ID22962A - Material komponen elektronik mengandung zat pengusir hama, komponen elektronik yang menggunakan material yang sama dan metoda pembuatannya - Google Patents

Material komponen elektronik mengandung zat pengusir hama, komponen elektronik yang menggunakan material yang sama dan metoda pembuatannya

Info

Publication number
ID22962A
ID22962A IDP980133D ID980133D ID22962A ID 22962 A ID22962 A ID 22962A ID P980133 D IDP980133 D ID P980133D ID 980133 D ID980133 D ID 980133D ID 22962 A ID22962 A ID 22962A
Authority
ID
Indonesia
Prior art keywords
electronic components
making
same material
containing pump
pump properties
Prior art date
Application number
IDP980133D
Other languages
English (en)
Indonesian (id)
Inventor
Hirohiko Haniu
Toshikazu Tomioka
Katsumi Tomita
Susumu Kobayashi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of ID22962A publication Critical patent/ID22962A/id

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01N—PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
    • A01N25/00—Biocides, pest repellants or attractants, or plant growth regulators, characterised by their forms, or by their non-active ingredients or by their methods of application, e.g. seed treatment or sequential application; Substances for reducing the noxious effect of the active ingredients to organisms other than pests
    • A01N25/34—Shaped forms, e.g. sheets, not provided for in any other sub-group of this main group
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01N—PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
    • A01N53/00—Biocides, pest repellants or attractants, or plant growth regulators containing cyclopropane carboxylic acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Environmental Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Dentistry (AREA)
  • Zoology (AREA)
  • Plant Pathology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Agronomy & Crop Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Pest Control & Pesticides (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Catching Or Destruction (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
IDP980133D 1997-01-31 1998-01-28 Material komponen elektronik mengandung zat pengusir hama, komponen elektronik yang menggunakan material yang sama dan metoda pembuatannya ID22962A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP01811797A JP3489369B2 (ja) 1997-01-31 1997-01-31 ゴキブリ忌避剤含有電子部品材料を用いた電子部品

Publications (1)

Publication Number Publication Date
ID22962A true ID22962A (id) 1999-12-23

Family

ID=11962674

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP980133D ID22962A (id) 1997-01-31 1998-01-28 Material komponen elektronik mengandung zat pengusir hama, komponen elektronik yang menggunakan material yang sama dan metoda pembuatannya

Country Status (7)

