770A (en)
GB (1) GB1199848A (en)
IE (1) IE32507B1 (en)
NL (1) NL6817049A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE758871A (en) * 1969-11-13 1971-05-12 Philips Nv METHOD FOR CONNECTING METAL CONTACT LOCATIONS OF ELECTRICAL COMPONENTS WITH METAL CONDUCTORS OF A FLASK SUBSTRATE
US7515693B2 (en) 2004-08-06 2009-04-07 Powerphone, Inc. Call handler systems and methods

Also Published As

Publication number Publication date
BE725468A (en) 1969-06-13
FR1597770A (en) 1970-06-29
IE32507L (en) 1969-06-15
DE1813165A1 (en) 1969-07-03
NL6817049A (en) 1969-06-17
GB1199848A (en) 1970-07-22
CA922021A (en) 1973-02-27

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