Country Link
US (3) US6387387B1 (de)
EP (1) EP0856556B1 (de)
JP (1) JP3489369B2 (de)
CN (1) CN1299573C (de)
DE (1) DE69840681D1 (de)
ID (1) ID22962A (de)
MY (2) MY127384A (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6403894B1 (en) 1998-05-26 2002-06-11 Matsushita Electric Industrial Co., Ltd. Printed wiring board with insect repellant
JP3595163B2 (ja) 1998-05-26 2004-12-02 松下電器産業株式会社 電子機器
JP2001048706A (ja) * 1999-06-02 2001-02-20 Earth Chem Corp Ltd 害虫防除製剤
JP2002359457A (ja) 2001-06-01 2002-12-13 Matsushita Electric Ind Co Ltd 電子部品用材料及びそれを用いた電子部品
WO2004047507A2 (en) * 2002-11-18 2004-06-03 Honeywell International Inc Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof
WO2005014696A1 (ja) * 2003-08-06 2005-02-17 Mitsubishi Gas Chemical Company, Inc. 光硬化性組成物及びコーティング剤組成物
US8088293B2 (en) * 2004-07-29 2012-01-03 Micron Technology, Inc. Methods of forming reticles configured for imprint lithography
JP4755837B2 (ja) * 2005-02-24 2011-08-24 Ｊｆｅ鋼板株式会社 防虫鋼板、およびその製造方法
JP5151475B2 (ja) * 2005-03-23 2013-02-27 日本ゼオン株式会社 非水電解質二次電池電極用バインダー、電極、ならびに非水電解質二次電池
US7240828B2 (en) * 2005-06-07 2007-07-10 Verifone Israel Ltd. Insect repelling point of sale terminal
JP4836178B2 (ja) * 2005-12-02 2011-12-14 高砂鐵工株式会社 ゴキブリ忌避性を有する金属材料およびそれを用いた構造物
KR20070080928A (ko) * 2006-02-09 2007-08-14 삼성전자주식회사 밀봉재 및 이를 포함하는 액정 표시 장치
TW201942144A (zh) * 2018-03-30 2019-11-01 日商太陽油墨製造股份有限公司 噴墨印刷用硬化性組成物、其之硬化物、及具有該硬化物之電子零件
CN110540697A (zh) * 2018-05-28 2019-12-06 佛山市顺德区美的电热电器制造有限公司 一种家电产品部件及其制备方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2788320A (en) * 1952-07-16 1957-04-09 Nat Res Dev Pesticidal coating compositions
FR1238083A (fr) 1958-10-20 1960-08-05 Minnesota Mining & Mfg Feuille copiante pour thermographie
US3864468A (en) * 1971-02-02 1975-02-04 Herculite Protective Fab Activated polymer materials and process for making same
US3954977A (en) 1972-07-24 1976-05-04 American Home Products Corporation Insecticidal pyrethroid compositions having increased efficacy
DE2406400B2 (de) 1973-02-14 1977-04-28 Hitachi Chemical Co., Ltd., Tokio Lichtempfindliche harzzusammensetzungen auf der basis von verbindungen mit epoxy- bzw. photopolymerisierbaren acrylgruppen
DE3382078D1 (de) * 1982-12-06 1991-02-07 Ici Plc Aromatische oligomere und harze.
JPS59227802A (ja) * 1983-06-08 1984-12-21 Kanebo Ltd 殺虫性樹脂組成物
US4511757A (en) * 1983-07-13 1985-04-16 At&T Technologies, Inc. Circuit board fabrication leading to increased capacity
US5023247A (en) * 1983-09-29 1991-06-11 Insecta Paint, Inc. Insecticidal coating composition and processes for making and using it
US4670246A (en) 1984-11-05 1987-06-02 Pennwalt Corporation Microencapsulated pyrethroids
JPH0294A (ja) * 1985-01-31 1990-01-05 Ricoh Co Ltd 文字等の表示装置
JPH0699244B2 (ja) * 1985-04-10 1994-12-07 日本ペイント株式会社 抗有害生物性を有する微小樹脂粒子
EP0207188B1 (de) * 1985-06-29 1996-06-19 Dainippon Ink And Chemicals, Inc. Kunststoffzusammensetzung für Lötschutztinte
JPH072888B2 (ja) * 1986-05-27 1995-01-18 旭硝子株式会社 エポキシ樹脂組成物
JPH0618985B2 (ja) * 1987-06-03 1994-03-16 信越化学工業株式会社 エポキシ樹脂組成物
JPH0220094A (ja) * 1988-07-08 1990-01-23 Elna Co Ltd プリント基板および同基板用レジストインク
US5229252A (en) 1989-06-09 1993-07-20 Morton International, Inc. Photoimageable compositions
JPH07118112A (ja) * 1992-08-19 1995-05-09 Daiwa Kagaku Kogyo Kk ゴキブリの忌避方法
JP2783093B2 (ja) * 1992-10-21 1998-08-06 日本電気株式会社 プリント配線板
JPH07112902A (ja) * 1993-10-15 1995-05-02 Daiwa Kagaku Kogyo Kk ゴキブリ忌避剤組成物
JP3393951B2 (ja) 1995-04-06 2003-04-07 松下電器産業株式会社 不快・衛生害虫忌避機器
JP3393952B2 (ja) 1995-04-06 2003-04-07 松下電器産業株式会社 不快・衛生害虫忌避機器
JPH097757A (ja) * 1995-06-23 1997-01-10 Matsushita Electric Ind Co Ltd 電子レンジ

Also Published As

Publication number Publication date
DE69840681D1 (de) 2009-05-07
MY127384A (en) 2006-11-30
EP0856556A2 (de) 1998-08-05
JP3489369B2 (ja) 2004-01-19
US20020179241A1 (en) 2002-12-05
EP0856556A3 (de) 1998-09-09
MY123915A (en) 2006-06-30
US20010055605A1 (en) 2001-12-27
CN1299573C (zh) 2007-02-14
JPH10212207A (ja) 1998-08-11
CN1201986A (zh) 1998-12-16
US6387387B1 (en) 2002-05-14
EP0856556B1 (de) 2009-03-25
US6475328B2 (en) 2002-11-05

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